Joining method of SiC ceramic through combining nano-impregnated transient co-crystal phase with chemical vapor infiltration as well as prepared ceramic connector
A technology of chemical vapor infiltration and connection method, which is applied in the field of ceramic material connection, can solve the problems of brittleness and low impact toughness, weak thermal shock resistance, and difficult parts, and achieve the effect of consistent thermal expansion coefficient and promotion of densification
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Embodiment 1
[0026] 1. Preparation: Nano-SiC powder, Al 2 o 3 and Y 2 o 3 As a connecting material, the SiC powder has a purity of 99% and a particle size of 10nm; Al 2 o 3 The purity is 99%, the particle size is 0.1μm; Y 2 o 3 The purity is 99%, the particle size is 0.1μm; SiC:Al 2 o 3 :Y 2 o 3 The mass percentage is 93wt%: 2wt%: 5wt%. The connecting material powder is mixed on a planetary ball mill for 8 hours according to the above ratio. The solvent is absolute ethanol. The mixed powder obtained after drying is spread in the middle of two polished SiC A sandwich structure is formed and then heat treated in a heat treatment furnace. The specific process parameters of the heat treatment are as follows: heat up to 1000°C at 20°C / min, keep it warm for 1h, connect the environment to vacuum, and then use polycarbosilane doped with 50wt% nano-silicon carbide at 1500°C for 0.5h for chemical vapor infiltration to obtain Connectors for SiC ceramics.
[0027] 2. Performance test: The ...
Embodiment 2
[0029] 1. Preparation: Nano-SiC powder, Al 2 o 3 and La 2 o 3 As a connecting material, the particle size of SiC is 100nm; Al 2 o 3 The particle size is 5μm; La 2 o 3 Particle size is 5μm; SiC:Al 2 o 3 :CeO 2 The mass percentage is 90wt%: 5wt%: 5wt%. Connect according to the method of Example 1, wherein the heat treatment process is: heat up to 1400°C at 20°C / min, keep it warm for 1h, connect the environment to Ar, and then use doping 80wt% SiC whiskers of polycarbosilane were subjected to chemical vapor infiltration at 1600°C for 4h to prepare SiC ceramic connectors.
[0030] 2. Performance test: The connection strength of the connected SiC ceramics in this example is 180MPa at room temperature, and 150MPa at a high temperature of 1600°C; the leakage rate at the connection reaches 1×10 -11 Pa·L / s.
Embodiment 3
[0032] 1. Preparation: Nano-SiC powder, Al 2 o 3 and Gd 2 o 3 As a connecting material, the particle size of SiC is 50nm; Al 2 o 3 The particle size is 10μm; Gd 2 o 3 Particle size is 10μm; SiC:Al 2 o 3 :Ho 2 o 3 The mass percentage is 90wt%: 5wt%: 5wt%. Connect according to the method of Example 1, wherein the heat treatment process is: heat up to 1200°C at 20°C / min, keep warm for 0.5h, connect the environment to vacuum, and then use doping 40 % SiC whiskers of polycarbosilane were subjected to chemical vapor infiltration at 1400°C for 4h to prepare SiC ceramic connectors.
[0033]2. Performance test: The connection strength of the connected SiC ceramics in this example is 200MPa at room temperature, and 180MPa at a high temperature of 1600°C; the leakage rate at the connection reaches 1×10 -13 Pa·L / s.
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