A kind of electronic material with high thermal stability and preparation method thereof

A technology of high thermal stability and electronic materials, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesive types, etc., can solve the problem of affecting the service life of LEDs, cracking of epoxy packaging materials, thermal stability Poor performance and other problems, to achieve the effect of improving crack resistance, reducing self-aggregation, and improving crack resistance

Active Publication Date: 2020-11-27
SUZHOU YUDESHUI ELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the problem that traditional LED epoxy packaging materials have poor thermal stability under the conditions of high-power LED use, resulting in cracking and warping of epoxy packaging materials during use, which affects the service life of LEDs, a solution is provided. A kind of electronic material with high thermal stability and preparation method thereof

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  • A kind of electronic material with high thermal stability and preparation method thereof

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example 1

[0042] An electronic material with high thermal stability, in parts by weight, mainly comprising: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts of Modified titanium dioxide, 5 parts zinc chloride, 10 parts epoxidized soybean oil.

[0043] A preparation method of an electronic material with high thermal stability, the preparation method of an electronic material with high thermal stability mainly comprises the following preparation steps:

[0044] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide with a mass of 300 times the mass of nano-silica into the beaker, at a temperature of 90°C , under the condition of rotating speed of 360r / min, stirring and mixing for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine in a mass ratio of 200:1, and add 4- N,N'-dicyclohexylca...

example 2

[0054] An electronic material with high thermal stability, in parts by weight, mainly comprising: 65 parts of epoxy resin E-51, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts of Modified titanium dioxide, 5 parts zinc chloride, 10 parts epoxidized soybean oil.

[0055] A preparation method of an electronic material with high thermal stability, the preparation method of an electronic material with high thermal stability mainly comprises the following preparation steps:

[0056] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide with a mass of 300 times the mass of nano-silica into the beaker, at a temperature of 90°C , under the condition of rotating speed of 360r / min, stirring and mixing for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine in a mass ratio of 200:1, and add 4- N,N'-dicyclohexylca...

example 3

[0066] An electronic material with high thermal stability, in parts by weight, mainly comprising: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of tetraethylene pentamine, 18 parts of additives, 24 parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.

[0067] A preparation method of an electronic material with high thermal stability, the preparation method of an electronic material with high thermal stability mainly comprises the following preparation steps:

[0068] (1) Mix nano-titanium dioxide and diisocyanate in a mass ratio of 1:1, and add anhydrous acetone with a mass of 30 times the mass of nano-titanium dioxide and an epoxy resin solution with a mass of 5 times the mass of nano-titanium dioxide, under a nitrogen atmosphere, at a temperature of 150 ℃, under the condition of rotating speed of 320r / min, after stirring and reacting for 24h, filter and dry at the temperature of 8...

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Abstract

The invention discloses an electronic material with high thermal stability and a preparation method thereof, belonging to the field of polymer materials for electronics. In the present invention, nano-silica is firstly chain-extended by polyacrylic acid, and mixed with tetraethylenepentamine and polyethyleneimine to prepare aminated nano-silica, and then nano-titanium dioxide is grafted with rings under the action of isocyanate. Oxygen groups, then grafted epoxy group nano-titanium dioxide and then grafted hydroxyl-containing flexible segments under the action of basic amines to prepare modified nano-titanium dioxide, and finally epoxy resin, fillers, diluents, amination Silicon dioxide, modified titanium dioxide, epoxy soybean oil and catalyst are mixed to prepare electronic material with high thermal stability. The electronic material with high thermal stability prepared by the technical solution of the present invention can have very good performance under high temperature conditions.

Description

technical field [0001] The invention relates to the field of electronic polymer materials, in particular to an electronic material with high thermal stability and a preparation method thereof. Background technique [0002] The LED lamp is composed of five parts: light-emitting chip, wire, bracket, conductive layer and packaging material. The main function of the packaging material is to protect the chip part, prevent the chip from being corroded by moisture or oxygen in the external environment, and ensure the luminous efficiency of the LED. . With the improvement of LED industry and technology, the performance requirements for LED packaging materials are becoming more and more strict. [0003] At present, LED packaging materials mainly include epoxy resin, silicone, silicone modified epoxy resin and other resins with high transparency. Since different packaging materials have different prices and functions, the application occasions and output are also different. At prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04
CPCC08K2003/0812C08K2003/168C08K2003/2241C08K2201/011C08L2201/08C08L2203/206C09J11/04C09J11/08C09J163/00C08L91/00C08K9/08C08K3/36C08K3/08C08K3/22C08K3/16
Inventor 高路生
Owner SUZHOU YUDESHUI ELECTRIC TECH CO LTD
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