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High-strength high-conductivity copper chromium zirconium alloy and low-temperature deforming preparing method thereof

A high-conductivity, high-strength technology, applied in the manufacture of high-strength and high-conductivity copper-chromium-zirconium alloys that are characterized by low-temperature deformation, can solve the problem of decreased conductivity, increased scattering cross-section, and alloys that cannot continue to reduce grain size Strength and other issues, to achieve the effect of relaxing the treatment conditions, improving the strength of the alloy, and eliminating the need for artificial aging treatment

Active Publication Date: 2019-07-30
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the formation and annihilation of internal defects in the metal are balanced during repeated deformation, such methods cannot continue to reduce the grain size and thus increase the strength of the alloy.
[0007] On the other hand, the high-density defect structure (such as: high-density dislocation) obtained by deformation and the high-density grain boundary accompanied by the reduction of grain size will also cause a large increase in the scattering cross-section during electron transport, which leads to While the strength of the alloy is improved, the electrical resistivity is significantly increased, and the electrical conductivity is significantly decreased
Increased defect density simultaneously increases strength and resistivity, a paradox that limits the development of conductive copper alloys to simultaneously achieve higher strength and conductivity

Method used

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  • High-strength high-conductivity copper chromium zirconium alloy and low-temperature deforming preparing method thereof
  • High-strength high-conductivity copper chromium zirconium alloy and low-temperature deforming preparing method thereof
  • High-strength high-conductivity copper chromium zirconium alloy and low-temperature deforming preparing method thereof

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Experimental program
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Effect test

Embodiment 1

[0035] In terms of mass percentage, the composition of copper-chromium alloy is: 98.6% copper, 1.0% chromium, 0.1% zirconium, and the rest are unavoidable impurities. After vacuum casting, the alloy is hot-extruded at 1000°C and kept at 600°C for 0.5 hours. After hot extrusion, the alloy is soaked in liquid nitrogen and then cold forged in a liquid nitrogen environment, with an equivalent variable of 2.0. The typical microstructure of the alloy after deformation is a mixed structure of nano-sized twin bundles and nano-crystals, the average thickness of the nano-twins is 30nm, and the average grain size of the nano-crystals is 50nm. The tensile strength of the alloy at room temperature is 700 MPa, and the electrical conductivity is 78% IACS.

Embodiment 2

[0037] In terms of mass percentage, the composition of copper-chromium alloy is: 98.6% copper, 1.0% chromium, 0.1% zirconium, and the rest are unavoidable impurities. After the alloy is vacuum melted and cast, it is hot extruded at 1000°C and cooled through water. The hot extruded material is naturally cooled after being kept at 600 degrees Celsius for 2 hours, and then cold forged at -50 degrees Celsius after soaking in liquid nitrogen. After the alloy goes through the above process, the typical microstructure is a mixed structure of nano-sized twin beams and nano-crystals, the average layer thickness of nano-twins is 30nm, and the average grain size of nano-crystals is 100nm. The tensile strength of the alloy at room temperature is 650 MPa, and the electrical conductivity is 80% IACS.

Embodiment 3

[0039] In terms of mass percentage, the composition of copper-chromium alloy is: 98.6% copper, 1.0% chromium, 0.1% zirconium, and the rest are unavoidable impurities. After the alloy is vacuum melted and cast, it is hot extruded at 1000°C and water cooled. After hot extrusion, the alloy is soaked in liquid nitrogen after heat preservation at 600°C for 2 hours, and rolled at -100°C, with a total rolling reduction of 85%. After the alloy goes through the above process, the typical microstructure is a mixed structure of nano-sized twin beams and nano-crystals, the average layer thickness of nano-twins is 30nm, and the average grain size of nano-crystals is 50nm. The tensile strength of the alloy at room temperature is 680 MPa, and the electrical conductivity is 80% IACS.

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Abstract

The invention relates to the field of copper alloy and application thereof, in particular to a high-strength high-conductivity copper chromium zirconium alloy and a low-temperature deforming preparingmethod thereof. The alloy comprises chemical components including, by mass percent, 0.2 to 1.5% of chromium, 0.05 to 0.2% of zirconium and the balance copper and inevitable impurities. The typical structure of the alloy comprises a copper matrix of a nanoscale deformation structure and dispersed distribution chromium particles, the typical nanostructure is a deformation twin crystal bundle, the twin crystal layer piece thickness ranges from 20 to 100 nanometers, the twin crystal bundle size ranges from several microns to several hundred microns, and the diameter of the dispersed distributionchromium particles ranges from 10 to 100 nanometers. The alloy has the 700 MPa stage strength, and meanwhile, the conductivity is within the 78 to 82% IACS range. The manufacturing method of the alloycomprises the steps of alloy blank casting heat machining and low-temperature deforming. The alloy has the advantages of being high in strength, high in conductivity, high in softening temperature, excellent in wear resisting and welding property and the like and can be suitable for the field of use of existing copper chromium zirconium alloy and the field with the higher requirement for strength-conductivity.

Description

technical field [0001] The invention relates to copper alloys and their application fields, in particular to a high-strength and high-conductivity copper-chromium-zirconium alloy strengthened by nano-twin structure and dispersed chromium particles, and a manufacturing method mainly characterized by low-temperature deformation. Background technique [0002] With the rapid development of power electronics, high-speed rail transit and other industries, higher and higher requirements are placed on the lightweight and low energy consumption of conductive components, which requires the use of key conductive components such as lead frames and high-speed railway contact wires. The conductive material has both high electrical conductivity and higher strength. The existing high-strength and high-conductivity materials are mainly copper alloys. This type of alloy will remain the most important conductor material for a long time in the future due to its excellent forming ability, moder...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22F1/08
CPCC22C9/00C22F1/08
Inventor 孙利昕张志远陶乃镕卢柯
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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