An integrated sic solid state power controller

Abstract

The invention discloses an integrated SiC solid-state power controller, which adopts a three-layer superimposed structure of a power circuit board, a drive circuit board and a digital circuit board, electrically connects copper pillars and contact pins, and uses power terminals to bend and lead out the module to the outside. , realizing the characteristics of high temperature resistance, high power density and low parasitic parameters of the module. The power trace adopts ceramic substrate as Si 3 N 4 The copper-clad ceramic substrate technology of the material is realized, and the layout of the main circuit, the current-limiting branch and the discharge branch are integrated, and the right-angle bending structure is adopted, which greatly reduces the circuit volume of the power part and reduces the parasitic parameters of the power part circuit, thereby reducing Voltage stress of SiC MOSFETs. SiC MOSFETs use bare chips and are welded in the circuit layout using nano-silver sintering technology, and are interconnected by ultrasonic aluminum wire bonding to form a good heat conduction path, greatly improving the heat dissipation effect, improving the high temperature resistance of the solid-state power controller, and high reliability .

Description

technical field [0001] The invention belongs to the field of power electronics and electric engineering, and relates to a solid-state power controller (SSPC) module integration technology, which can greatly reduce the volume of the SSPC, improve the reliability of the SSPC, and expand its application field. Background technique [0002] Solid State Power Controller (SSPC for short) is an electronic switching device composed of solid-state semiconductor power devices. It has the advantages of no contact, no arc, no noise, fast response, low electromagnetic interference, long life, high reliability, and easy computer remote control. It is being widely used in aircraft, tanks, ships, and civil distribution networks. [0003] In order to meet the high-voltage DC power supply system technology that is being widely researched and applied in the aviation industry, it is imminent to develop a solid-state power controller with small size and light weight, high power and high power de...

AI Technical Summary

Problems solved by technology

Due to the small size of the integrated SSPC module, the generated heat is not easy to dissipate, and the accumulation inside the module will cause the internal temperature of the module to be too high, which will damage the internal power devices and copper layer wiring of the module; in addition, the parasitic parameters generated by the layout of the power wiring are in the The overvoltage phenomenon caused by the shutdown process of the power chip also threatens the safe and normal operation of the power device chip. In order to ensure that the power device chip does not fail due to overvoltage breakdown, the current SSPC module design engineers have to use higher voltage grades. Cost Device Products

At the same time, this overvoltage phenomenon will also increase device loss, affect circuit efficiency and electromagnetic performance, and put forward higher requirements for module heat dissipation conditions

[0005] The current detection of the integrated SSPC module plays a decisive role in realizing the functions of circuit short-circuit protection and start-up with capacitance. At present, commercial SSPC products use detection resistors as the means of circuit current detection. This method has low precision in high-current SSPCs. Low security and high power consumption

Images