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Polyimide thick membrane and quantum carbon-based membrane as well as preparation method thereof

A polyimide thick film and polyimide resin technology, which is applied in the field of polyimide film preparation, can solve the problems of peeling, low moisture permeability, easy generation of air bubbles at the interface between metal and polyimide film, etc. , to achieve the effect of improving warpage, no inclined warpage, and good flatness

Active Publication Date: 2019-05-21
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing method of preparing polyimide film is usually prepared by casting method. When the thick film composite film is prepared by casting method, due to the relatively small moisture permeability rate on the reverse side, the interface between the metal and the polyimide film will Prone to air bubbles, which can cause a tendency to peel

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  • Polyimide thick membrane and quantum carbon-based membrane as well as preparation method thereof
  • Polyimide thick membrane and quantum carbon-based membrane as well as preparation method thereof
  • Polyimide thick membrane and quantum carbon-based membrane as well as preparation method thereof

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preparation example Construction

[0030] like figure 1 As shown, the preferred embodiment of the present invention discloses a method for preparing a polyimide thick film, wherein the thickness of the polyimide thick film is 150-300 μm, comprising the following steps:

[0031] A1: Hybridization of anhydrides containing phenyl groups with diamines to obtain thermoplastic polyimide resin precursors;

[0032] Specifically, step A1 specifically includes: 20-30 parts by volume of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 4,4'-diaminodiphenyl ether (4,4'-ODA) 20 to 30 parts by volume and diaminodianthracene ether (also known as heterosexual diamine, the structural formula is ) 3 to 7 parts by volume are dissolved in N,N-dimethylformamide (DMF), and then 25 to 25 parts by volume of 3,3',4,4'-benzophenone tetra-acid dianhydride (BTDA) 35 parts, then add 10 to 20 parts by volume of pyromellitic dianhydride (PMDA), and then add 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA ) and / or pyromellitic dia...

Embodiment 1

[0055] S1: Dissolve 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) 25mol and 4,4 in N,N-dimethylformamide (DMF) cooled below 10°C 25mol of '-diaminodiphenyl ether (4,4'-ODA) and 5mol of diaminodianthracene ether, add 30mol of 3,3',4,4'-benzophenonetetraacid dianhydride (BTDA), and After dissolving, add 15mol of pyromellitic dianhydride (PMDA) and stir for 2 hours to form a thermoplastic polyimide prepolymer prepolymer; after a period of reaction, add 3,3',4,4'-di Benzophenone tetracarboxylic dianhydride and / or pyromellitic dianhydride, so that the final synthesis molar ratio is actually equivalent to roughly equimolar to obtain a thermoplastic polyimide prepolymer;

[0056] S2: Mix the thermoplastic polyimide prepolymer obtained in step S1 with the monomeric reactant NA acid anhydride in a vacuum environment of -100°C ~ -60°C, and obtain two low molecular weight polyimides through a bridging reaction. The terminal forms a monomer structure to obtain an imide intermediate com...

Embodiment 2

[0063] Cut the polyimide thick film (thickness) prepared above into a square of 15cm*15cm on one side, laminate, heat press, rise from room temperature to 300°C at a speed of 30°C / min, keep it for 30 minutes, and circulate through heat medium oil Cool to obtain a PI composite film with no breakage, no peeling, good flexibility, no warping, and no foaming. Press the temperature to rise to 1000°C and keep it for 30 minutes. After cooling, no folds, complete carbonization, consistent color, and thickness are obtained. Uniform carbonized composite film. Further heat the carbonized film composite film to 2800°C-3000°C, keep it warm for 1 hour, and dope or inject nano-metal particles in the process to form uniformly distributed nano-quantum dots on the surface of the pure carbon-based film, and finally form a multi- A quantum carbon-based film with a layered graphene structure.

[0064] Through this preparation method, it shows that the polyimide thick film prepared by the above pr...

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Abstract

The invention discloses a polyimide thick membrane and a quantum carbon-based membrane as well as a preparation method thereof. The preparation method of the polyimide thick membrane comprises the following steps: hybridizing phenyl-containing anhydride and diamine to obtain a thermoplastic polyimide resin precursor; mixing the thermoplastic polyimide resin precursor and a monitor reactant and performing crosslinking reaction to enable the two tail ends of the thermoplastic polyimide resin precursor to a monomer structure to obtain an imide intermediate composition; imidizing the imide intermediate composition to obtain a resin solution mixture; spray-coating a conveying belt with the resin solution mixture continuously and uniformly by a blowout type spray-coating method, curing and drying to obtain the polyimide thick membrane. According to the polyimide thick membrane and the quantum carbon-based membrane as well as the preparation method thereof, which are provided by the invention, the flatness is high and inclined warping phenomenon is avoided.

Description

technical field [0001] The invention relates to the field of preparation of polyimide films, in particular to a polyimide thick film and quantum carbon-based film, and a preparation method thereof. Background technique [0002] Chemical polyimide films are widely used in various applications, such as electronic component insulation and semiconductor packaging, because of their outstanding heat resistance, chemical resistance, high mechanical bending strength, excellent electrical and physical properties, Dimensional stability and other advantages, such as polyimide film and copper foil composite to make flexible substrates and flexible protective films, used in the fields of flexible circuit boards (FPC), flexible displays, and flexible solar power generation. Recently, in particular, the chemical polyimide film is sintered at high temperature to make a carbon-based film for cooling of mobile phones, notebooks, communication routers and chips. [0003] The existing method o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10C01B32/184C01B32/15
CPCC01B32/15C01B32/184C08G73/10C08J5/18C08L79/08
Inventor 刘萍
Owner SHENZHEN DANBOND TECH
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