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High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method

A technology of low-temperature co-fired ceramics and low dielectric constant, applied in the field of electronic materials, can solve the problems of low bending strength, high dielectric loss, and limited application of quartz materials, and achieve high bending strength, low dielectric constant, Good corrosion resistance

Active Publication Date: 2019-09-20
JIAXING GLEAD ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN 103011788A utilizes the low softening point of borosilicate glass and the low dielectric constant and low expansion coefficient of high-purity ultrafine spherical quartz to develop a medium-low expansion low-temperature co-fired ceramic material, but this material is at low frequency (1MHz) That is, it shows a high loss (0.25%), and the quartz material has low bending strength and high dielectric loss, which will greatly limit its application in the production of substrate devices and other products and at high frequencies

Method used

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  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method
  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method
  • High frequency and low dielectric constant low temperature co-fired ceramic material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0031] Embodiment 1-3 is the preparation of glass powder

[0032] 1) Weigh a certain mass of SiO 2 , H 3 BO 3 , Li 2 CO 3 , Al 2 o 3 , Na 2 CO 3As the raw material powder of the first phase glass, dry mix for 12 hours, put the evenly mixed raw material powder into a crucible, put it in a high-temperature resistance furnace at 1450°C for melting and clarification, and pour the clarified glass liquid quickly after 0.5 hours In deionized water, glass crumbs were obtained. Crush the broken glass slag, put it into a ball mill jar, use absolute ethanol as a medium, ball mill it to a medium particle size of 2.5-3.5 μm, and dry it to obtain glass powder. The glasses prepared in Examples 1-3 are respectively recorded as the first phase glasses A, B, and C, as shown in Table 1 below.

[0033] 2) Weigh a certain mass of SiO 2 , H 3 BO 3 , ZnO is used as the raw material powder of the second phase glass, and the glass powder is prepared by the same method as the first phase g...

Embodiment 4-9

[0037] Embodiment 4-9 is the preparation of low temperature co-fired ceramic powder

[0038] Weigh the first phase glass, second phase glass, SiO 2 , ZrO 2 The material is composed of ethanol as a solvent, ball milled for 2-8 hours and then dried to obtain low temperature co-fired ceramic powder.

[0039] Table 2

[0040] serial number First phase glass / g Second phase glass / g SiO 2 / g

Embodiment 10-15

[0042] Examples 10-15 are prepared from the low-temperature co-fired ceramic powders given in Examples 4-9 and the proportions of the components of the ceramic slurry listed in Table 3 below to prepare low-temperature co-fired ceramic material green tapes and sintering process parameters.

[0043] table 3

[0044]

[0045] 1) Weigh 250g of low-temperature co-fired ceramic powder, add n-butanol and xylene as a solvent, use fish oil as a dispersant, disperse the low-temperature co-fired ceramic powder for 17 hours, and then add 20% binder PVB and phthalic acid Dizinc ester (DOP) is used as a plasticizer, and after being mixed for 5 hours, the material is degassed to obtain a low-temperature co-fired ceramic slurry, and a green ceramic tape is obtained by casting equipment.

[0046] 2) Cutting, lamination, isostatic pressing, and slicing of raw porcelain strips to obtain 7.5mm*7.5mm*1mm tiles and 45mm*5mm*4.5mm rectangular tiles, and place the tiles and tiles in a box Debindi...

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Abstract

The invention relates to a high frequency and low dielectric constant low temperature co-fired ceramic material and a preparation method thereof. The high frequency and low dielectric constant low temperature co-fired ceramic material is composed of the following raw materials by weight percentage: 10%-30% of first phase glass, 5%-20% of second phase glass and 50%-75% of a ceramic material. The method includes the procedures of: preparation of raw glass powder, preparation of a low dielectric constant low temperature co-fired ceramic material, preparation of a raw ceramic membrane by tape casting and making of a ceramic substrate. The low temperature co-fired ceramic material can realize low-temperature sintering (840-900DEG C), and under a frequency of 10GHz, the measured dielectric constant is 4.0-6.5, the dielectric loss is less than 0.2%, the coefficient of thermal expansion is 5.0-6.0ppm / DEG C (25-300DEG C), and the bending strength is greater than 160MPa.

Description

technical field [0001] The invention belongs to the field of electronic materials, and in particular relates to a high-frequency low-dielectric constant low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] Low-temperature co-firing ceramics (Low-temperature co-firing ceramics, LTCC) is a kind of electronic packaging technology. It completes the spatial wiring of electrodes by stacking and co-firing multiple ceramic diaphragms printed with metal patterns to achieve specific For component functions, since silver or copper with high conductivity and low melting point is used for wiring, it needs to be matched with ceramic materials that can be sintered at a low temperature below 900°C or 1000°C. LTCC technology has significant advantages such as miniaturization, high integration, high performance and high reliability. In the past 30 years, great progress has been made in technology development and market application. At pres...

Claims

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Application Information

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IPC IPC(8): C04B35/14C04B35/48C04B35/622C04B35/626C03C3/091C03C3/089
CPCC03C3/089C03C3/091C04B35/14C04B35/48C04B35/622C04B35/62605C04B2235/365C04B2235/6562C04B2235/6567C04B2235/96C04B2235/9607
Inventor 袁烨童建喜胡元云刘强
Owner JIAXING GLEAD ELECTRONICS CO LTD
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