A frequency-selective high-temperature-resistant resin-based wave-transparent composite material and its preparation method

Abstract

The invention discloses a frequency-selective high-temperature-resistant resin-based wave-transparent composite material, which comprises a fiber-reinforced high-temperature-resistant resin-based composite bottom layer, a high-temperature frequency-selective surface interlayer, and an anti-ablation / heat-insulation / low-dielectric surface layer. The high-temperature frequency selective surface interlayer is a non-precious metal coating with a certain porosity and a periodic pattern, and the anti-ablation / heat insulation / low dielectric surface layer is a ceramic surface layer with a certain porosity. The present invention also provides a method for preparing the above-mentioned frequency-selective high-temperature-resistant resin-based wave-transparent composite material. The frequency-selective high-temperature-resistant resin-based wave-transparent composite material of the present invention can withstand high temperatures above 350° C., and can simultaneously have wave-transmitting and stealth functions. The present invention is easy to realize the preparation of large-scale complex shape frequency selective surface, relative to the bonding frequency selective surface film scheme, can avoid the problems of block bonding and joints, and make the frequency selective high temperature resistant resin-based wave-transparent composite material have more excellent performance electrical properties.

Description

technical field [0001] The invention belongs to the field of composite materials, in particular to a resin-based wave-transparent composite material and a preparation method thereof. Background technique [0002] Wave-transparent materials and structures (radome, antenna window, radome, etc.) are important components of antennas and communication systems. They play an important role in protecting antennas and communication systems and maintaining the shape of aircraft. Wave function requirements, so that it can work properly. As antennas and communication systems have higher performance requirements for wave-transparent structures such as omnidirectional wave-transmission, wide-band (or multi-frequency points), frequency-selective wave-transmission, and stealth, traditional wave-transparent materials and structures can no longer meet the requirements. [0003] The frequency selective surface is a single-screen or multi-screen periodic array structure composed of a large num...

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Problems solved by technology

[0005] The conventional method for preparing a high-temperature frequency-selective surface on the surface of a high-temperature-resistant resin-based composite material is to use a physical deposition process (such as magnetron sputtering) to prepare a high-temperature-resistant, Anti-oxidation metal coating, and then use the printed circuit board process to etch the metal coating to form a frequency-selective surface pattern, and then use high-temperature resin to bond it to the surface of the high-temperature-resistant resin-based wave-transparent composite material, but this technology has obvious Disadvantages: 1) The physical deposition process is difficult to prepare a thicker metal coating on the resin film. The thickness of the coating is generally lower than the skin depth corresponding to the electromagnetic wave, resulting in a large square resistance of the metal coating, which is difficult to meet the electrical performance design requirements, and The cost of the physical deposition process is high, and it is difficult to prepare large-scale coatings; 2) Due to the poor adhesion and manufacturability of high-temperature resins, it is difficult to use high-temperature resins to realize the bonding process of wave-transparent composite materials and frequency-selective surface films; 3) and due to high-temperature use Under certain conditions, the bonding resin and the resin matrix in the composite material will undergo different degrees of pyrolysis and exhaust, which will easily cause the bubbling failure of the frequency selective surface film, and the use temperature is difficult to reach above 350 °C; 4) High temperature resin bonding process It is difficult to implement on non-planar developable special-shaped components. The frequency selective surface film needs to be divided into pieces during the surface bonding process of non-planar expandable components. The split joints will have a significant impact on the electrical properties of the components, and due to high temperature Adhesive resin has poor viscosity, and the laying and fixing of frequency selective surface film on special-shaped components is also a difficult process problem to solve

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