A cleaning process before preparing black silicon by solar polycrystalline RIE
A technology of solar energy and black silicon, applied in the direction of sustainable manufacturing/processing, final product manufacturing, semiconductor/solid-state device manufacturing, etc., can solve the problems of low production capacity, low market share, poor appearance uniformity of cells, etc., and achieve improved conversion efficiency, reduced recombination in vivo, and reduced surface contamination
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Embodiment 1
[0025] A cleaning process before preparing black silicon by solar polycrystalline RIE comprises the following steps:
[0026] a) Pre-cleaning: Clean the silicon wafer with cleaning solution to remove organic impurities and particulate impurities. The cleaning temperature is 50°C and the cleaning time is 2 minutes. After completion, rinse with water; the cleaning solution consists of sodium hydroxide solution, hydrogen peroxide and water. It is composed of 1:1:4 by volume; the sodium hydroxide solution is a sodium hydroxide solution with a mass concentration of 35%;
[0027] b) Cleaning: immerse the silicon wafer treated in step a) in a high-concentration alkaline solution for 3 minutes to remove the damaged layer at a temperature of 50° C., and rinse with water after completion; the high-concentration alkaline solution is 15% of the mass concentration Sodium hydroxide solution; the single-layer thickness of the removed damaged layer is controlled to be 18-22 microns;
[0028]...
Embodiment 2
[0031] A cleaning process before preparing black silicon by solar polycrystalline RIE comprises the following steps:
[0032] a) Pre-cleaning: Use a cleaning solution to clean and remove organic impurities and particulate impurities. The cleaning temperature is 60°C and the cleaning time is 5 minutes. After completion, rinse with water; the cleaning solution consists of sodium hydroxide solution, hydrogen peroxide and water. It is composed of 1:2.5:7 by volume; the sodium hydroxide solution is a sodium hydroxide solution with a mass concentration of 45%;
[0033] b) Cleaning: immerse the silicon wafer treated in step a) in a high-concentration alkaline solution for 5 minutes to remove the damaged layer at a temperature of 60° C., and rinse with water after completion; the high-concentration alkaline solution is 25% of the mass concentration Sodium hydroxide solution; the single-layer thickness of the removed damaged layer is controlled to be 18-22 microns;
[0034] c) Removal...
Embodiment 3
[0037] A cleaning process before preparing black silicon by solar polycrystalline RIE comprises the following steps:
[0038] a) Pre-cleaning: Clean the silicon wafer with cleaning solution to remove organic impurities and particulate impurities. The cleaning temperature is 50°C and the cleaning time is 2 minutes. After completion, rinse with water; the cleaning solution consists of sodium hydroxide solution, hydrogen peroxide and water. It is composed of 1:1:6 by volume; the sodium hydroxide solution is a sodium hydroxide solution with a mass concentration of 40%;
[0039] b) Cleaning: immerse the silicon wafer treated in step a) in a high-concentration alkaline solution for 3 minutes to remove the damaged layer. The temperature is 60° C., and rinse with water after completion; Sodium hydroxide solution; the thickness of the single layer of the removed damaged layer is controlled to be 22 microns;
[0040] c) Removal of oxide layer: immerse the silicon wafer treated in step ...
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