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NTC chip electrode paste and method for preparing NTC chip using same

A chip electrode and paste technology, used in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problem of difficult to meet the requirements of response speed, good consistency, and increasing reliability, electrode-chip interface gaps and voids There are many problems such as large difference in thermal expansion coefficient, etc., to achieve the effect of good strength and toughness, small difference in thermal expansion coefficient, and good resistance to cold and thermal shock.

Active Publication Date: 2019-02-22
SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the common conductive paste in the market is attached to the chip through an organic binder or glass glaze, which has defects such as poor bonding strength, large difference in thermal expansion coefficient, many gaps in the electrode-chip interface, and prone to corrosion and aging.
It is difficult to meet the increasingly higher requirements for temperature sensors in battery packs, motors, electronic controls, and thermal management systems of new energy vehicles in terms of accuracy, response speed, good consistency, and reliability

Method used

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  • NTC chip electrode paste and method for preparing NTC chip using same
  • NTC chip electrode paste and method for preparing NTC chip using same
  • NTC chip electrode paste and method for preparing NTC chip using same

Examples

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Effect test

Embodiment 1

[0055] Silver-coated palladium powder is 73%, the silver-coated palladium powder is spherical, the powder particle size is 3-6um, and the thickness of silver-coated palladium is 15-20nm;

[0056] 6% metal oxide powder, the metal oxide powder is a combination of iron oxide and manganese dioxide metal oxide powder, the weight ratio of iron oxide and manganese dioxide metal oxide powder is 2:1, and the particle size of the powder is 120-500nm;

[0057] Solvent 9%, the solvent is butyl carbitol and DBE, and the weight ratio of the two solvents is 1:1;

[0058] 10.5% organic binder, the organic binder is American Eastman butyl cellulose CAB551-0.01 and Japanese Kuraray company Mowital B 60H, the weight ratio of butyl cellulose CAB551-0.01 and Mowital B 60H is 4:1;

[0059] Dispersant 0.3%, DISPERBYK-190 from BYK Company.

[0060] Defoamer 0.7%, BYK-055 of BYK Company.

[0061] Leveling agent 0.5%, BYK company is: BYK-333.

[0062] Add it into the container tank according to the ...

Embodiment 2

[0065] Silver-coated palladium powder 68%, the silver-coated palladium powder tail is nearly spherical, the powder particle size is 3-8um, and the thickness of silver-coated palladium is 8-16nm;

[0066] 5% metal oxide powder, the metal oxide powder is iron oxide and manganese dioxide metal oxide powder, the weight ratio of iron oxide and manganese dioxide metal oxide powder is 2:1, and the particle size of the powder is 120-500nm;

[0067] Solvent 12%, the solvent is butyl carbitol and DBE, and the weight ratio of the two solvents is 1:1;

[0068] Organic binder 13.5%, organic binder is American Eastman butyl cellulose CAB551-0.01 and Japanese Kuraray company Mowital B 60H, the weight ratio of butyl cellulose CAB551-0.01 and Mowital B 60H is 4:1;

[0069] Dispersant 0.3%, dispersant is DISPERBYK-190 of BYK company;

[0070] Defoamer 0.7%, defoamer is BYK-055 of BYK company;

[0071] The leveling agent is 0.5%, and the leveling agent is BYK-333 of BYK Company.

[0072] Add ...

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Abstract

The present application discloses an NTC chip electrode paste and a method for preparing an NTC chip using the same. The NTC chip electrode paste of the present application comprises silver-coated palladium powder used as a conductive agent instead of silver powder. The silver-coated palladium powder of the present application is a silver-added binary alloy with palladium as a matrix, and palladium and silver can be infinitely mutually soluble to form a continuous solid solution with a stable resistance value and good oxidation resistance at room temperature. The oxidation resistance of the solid solution increases with a palladium content increase at a high temperature. The solid solution does not change in color in a sulfur-containing atmosphere, and is not liable to corrosion aging. TheNTC chip prepared by using the electrode paste of the present application has stable resistance, high reliability, good resistance to mechanical vibration and cold and heat shock resistance, can meetthe requirements for high precision, fast response, good consistency and high reliability of a temperature sensors in battery packs, motors, electric control and thermal management systems of new energy vehicles.

Description

technical field [0001] The invention relates to the technical field of electrode paste, in particular to an NTC chip electrode paste and a preparation method for an NTC chip using the paste. Background technique [0002] With the further development of high integration of electronic products and miniaturization of independent components, temperature sensors, as sensing components for collecting ambient temperature, are developing in the direction of integration, miniaturization, high performance and high precision. In recent years, NTC temperature sensors have been more and more widely used in new energy vehicle battery packs, motors, electronic control, and thermal management systems. In the harsh environment of continuous high temperature, high pressure and high vibration in new energy vehicles, NTC temperature sensors are required to be small in size, high in precision, fast in response and high in reliability. As the core component of the temperature sensor, the NTC the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/02H01B13/00H01C7/04
CPCH01B1/02H01B13/00H01C7/04
Inventor 刘斌王田军杜野吴菲徐邦耿黄小华
Owner SHENZHEN HOVERBIRD ELECTRONICS TECH CO LTD
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