Low-halogen flame-retardant epoxy resin adhesive and preparation method thereof

A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive additive, etc., can solve the problems of reducing the properties of epoxy resin cured products, reducing mechanical properties, increasing curing temperature, etc. Overcome the effects of poor impact resistance, good flame retardant effect and high bond strength

Inactive Publication Date: 2019-03-29
深圳市德镒盟电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For traditional epoxy resin adhesives, the cured epoxy resin is a flammable polymer material that emits toxic gases when burned, and requires flame retardant modification. Additive flame retardants are easy to operate due to their low toxicity. Favored by people, on the one hand, to achieve high flame retardant requirements, it is often necessary to add a large amount of additives, and too much will reduce the performance of the cured epoxy resin, such as the performance of the cured product, increase the curing temperature and make the mechanical properties lower etc.
On the other hand, additive flame retardants that can contain halogens will pollute the environment due to the release of corrosive gases when they are burned.

Method used

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  • Low-halogen flame-retardant epoxy resin adhesive and preparation method thereof
  • Low-halogen flame-retardant epoxy resin adhesive and preparation method thereof
  • Low-halogen flame-retardant epoxy resin adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] The low-halogen flame-retardant epoxy resin adhesive includes the following raw materials in parts by mass: 80 parts of epoxy resin (bisphenol A epoxy resin E-44), 5 parts of curing agent (dicyandiamide), 5 parts of diluent (dibutyl phthalate) 5 parts, flame retardant (aluminum hydroxide) 20 parts, dispersant (polyacrylamide) 1 part, coupling agent (γ-(methacryloxy) propyl trimethoxy Silane) 1 part, defoamer (glyceryl stearate) 1 part, football ene 0.01 part, silicon carbide ceramics 0.05 part.

Embodiment 2

[0033] The low-halogen flame-retardant epoxy resin adhesive includes the following raw materials in parts by mass: epoxy resin (hydrogenated bisphenol A type epoxy resin GEST3000 and bisphenol A type epoxy resin E-51 mixed resin, the mass of both The ratio is 1:1) 100 parts, the curing agent (the mixture of acetic anhydride and diaminodiphenylmethane, the mass ratio of the two is 1:10) 15 parts, the diluent (the mixture of acetone and n-butyl glycidyl ether, the mass ratio of the two The ratio is 5:1) 10 parts, the flame retardant (the mixture of zinc borate and phosphoramidate, the mass ratio of the two is 0.1:1) 60 parts, the dispersant (the mixture of polyacrylamide and zinc stearate, the mass ratio of the two 10:1) 5 parts, coupling agent (γ-aminopropyl triethoxysilane, isopropyl tristearyl titanate mixture, its mass ratio is 1:2) 10 parts, defoamer ( Glyceryl stearate) 10 parts, football ene 0.05 parts, silicon carbide ceramics 0.02 parts.

Embodiment 3

[0035] The low-halogen flame-retardant epoxy resin adhesive includes the following raw materials in parts by mass: epoxy resin (hydrogenated bisphenol A type epoxy resin GEST3000 and bisphenol A type epoxy resin E-51 mixed resin, the mass of both The ratio is 3:1) 100 parts, the curing agent (the mixture of acetic anhydride and diaminodiphenylmethane, the mass ratio of the two is 1:8) 15 parts, the diluent (the mixture of acetone and n-butyl glycidyl ether, the mass ratio of the two The ratio is 3:1) 10 parts, the flame retardant (the mixture of zinc borate and phosphoramidate, the mass ratio of the two is 1:5) 60 parts, the dispersant (the mixture of polyacrylamide and zinc stearate, the mass ratio of the two 2:1) 5 parts, coupling agent (γ-aminopropyl triethoxysilane, isopropyl tristearyl titanate mixture, its mass ratio is 1:5) 10 parts, defoamer ( Glyceryl stearate) 10 parts, football ene 0.05 parts, silicon carbide ceramics 0.02 parts.

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Abstract

The invention discloses a low-halogen flame-retardant epoxy resin adhesive and a preparation method thereof. The low-halogen flame-retardant epoxy resin adhesive is prepared from the following raw materials in parts by mass: 80-120 parts of epoxy resin, 5-100 parts of a curing agent, 5-25 parts of a diluent, 20-40 parts of a flame retardant, 1-10 parts of a dispersant, 1-20 parts of a coupling agent, 1-10 parts of a defoaming agent, 0.01-0.1 part of footballene and 0.01-0.05 part of silicon carbide ceramics. The preparation method provided by the invention is simple and easy to implement, energy-saving and environmentally-friendly; furthermore, the prepared epoxy resin adhesive is low in halogen content, good in flame-retardant effect and high in bonding strength, and can well meet the market demands.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a low-halogen flame-retardant epoxy resin adhesive. Background technique [0002] With the popularity of mobile phones, computers, artificial intelligence and other electronic products, epoxy resin adhesives have been used as a new type of structural device adhesive due to their high bonding strength, long service life and excellent performance in chemical solvent resistance. Bonding materials are widely used in industrial production and people's life. [0003] For traditional epoxy resin adhesives, the cured epoxy resin is a flammable polymer material that emits toxic gases when burned, and requires flame retardant modification. Additive flame retardants are easy to operate due to their low toxicity. Favored by people, on the one hand, to achieve high flame retardant requirements, it is often necessary to add a large amount of additives, and too much will reduce the performance of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06
CPCC08K2003/2224C08K2003/2227C08K2003/387C08L2201/02C08L2201/08C08L2205/025C08L2205/03C08L2205/035C09J11/04C09J11/06C09J163/00C08L33/26C08K13/06C08K9/00C08K3/045C08K3/34C08K5/103C08K3/22C08L63/00C08K3/38
Inventor 王永超唐新开
Owner 深圳市德镒盟电子有限公司
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