Method of transmitted Algan ultraviolet optical cathode preparation method based on the substrate
A transmission type, ultraviolet light technology, applied in the direction of light-emitting cathode manufacturing, photoemission cathode, discharge tube main electrode, etc., can solve the problems of low deep ultraviolet light transmittance, high density of AlGaN emission layer, etc., and achieve simple epitaxy process, reduce Difficulty in growth, to ensure the effect of efficient detection
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[0022] A method for preparing a transmissive AlGaN ultraviolet photocathode based on substrate lift-off, comprising the following steps:
[0023] 1) Prepare materials: take a substrate for growing nitride;
[0024] 2) Growth of GaN peeling layer: transfer the substrate into the MOCVD system, and sequentially bake the substrate at high temperature, grow the nucleation layer, and grow the high-quality GaN peeling layer;
[0025] 3) Growth of p-AlGaN emission layer: On the high-quality GaN buffer layer, grow a p-type Mg-doped high-aluminum component AlGaN photo-emission layer;
[0026] 4) Front-side bonding of the quartz window: transfer the epitaxial material in step 3 out of the MOCVD system, clean the surface, and bond the quartz window material on the AlGaN surface;
[0027] 5) Substrate peeling: transfer the material in step 4 into the laser lift-off equipment, use laser decomposition technology to completely decompose the GaN layer, and peel off the substrate;
[0028] 6)...
Embodiment 1
[0043] Take a double-sided polished sapphire substrate 10, transfer the substrate into the MOCVD system, bake the substrate in a hydrogen atmosphere at a high temperature of 1100°C for 5 minutes, cool down to 600°C to grow a 20nm GaN nucleation layer; further raise the temperature to 1050°C for high The high-quality GaN buffer layer 20 is grown, and the growth thickness is 2 μm;
[0044] Secondly, on the high-quality GaN buffer layer, increase the growth temperature to 1080° C., and grow a p-type Mg-doped high-aluminum composition AlGaN photoemissive layer 30 with a thickness of 100 nm, an Al composition of 0.4, and a Mg doping concentration of 1×10 19 cm -3 ;
[0045] Then, cool down to room temperature, transfer the epitaxial material out of the MOCVD system, use acetone, ethanol, and deionized water to ultrasonically clean the surface dirt, and bond a quartz window material 40 on the AlGaN emitter layer, the thickness of the quartz window material is 2mm;
[0046] Then, t...
Embodiment 2
[0049] First, take a silicon substrate 10, transfer the substrate into an MOCVD system, bake the substrate in a hydrogen atmosphere at a high temperature of 1100°C for 5 minutes, cool down to 600°C to grow a 20nm AlN nucleation layer; further raise the temperature to 1050°C for high-quality GaN buffer layer 20 is grown with a growth thickness of 5 μm;
[0050] Secondly, on the high-quality GaN buffer layer, increase the growth temperature to 1080° C., and grow a p-type Mg-doped high-aluminum composition AlGaN photoemissive layer 30 with a thickness of 70 nm, an Al composition of 0.5, and a Mg doping concentration of 5×10 19 cm -3 ;
[0051] Then, cool down to room temperature, transfer the epitaxial material out of the MOCVD system, use acetone, ethanol, and deionized water to ultrasonically clean the surface dirt, and bond a quartz window material 40 on the AlGaN emitter layer, the thickness of the quartz window material is 4mm;
[0052] Then, the material is transferred in...
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