High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method

A technology of low-temperature co-fired ceramics and low dielectric constant, applied in the field of electronic materials, can solve the problems of low bending strength, high dielectric loss, and limited application of quartz materials, and achieve high bending strength, low dielectric constant, Good corrosion resistance

Active Publication Date: 2019-09-20
JIAXING GLEAD ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN 103011788A utilizes the low softening point of borosilicate glass and the low dielectric constant and low expansion coefficient of high-purity ultrafine spherical quartz to develop a medium-low expansion low-temperature co-fired ceramic material, but this mat

Method used

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  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method
  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method
  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Examples 1-3

[0031] Embodiment 1-3 is the preparation of glass powder

[0032] 1) Weigh a certain mass of SiO 2 , H 3 BO 3 , Li 2 CO 3 , Al 2 O 3 , Na 2 CO 3As the raw material powder of the first phase glass, dry mix for 12 hours, put the mixed raw material powder into the crucible, put it in a high temperature resistance furnace at 1450℃ to melt and clarify, and pour the clear glass liquid quickly after 0.5 hours In deionized water, glass slag was obtained. The broken glass slag is crushed, put into a ball-milling tank, ball-milled to a medium particle size of 2.5-3.5 μm with absolute ethanol as a medium, and dried to obtain glass powder. The glasses prepared in Examples 1-3 are denoted as the first phase glasses A, B, and C, respectively, as shown in Table 1 below.

[0033] 2) Weigh a certain mass of SiO 2 , H 3 BO 3 , ZnO is used as the raw material powder of the second phase glass, and the glass powder is prepared by the same method as the first pha...

Example Embodiment

[0036] Examples 4-9

[0037] Embodiment 4-9 is the preparation of low temperature co-fired ceramic powder

[0038] Weigh the first phase glass, second phase glass, SiO of the following table 2 2 , ZrO 2 The material composition of ethanol is used as a solvent, ball-milled for 2-8 hours and then dried to obtain low-temperature co-fired ceramic powder.

[0039] Table 2

[0040] Numbering First phase glass / g Second phase glass / g SiO 2 / g

Example Embodiment

[0041] Examples 10-15

[0042] In Examples 10-15, the low-temperature co-fired ceramic powders given in Examples 4-9 were used to prepare the low-temperature co-fired ceramic material green ceramic tapes and the sintering process parameters according to the composition ratio of the ceramic slurry listed in Table 3.

[0043] table 3

[0044]

[0045] 1) Weigh 250 g of low-temperature co-fired ceramic powder, add n-butanol and xylene as solvents, use fish oil as a dispersant, and add binder PVB and phthalic acid with a concentration of 20% after the low-temperature co-fired ceramic powder is dispersed for 17 hours. Dizinc ester (DOP) was used as a plasticizer, and after mixing for 5 hours, the material was discharged and deaerated to obtain a low-temperature co-fired ceramic slurry, and a green ceramic tape was obtained through a casting equipment.

[0046] 2) The green ceramic tape is cut, laminated, isostatic pressing and slicing to obtain 7.5mm*7.5mm*1mm tiles and 45mm*5m...

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PUM

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Abstract

The invention relates to a high frequency and low dielectric constant low temperature co-fired ceramic material and a preparation method thereof. The high frequency and low dielectric constant low temperature co-fired ceramic material is composed of the following raw materials by weight percentage: 10%-30% of first phase glass, 5%-20% of second phase glass and 50%-75% of a ceramic material. The method includes the procedures of: preparation of raw glass powder, preparation of a low dielectric constant low temperature co-fired ceramic material, preparation of a raw ceramic membrane by tape casting and making of a ceramic substrate. The low temperature co-fired ceramic material can realize low-temperature sintering (840-900DEG C), and under a frequency of 10GHz, the measured dielectric constant is 4.0-6.5, the dielectric loss is less than 0.2%, the coefficient of thermal expansion is 5.0-6.0ppm/DEG C (25-300DEG C), and the bending strength is greater than 160MPa.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a high-frequency low-dielectric constant low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] Low-temperature co-firing ceramics (Low-temperature co-firing ceramics, LTCC) is a kind of electronic packaging technology. It completes the spatial wiring of electrodes by stacking and co-firing multiple ceramic diaphragms printed with metal patterns to achieve specific For component functions, since silver or copper with high conductivity and low melting point is used for wiring, it needs to be matched with ceramic materials that can be sintered at a low temperature below 900°C or 1000°C. LTCC technology has significant advantages such as miniaturization, high integration, high performance and high reliability. In the past 30 years, great progress has been made in technology development and market application. At pres...

Claims

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Application Information

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IPC IPC(8): C04B35/14C04B35/48C04B35/622C04B35/626C03C3/091C03C3/089
CPCC03C3/089C03C3/091C04B35/14C04B35/48C04B35/622C04B35/62605C04B2235/365C04B2235/6562C04B2235/6567C04B2235/96C04B2235/9607
Inventor 袁烨童建喜胡元云刘强
Owner JIAXING GLEAD ELECTRONICS CO LTD
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