A kind of method that adopts printing technology to make two-way TVS chip

Abstract

The invention relates to a method for manufacturing a bidirectional TVS chip using a printing process. The preparation steps include silicon chip pretreatment, double-sided diffusion texturing, glass passivation printing and drawing, metallization and test sorting, wherein the double-sided diffusion texturing step adopts double-sided Phosphorus source is deposited on the surface or boron source is printed on both sides, and then diffused, and wet texturing or laser texturing is used. The glass passivation process uses printing to coat the protective layer and glass paddle, which simplifies the glass passivation process and increases the production rate. Compared with traditional methods, the production process of bidirectional TVS chips produced by printing technology is large-scale, automated, informatized, and less humanized; bidirectional TVS chip products have low production costs, high quality, high consistency, and good market compatibility; printing process efficiency is high, With high precision, it replaces coating, coating, electrophoresis and other processes in the existing process, realizes automated production with fewer people, improves product consistency, and reduces environmental protection and safety risks.

Description

Technical field[0001]The invention belongs to the field of bidirectional TVS chip, in particular, to a method of fabricating a two-way TVS chip using a printing process.Background technique[0002]TVS (Transient Voltage Suppressor) diode, also known as transient suppression diodes, is a new high-efficiency circuit protection device that is commonly used, which has extremely fast response time (Nanaosecond) and quite high surge absorption. It cooperates with the electrical resistance, capacitance and other components to use as the use of transient high pressure suppression protection. When it is subjected to a high energy impact on both ends, the TVS can cause the impedance value between the two ends from high impedance to low impedance at extremely high speed to absorb a large current, clamp its two-end voltage. A predetermined value, thereby protecting the back circuit components from the impact of transient high pressure spikes[0003]TVS is widely used in all kinds of protection elec...

AI Technical Summary

Problems solved by technology

[0004] Currently, three processes are mainly used in the industry to produce bidirectional TVS chips: knife scraping process, electrophoresis process, and photoresist glass process. Among these three processes, the knife scraping bidirectional TVS process is simple and low in cost, but due to the And there is no oxide film protection on the passivated glass, the solder is easy to flow to the glass, the reliability will be reduced, and it is easy to fail in application; the sharp corners of the electrophoresis process groove are protected by passivated glass, and the reliability is relatively high, but due to platinum There are many production processes, and a large amount of acetone is required for production, which has potential safety hazards and relatively high costs; the photoresist glass method uses three layers of passivation protection (SIPOS, glass, silicon dioxide), and the reverse voltage is higher. Silicon wafer resistors are used The rate range is wider and the reliability is high, but 3 times of photolithography are required in production, and the production cost is high