A kind of preparation technology of conductive circuit of glass-based circuit board

Abstract

The invention provides a preparation process of a conductive circuit of a glass-based circuit board. The preparation process comprises the steps of preparing special conductive silver paste from a special conductive material, an organic adhesive and an inorganic additive according to a mass ratio; scraping the special conductive silver paste onto a glass substrate through a hollow part on a titanium alloy printing plate; performing low-temperature drying at 150-200 DEG C for 5-15 minutes; and performing heating to 500-750 DEG C, keeping the temperature for 2-8 minutes, and performing cooling to the room temperature. According to the preparation process of the conductive circuit of the glass-based circuit board, the titanium alloy printing plate is used for replacing a traditional silk-screen printing plate to realize a printing paste scraping process of the circuit board in the coating step; the circuit thickness of the glass-based circuit board can reach 18-35 microns; the paste is smooth; the edge is neat; no air holes are generated; and the circuit performance is improved by about 1 time compared with that of a traditional process.

Description

technical field [0001] The invention relates to a process for preparing a conductive circuit of a glass-based circuit board, which belongs to the field of electronic technology. Background technique [0002] At present, the conductive paste for glass-based circuit boards is generally composed of conductive metal powder, binder, solvent and other auxiliary agents, and the conductive paste is printed on the glass substrate by screen printing. The screen printing method refers to the method of using a screen perforated plate and printing materials to obtain graphics by scraping with a scraper. The basic principle of printing materials is printed. The content of the metal conductive material in the conductive paste will directly affect the electrical conductivity of the circuit. Studies have shown that when the content of the conductive material in the conductive paste is 80% to 90% by weight, the electrical conductivity is the best. At present, the proportion of conductive ma...

AI Technical Summary

Problems solved by technology

At present, the proportion of conductive materials in the conductive paste of glass-based circuit boards produced by traditional technology is less than 75%, because the content of auxiliary materials such as binders needs to reach more than 25% to make the spherical particles in the paste between conductive materials. It has sufficient adhesive force to prevent the conductive particles from falling off, so it is difficult to increase the content of conductive materials in the existing slurry

However, such a mass ratio does not reach the optimal ratio of conductive materials in the paste, and there is still room for improvement in the conductivity, and the use of a large number of additives greatly increases the brittleness of the conductive circuit, and it is easy to break when the glass substrate is deformed. Causes damage to glass-based circuit boards

[0003] In the preparation process of conductive lines of glass-based circuit boards, due to the high viscosity of conductive silver paste with high silver content, its fluidity is poor. The isolation of the conductive circuit will make the coating of the conductive line uneven and produce air holes, resulting in poor conduction ability and low conductivity of the circuit; if the pressure on the scraper is increased, the air holes can be slightly reduced and the flatness can also be improved. However, due to the increase in pressure, the thickness of the conductive circuit layer of scraping will become smaller, mostly below 10 μm. Because the circuit is too thin, and the conductive silver paste prepared by the traditional process is brittle, when the glass substrate is deformed, the conductive The line is easily broken, causing damage to the circuit