Preparation method of halogen-free high Tg and low dielectric constant copper-clad board

A copper-clad laminate and low-dielectric technology, which is applied in the field of preparation of halogen-free high-Tg low-dielectric copper-clad laminates, can solve the problems of affecting dielectric properties and high cost of inorganic phosphorus-containing flame retardants, and achieve low Water absorption, excellent halogen-free flame retardancy, effects of improving dielectric properties and reliability

Inactive Publication Date: 2019-03-08
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Reactive organic phosphorus-based flame retardants participate in the reaction, which can easily affect the dielectric properties of the final product. Additive phosphorus-containing flame retardants mainly refer to inorganic phosphorus-based flame retardants, which do not participate in the reaction o

Method used

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  • Preparation method of halogen-free high Tg and low dielectric constant copper-clad board
  • Preparation method of halogen-free high Tg and low dielectric constant copper-clad board
  • Preparation method of halogen-free high Tg and low dielectric constant copper-clad board

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preparation example Construction

[0038] A preparation method of a halogen-free high Tg low dielectric copper clad board, the modified epoxy resin and functional additives are formulated to form an adhesive and coated on the glass fiber cloth, and then covered with copper foil and subjected to hot pressing A halogen-free high Tg low dielectric copper clad laminate was prepared.

[0039] The adhesive can be prepared by using the following components and raw materials in parts by weight: phosphazene flame retardant 2-80, isocyanate modified epoxy resin 5-80, modified polymeric anhydride 20-70, active ester curing agent 5 -50, biphenyl phenol type modified epoxy resin 5-80, metal type catalyst 0.005-1.0, imidazole catalyst 0.005-1.0, inorganic filler 10-60, silane 0.1-5.0, toughening agent 1-10, organic solvent 10-60.

[0040]Among the raw materials used above, the phosphazene flame retardant is 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10-phosphinephenanthrene-10-oxide, 10-(2,5 -Dihydroxynaphthyl)-10-hydro-9-...

Embodiment 1

[0056] 1. Prepare materials according to the formula composition

[0057] material name

Example 1

Phosphazene flame retardant (%)

16.7

Isocyanate Modified Epoxy

12.6

Modified polymeric anhydride

24.6

Active ester curing agent

10.5

Biphenyl phenol type modified epoxy

18.5

metal catalyst

0.005

2-Ethyl-4 methylimidazole

0.01

Spherical silica (%)

21.8

Silane (%)

0.11

Organic solvents(%)

20.6

Toughener (%)

3.58

[0058] Glue adjustment

[0059] 2.1 Add organic solvent, biphenyl phenol type modified epoxy resin, phosphazene flame retardant sequentially into the stirring tank according to the formula quantity, rotate at 1200 rpm, keep the tank at 30-50°C, and stir for 60 minutes;

[0060] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1300 rpm, and continue stirring f...

Embodiment 2

[0078] 1. Prepare materials according to the formula composition

[0079]

[0080]

[0081] Glue adjustment

[0082] 2.1 Add organic solvent, biphenyl phenol-type modified epoxy resin, and phosphazene flame retardant sequentially into the stirring tank according to the formula amount, rotate at 1100 rpm, keep the tank at 30-50°C, and stir for 110 minutes;

[0083] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1100 rpm, and continue stirring for 80 minutes after the addition is complete;

[0084] 2.3 Add silane, spherical silica, and toughening agent in sequence according to the formula amount in the tank and stir for 130 minutes at a speed of 1200 rpm;

[0085] 2.4 Add the metal-type catalyst and 3-ethyl-4 methylimidazole in sequence according to the formula amount in the tank, and stir at a speed of 1500 rpm for 160 minutes to prepare the adhesive.

[0086] 2. Glue and bake

...

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Abstract

The invention relates to a preparation method of a halogen-free high Tg and low dielectric constant copper-clad board. The preparation method comprises the steps of preparing an adhesive from modifiedepoxy resin and a functional assistant, coating glass fiber cloth with the adhesive, cladding with copper foil, and performing hot pressing to form the halogen-free high Tg and low dielectric constant copper-clad board. Compared with the prior art, Tg of the epoxy glass cloth based copper-clad board is greater than 180 DEG C; Z-axis CTE (coefficient of thermal expansion) is less than 3.0%; for thermal resistance, TD is greater than or equal to 360 DEG C and T288 is greater than 60min; for electrical properties, a dielectric constant (5GHZ) is less than or equal to 4.1 and a dielectric loss (5GHZ) is less than 0.007; in addition, the copper-clad board has very low water absorptivity and good machinability; flame retardance reaches a UL94 V-0 level; and the board can fully meet requirementsof halogen-free and leadless processing and high composite board production in the field of high-frequency and high-speed PCBs (printed circuit boards).

Description

technical field [0001] The invention relates to the field of preparation of copper clad boards, in particular to a preparation method of a halogen-free high Tg low dielectric copper clad board. Background technique [0002] The 21st century has entered a highly informationized society. Computers, mobile communications, and networks have gradually penetrated into every corner of society and people's lives. Human life is steadily developing in the direction of high informationization. Information processing and information communication constitute Two technical pillars in the development of highly informationized science and technology. In order to meet the ultra-large-capacity information transmission brought about by the rapid development of information technology, as well as the rigid requirements of ultra-fast and ultra-high-density information processing, higher requirements are put forward for printed circuit boards and copper-clad laminates. The specific requirements of...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06B32B15/14B32B15/20B32B17/02B32B7/12B32B37/12B32B37/06B32B37/10
CPCC09J11/04C09J11/06C09J163/00B32B5/02B32B7/12B32B15/14B32B15/20B32B37/06B32B37/10B32B37/1284B32B2307/204B32B2262/101B32B2307/726B32B2307/3065B32B2457/08C08L2205/025C08L63/00C08K7/18C08K5/5399
Inventor 何川粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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