Coating used for steel bars, as well as preparation method and use method
A technology for steel bars and coatings, applied in powder coatings, epoxy resin coatings, coatings, etc., can solve problems such as short curing agent chains, bending cracks, and adhesion problems
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Embodiment 1
[0022] The technical scheme of the present invention is: a coating for steel bars, including the following formula: epoxy resin A, the epoxy equivalent of the epoxy resin A is 1500, and the addition amount is 30%; epoxy resin B, the epoxy resin The epoxy equivalent of resin B is 850, and the addition amount is 20%; the phenolic curing agent, the hydroxyl equivalent of the phenolic curing agent is 450, and the addition amount is 20%; the epoxy addition imidazole, the addition amount is 3%; Leveling agent, the addition amount is 2%; filler, the addition amount is 20%; pigment, the addition amount is 5%.
[0023] Both the epoxy resin A and the epoxy resin B are bisphenol-A epoxy resins, and the bisphenol-A epoxy resin and the phenolic curing agent do not produce small molecules during the curing process, and will not Defects such as pinholes appear in the film. In addition, the existence of a large number of hydroxyl groups in the bisphenol A epoxy resin promotes the adhesion to...
Embodiment 2
[0032] The technical scheme of the present invention is: a coating for steel bars, including the following formula: epoxy resin A, the epoxy equivalent of the epoxy resin A is 1500-1800, and the addition amount is 50%; epoxy resin B, the The epoxy equivalent of epoxy resin B is 750-850, and the addition amount is 12.5%; the phenolic curing agent, the hydroxyl equivalent of the phenolic curing agent is 300-450, and the addition amount is 14%; epoxy addition imidazole, The addition amount is 2%; the leveling agent, the addition amount is 1%; the filler, the addition amount is 15.5%; the pigment, the addition amount is 5%.
[0033] Both the epoxy resin A and the epoxy resin B are bisphenol-A epoxy resins, and the bisphenol-A epoxy resin and the phenolic curing agent do not produce small molecules during the curing process, and will not Defects such as pinholes appear in the film. In addition, the existence of a large number of hydroxyl groups in the bisphenol A epoxy resin promo...
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