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High-oxidation-resistance and high-binding-force silver-coated copper powder to which tin interlayer is added and preparation method thereof

A technology of silver-coated copper powder and intermediate layer, which is used in metal processing equipment, coating, transportation and packaging, etc., can solve the problems of low oxidation resistance, insufficient bonding force, increase cost, etc., and achieve reduced porosity and denser The effect of enhancing sexuality and enhancing bonding

Active Publication Date: 2019-01-25
KUNMING UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the silver-coated copper powders are prepared by chemical replacement and electroless plating methods, but when the silver-coated copper powders are used in high temperature environment, the oxidation resistance is low, the coating is loose, and the bonding force is not high enough. Increasing the content of silver to improve performance will significantly increase the cost. Tin is a silver-white metal, non-toxic, has good welding and ductility, etc., and is widely used in electronics, food, automobiles and other industries

Method used

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  • High-oxidation-resistance and high-binding-force silver-coated copper powder to which tin interlayer is added and preparation method thereof
  • High-oxidation-resistance and high-binding-force silver-coated copper powder to which tin interlayer is added and preparation method thereof
  • High-oxidation-resistance and high-binding-force silver-coated copper powder to which tin interlayer is added and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0030] Such as figure 1 As shown, the preparation method of the silver-coated copper powder with high oxidation resistance and high binding force with the addition of tin intermediate layer of this embodiment includes the following steps:

[0031] Step (1), preparation of copper powder suspension

[0032] Dissolve 12g of copper powder in 500ml of deionized water, ultrasonically wash with 2g / L sodium hydroxide solution for 5 minutes, filter and wash to obtain a copper powder suspension.

[0033] Step (2), prepare tin plating solution:

[0034] Dissolve 11.4g of stannous chloride with 20ml of hydrochloric acid, pour 61g / L of thiourea, 50g / L of sodium hypophosphite, and 14g / L of sodium citrate solution into it in sequence to obtain a tin plating solution.

[0035] Step (3), preparation of tinned copper powder

[0036] The tin plating solution of step (2) was dropped into the copper powder suspension of step (1) at a speed of 25ml / min under ultrasonic stirring, and reacted at room temperatur...

Embodiment 2

[0045] The preparation method of the silver-coated copper powder with high oxidation resistance and high binding force with the addition of tin intermediate layer of this embodiment includes the following steps:

[0046] Step (1), preparation of copper powder suspension

[0047] Dissolve 12g of copper powder in 500ml of deionized water, ultrasonically wash with 2g / L sodium hydroxide solution for 5 minutes, filter and wash to obtain a copper powder suspension.

[0048] Step (2), prepare tin plating solution:

[0049] Dissolve 5.04 g of stannous chloride with 10 ml of hydrochloric acid, and pour 28 g / L of thiourea, 22 g / L of sodium hypophosphite and 6 g / L of sodium citrate solution into it in sequence to obtain a tin plating solution.

[0050] Step (3), preparation of tinned copper powder

[0051] The tin plating solution of step (2) was dropped into the copper powder suspension of step (1) at a speed of 30 ml / min under ultrasonic stirring, and reacted at room temperature for 30 minutes. A...

Embodiment 3

[0058] The preparation method of the silver-coated copper powder with high oxidation resistance and high binding force with the addition of tin intermediate layer of this embodiment includes the following steps:

[0059] Step (1), preparation of copper powder suspension

[0060] Dissolve 12g of copper powder in 500ml of deionized water, ultrasonically wash with 2g / L sodium hydroxide solution for 5 minutes, filter and wash to obtain a copper powder suspension.

[0061] Step (2), prepare tin plating solution:

[0062] Dissolve 11.4g of stannous chloride with 20ml of hydrochloric acid, and pour 50g / L of thiourea, 30 / L of sodium hypophosphite and 8g / L of sodium citrate solution into it in sequence to obtain a tin plating solution.

[0063] Step (3), preparation of tinned copper powder

[0064] The tin plating solution of step (2) was dropped into the copper powder suspension of step (1) at a speed of 25ml / min under ultrasonic stirring, and reacted at room temperature for 30 minutes. After st...

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Abstract

The invention relates to high-oxidation-resistance and high-binding-force silver-coated copper powder to which a tin interlayer is added and a preparation method thereof, and belongs to the field of metal powder materials. The preparation method includes the following steps of preparation of copper powder turbid liquid, preparation of tinning liquid, preparation of tinned copper powder, coating asilver layer with the tinned copper powder, and preparation of the silver-coated copper powder with the tin interlayer. The silver-coated copper powder prepared with the method is excellent in oxidation resistance, coatings are tightly bound, and the silver-coated copper powder is an excellent substitute of common silver-coated copper powder.

Description

Technical field [0001] The invention relates to a preparation method of silver-coated copper powder, in particular to a preparation method of silver-coated copper powder with high oxidation resistance and high binding force added with a tin intermediate layer, and also relates to the silver-coated copper powder obtained by the preparation method, which belongs to metal Powder field. Background technique [0002] As an important pillar industry supporting the country’s economic transformation and industrial upgrading, new materials have broad development prospects. Silver-clad copper powder, as a new type of multi-functional powder material with a core-shell structure, takes into account the excellent characteristics of both silver and copper. , Not only overcomes the defect of silver migration in silver conductive adhesive, but also maintains the good conductivity, thermal stability and oxidation resistance of silver powder. As an alternative material for conductive fillers, ind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02C23C18/31B22F9/24B22F3/10
CPCC23C18/31B22F3/1007B22F9/24B22F1/17
Inventor 朱晓云徐琦吴有龙
Owner KUNMING UNIV OF SCI & TECH
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