Mixed conductive silver paste for package of nano chip

A technology of chip packaging and conductive silver paste, which is applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve the problems of uneven dispersion of nano-silver particles, reduction of original powder density, etc., and achieve delayed quality Diffusion, prevention of agglomeration, and simple preparation method

Inactive Publication Date: 2019-07-05
HIDETAKA NANO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silver nanoparticles are often in an unstable state in thermodynamics, leading to agglomeration between particles, which will lead to uneven dispersion of silver nanoparticles, thus forming large holes, which signi...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A mixed conductive silver paste for nanochip packaging, comprising 65%-85% of silver powder, 5%-25% of organic solvent, 1%-2% of dispersant, 10%-20% of organic vehicle, and surface Active agent 0.5%-5%, diluent 0.1%-5%;

[0021] Described silver paste preparation method is as follows:

[0022] (1) by weight percentage, take by weighing 70% of silver powder, silver powder comprises micron silver powder and nano silver powder, and micron silver powder average diameter is 1 μ m, and nano silver powder purity is 99.99%, and nano silver powder average particle diameter is 20nm; Micron silver powder and nano silver powder The mass ratio is 1:8; ethanol 10%; polyvinylpyrrolidone 1.5%; organic vehicle 15%, the organic vehicle is a mixture of acrylic resin and ethyl cellulose, wherein the mass ratio of acrylic resin to ethyl cellulose is 11:4 ;Abietic acid 0.5%;Abietyl alcohol 3%;

[0023] (2) Heat the ethanol solvent in a water bath to 60°C, slowly add polyvinylpyrrolidone, a...

Embodiment 2

[0028] A mixed conductive silver paste for nanochip packaging, comprising 65%-85% of silver powder, 5%-25% of organic solvent, 1%-2% of dispersant, 10%-20% of organic vehicle, and surface Active agent 0.5%-5%, diluent 0.1%-5%;

[0029] Described silver paste preparation method is as follows:

[0030] (1) by weight percentage, take silver powder 80%, silver powder comprises micron silver powder and nano silver powder, and micron silver powder average diameter is 1 μ m, and nano silver powder purity is 99.99%, and nano silver powder average particle diameter is 20nm; Micron silver powder and nano silver powder The mass ratio is 1:8; acetone 5%; polyvinylpyrrolidone 1%; organic vehicle 10%, the organic vehicle is a mixture of acrylic resin and ethyl cellulose, and the mass ratio of acrylic resin to ethyl cellulose is 11:4 ;Abietic acid 1%;Abietol 3%;

[0031] (2) Heat the ethanol solvent in a water bath to 60°C, slowly add polyvinylpyrrolidone, a mixture of acrylic resin and et...

Embodiment 3

[0036] A mixed conductive silver paste for nanochip packaging, comprising 65%-85% of silver powder, 5%-25% of organic solvent, 1%-2% of dispersant, 10%-20% of organic vehicle, and surface Active agent 0.5%-5%, diluent 0.1%-5%;

[0037] Described silver paste preparation method is as follows:

[0038] (1) by weight percentage, take by weighing 70% of silver powder, silver powder comprises micron silver powder and nano silver powder, and micron silver powder average diameter is 1 μ m, and nano silver powder purity is 99.99%, and nano silver powder average particle diameter is 20nm; Micron silver powder and nano silver powder The mass ratio is 1:8; acetone 10%; polyvinylpyrrolidone 1%; organic vehicle 15%, the organic vehicle is a mixture of acrylic resin and ethyl cellulose, wherein the mass ratio of acrylic resin to ethyl cellulose is 11:4 ;Abietic acid 2%;Abietol 2%;

[0039] (2) Heat the ethanol solvent in a water bath to 70°C, slowly add polyvinylpyrrolidone, a mixture of ...

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Abstract

The invention provides a mixed conductive silver paste for package of a nano chip. The preparation method is simple, stable and reliable in preparation process and free of pollution to the environment. The mixed conductive silver paste comprises the components: 65-85% of aluminium powder, 5-25% of an organic solvent, 1-2% of a dispersing agent, 10-20% of an organic carrier, 0.5-5% of surface active agent, and 0.1-5% of a diluent. An abietic acid is taken as the surface active agent, and the mixture of the acrylic resin and the ethyecellulose is taken as the organic carrier to effectively delaythe generation of mass diffusion and avoid generation of low-temperature non-intensive diffusion, the mixing of the nano silver powder and the micron silver powder is employed to maintain the stabilization of particles and have the effects on dispersion of nano particles and avoiding of agglomeration so as to improve the performances of the slurry; the sodium and silver slurry obtained by employing the formula and the preparation method has the thermal conductivity being 193W/(K.m) after sintering which is better than the thermal conductivity of the thermal conductive glue and the alloy solder for package, and the shear strength of a sintered joint can reach 37.5 MPa, and the performance is excellent.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a mixed conductive silver paste for nano chip packaging. Background technique [0002] Due to worldwide restrictions on the use of lead-containing solder in electronic packaging and interconnection, electronic lead-free has always been the focus of electronic interconnection research. At present, the main lead-free solders are Sn-Ag-Cu, Sn-Cu and Au- Alloys such as Sn, but compared with Pb-Sn solder, lead-free solder still has disadvantages such as poor processing performance and high processing temperature. On the other hand, the widespread use of high-power wide-bandgap chips and the sharp increase in power density make the packaging system have higher and higher requirements for heat dissipation, and the thermal conductivity of mutual thermal paste and alloy solder used for chip-level interconnection is becoming less and less capable fulfil requirements. Nano-intercon...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00B82Y30/00
CPCB82Y30/00H01B1/22H01B13/00
Inventor 崔建中
Owner HIDETAKA NANO TECH CO LTD
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