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A kind of fluorine-containing silicon aryl alkynyl resin and preparation method thereof

A technology of aryl alkynyl and fluorine-containing alkyl, which is applied in the field of preparation of fluorine-containing silicon aryl alkynyl resin

Active Publication Date: 2021-07-27
EAST CHINA UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese invention patent CN103772981 discloses a modified epoxy resin or polyimide resin with fluorinated graphene to obtain a low dielectric constant composite material glue, which has good thermal stability after removing the solvent and curing and low dielectric constant, but the glue needs to be molded in a solution state, and the manufacturability needs to be improved

Method used

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  • A kind of fluorine-containing silicon aryl alkynyl resin and preparation method thereof
  • A kind of fluorine-containing silicon aryl alkynyl resin and preparation method thereof
  • A kind of fluorine-containing silicon aryl alkynyl resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0040] Embodiment 1 Fluorine-containing silicon aryl alkynyl resin PSAF-1

[0041] In a 500ml four-necked flask equipped with a nitrogen conduit, a stirrer, a thermometer and a condenser tube, after several dehumidification and deoxygenation after vacuuming and nitrogen displacement, under the protection of nitrogen, 3.02g (0.126mol) of magnesium powder / tetrahydrofuran (50ml) was added to a four-neck flask, cooled with an ice-water bath, and then 18.13g (0.12mol) / tetrahydrofuran solution of bromopentane was added dropwise. A solution of 7.56 g (0.06 mol) of diethynylbenzene / tetrahydrofuran was added dropwise, and after the dropwise addition, the reaction was kept at 70°C for 2 hours. The reaction system was cooled to below room temperature, and a 9.50 g (0.045 mol) / tetrahydrofuran solution of trifluoropropylmethyldichlorosilane was added thereto, and the reaction was maintained at 60° C. for 3 hours. Terminate the reaction with an acid, wash with water and take the organic ph...

Embodiment 2

[0047] Example 2 Fluorine-containing silicon aryl alkynyl resin PSAF-2

[0048] In a 500ml four-necked flask equipped with a nitrogen conduit, a stirrer, a thermometer and a condenser tube, after several cycles of dehumidification and deoxygenation through vacuuming and nitrogen displacement, under nitrogen protection, magnesium powder 3.02g (0.126mol) / Methyltetrahydrofuran (60ml) was added to a four-neck flask, cooled with an ice-water bath, and bromoethane 13.08g (0.12mol) / methyltetrahydrofuran (30ml) was added dropwise therein, and then kept at 50°C for 2 hours, and then cooled Afterwards, 7.56 g (0.06 mol) of diethynylbenzene / methyltetrahydrofuran (30 ml) was added dropwise to the reaction system, and the reaction was carried out at reflux temperature (about 80° C.) for 2 hours after the dropwise addition. The system was cooled to below room temperature, and 6.33 g (0.03 mol) of trifluoropropylmethyldichlorosilane / methyltetrahydrofuran (30 ml) was added thereto, followed ...

Embodiment 3

[0049] Example 3 Fluorine-containing silicon aryl alkynyl resin PSAF-3

[0050] In a 500ml four-necked flask equipped with a nitrogen conduit, a stirrer, a thermometer and a condenser tube, after several cycles of dehumidification and deoxygenation after vacuuming and nitrogen displacement, under nitrogen protection, magnesium powder 3.02g (0.12mol) / Methyltetrahydrofuran (60ml) was added into a four-necked flask, cooled with a cold water bath, and bromopentane 18.13g (0.12mol) / methyltetrahydrofuran (30ml) was added thereto, then reacted at 60°C for 2 hours, and then cooled to Diethynylbenzene 7.56g (0.06mol) / methyl tetrahydrofuran (30ml) was added dropwise into the system, and reacted at 70°C for 2 hours. The system was cooled to below room temperature, and 11.63 g (0.02 mol) of perfluorooctylethyltrichlorosilane / methyltetrahydrofuran (30 ml) was added thereto, and the mixture was kept at 70° C. for 2 hours. Terminate the reaction with an acid, wash with water and take the o...

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Abstract

The invention relates to a fluorine-containing silicon arylalkynyl resin and a preparation method thereof. The molecular structure of the fluorine-containing silicon arylalkynyl resin is characterized in that it contains fluorine silane and aryl alkyne groups. The fluorine-containing silicon arylalkynyl resin simplifies the process flow, the reaction time is short, the process conditions are easy to control, and the post-treatment process is simple. Fluorine-containing silicon arylalkynyl resin has excellent heat resistance, low dielectric constant and dielectric loss, which can be used to prepare advanced resin-based composite materials and low dielectric constant materials. It is used in aerospace, electronic information fields Has a wide range of applications.

Description

technical field [0001] The invention belongs to the technical field of low dielectric constant resin and its preparation, specifically relates to a low dielectric constant fluorine-containing silicon aryl alkynyl resin, and also relates to a preparation method of the fluorine-containing silicon aryl alkynyl resin. Background technique [0002] With the rapid development of electronic information technology, the development direction of electronic products is light and thin, high performance and multifunctional. High temperature resistance and low dielectric constant performance put forward higher requirements; on the other hand, the rapid development of aerospace technology also puts forward higher requirements for the performance of high temperature resistant and wave-transparent materials. [0003] High-performance resins, such as epoxy resin, bismaleimide resin, cyanate resin and polyimide resin, etc., have excellent heat resistance, high mechanical strength and low diele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G77/24C08G77/20C08G77/06
CPCC08G77/06C08G77/20C08G77/24C08G77/80
Inventor 齐会民陈元俊朱亚平王帆
Owner EAST CHINA UNIV OF SCI & TECH