High-frequency high-power heterojunction bipolar transistor power amplifier

A heterojunction bipolar, power amplifier technology, used in high-frequency amplifiers, power amplifiers, radio frequency amplifiers, etc., can solve the problem of low output impedance, low power consumption, limited high-gain amplification capability, high-power, high-efficiency output Difficulty and other problems, to achieve the effect of ensuring phase difference, realizing impedance matching and phase adjustment

Pending Publication Date: 2019-10-22
QINGHAI UNIV FOR NATITIES +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) High power and high efficiency capabilities are limited: Traditional power amplifiers use a multi-channel parallel combination structure or a distributed structure. The combination efficiency of these two structures is limited, resulting in part of the power loss in the combination network, which limits high power. , high efficiency capability
[0005] (2) Low power consumption, high gain amplification capability is limited: the power amplifier of the traditional single-ended common source transistor is affected by the parasitic parameters of the transistor, the gain is low when working at high frequency, and the power capability is greatly limited at the same time, so as to achieve low power consumption more difficult
[0007] (1) The output impedance of the traditional multi-stage and multi-channel synthesis single-ended power amplifier is low when the multi-channel parallel combination structure is adopted, so the output synthesis net...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-frequency high-power heterojunction bipolar transistor power amplifier
  • High-frequency high-power heterojunction bipolar transistor power amplifier

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be understood that the implementations shown and described in the drawings are only exemplary, intended to explain the principle and spirit of the present invention, rather than limit the scope of the present invention.

[0024] An embodiment of the present invention provides a high-frequency and high-power heterojunction bipolar transistor power amplifier, including an input distribution transformer coupling matching network, a first Darlington power amplification network, a second Darlington power amplification network, a third A Darlington power amplification network, a fourth Darlington power amplification network, and an output distribution transformer coupling equalization network.

[0025] like figure 1 As shown, the input end of the input distribution transformer coupling matching network is the input end of the entire power ampl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-frequency high-power heterojunction bipolar transistor power amplifier. The high-frequency high-power heterojunction bipolar transistor power amplifier comprises an input distribution transformation coupling matching network, a first Darlington power amplification network, a second Darlington power amplification network, a third Darlington power amplification network, a fourth Darlington power amplification network and an output distribution transformation coupling equalization network. According to the invention, the heterojunction bipolar transistor is adopted,and the self-biased structure is utilized, so that extra base-stage feed is not needed, and complex peripheral circuits in the application of the amplifier are greatly reduced. The core framework adopts the first Darlington power amplification network, the second Darlington power amplification network, the third Darlington power amplification network and the fourth Darlington power amplificationnetwork, so that high power can be obtained, high high-frequency gain can be obtained, and meanwhile, the whole power amplifier obtains good high-frequency, high-gain, high-efficiency and high-power output capacities by utilizing good parasitic parameter inhibition of the differential amplifier in a microwave frequency band and combining with good power synthesis characteristics of a distributed transformer network.

Description

technical field [0001] The invention relates to the field of semiconductor power amplifiers and integrated circuits, in particular to a high-frequency and high-power heterojunction bipolar transistor power amplifier applied to a transmitting module at the end of a radio frequency microwave transceiver. Background technique [0002] With the rapid development of wireless communication systems and RF microwave circuits, RF front-end transceivers are also developing in the direction of high performance, high integration, and low power consumption. Therefore, the market urgently needs the radio frequency and microwave power amplifier of the transmitter to have high output power, high gain, high efficiency, low cost and other performances, and the integrated circuit is the key technology that is expected to meet the market demand. [0003] However, when using integrated circuit technology to design and implement RF and microwave power amplifier chip circuits, its performance and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H03F1/02H03F1/56H03F3/19H03F3/21H03F3/24
CPCH03F1/0205H03F1/565H03F3/19H03F3/21H03F3/245H03F2200/451
Inventor 林倩刘林盛邬海峰胡单辉张晓明
Owner QINGHAI UNIV FOR NATITIES
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products