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Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet

A technology of thermosetting resin and composition, which is applied in the field of thermosetting resin composition, can solve the problems that have not been studied, and achieve the effects of good adhesion, solder resistance and solvent resistance

Inactive Publication Date: 2019-10-25
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no study on flux resistance and solder resistance when used as a solder resist

Method used

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  • Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet
  • Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet
  • Thermosetting resin composition, cured film, substrate having cured film, electronic component, and ink composition for inkjet

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0194] 2. Preparation method of thermosetting resin composition

[0195]The composition of the present invention can be prepared by mixing polyester amic acid (A), epoxy compound (B), copolymer (C), solvent (D), colorant (E) and other additives used as needed. preparation. In addition, the composition of the present invention can also directly mix epoxy compound (B), solvent (D), coloring agent ( E) and other additives etc. used as needed are prepared.

[0196] 3. Preservation of the composition

[0197] When the composition of this invention is preserved in the range of -30 degreeC - 25 degreeC, since the temporal stability of a composition will become favorable, it is preferable. If the storage temperature is -25°C to 10°C, no precipitates are present, which is more preferable.

[0198] 4. Manufacturing method of cured film

[0199] The method of manufacturing a cured film using the composition which concerns on one Embodiment of this invention is not limited. Th...

Embodiment

[0225]Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. Synthesis of epoxy compound (B), solvent (D), colorant (E), epoxy hardener (F), surfactant (i), and polyester amic acid (A) used in the examples is shown Tetracarboxylic dianhydride (a1), diamine (a2), polyhydric hydroxy compound (a3), monohydric alcohol (a4), reaction solvent (a5), polybasic anhydride (a6), and copolymer (C) used in the synthesis Names and abbreviations of the monomer (c1), polymerization initiator (c2) and reaction solvent (c3) used. These abbreviations are used in the following description.

[0226]

[0227]

[0228] ODPA: 3,3',4,4'-Diphenyl ether tetracarboxylic dianhydride

[0229]

[0230] DDS: 3,3'-Diaminodiphenylsulfone

[0231]

[0232] BDOH: 1,4-Butanediol

[0233]

[0234] BzOH: benzyl alcohol

[0235]

[0236] MPM: methyl 3-methoxypropionate

[0237] PGMEA: Propylene Glycol Monomethyl Ether Acetate

[0238] EDM: Di...

Synthetic example 1

[0275] Add the MPM of 446.6g and the ODPA of 183.20g, the BDOH of 31.93g, the BzOH of 25.54g as the reaction solvent in the 1000ml separable flask that is equipped with thermometer, stirring blade, raw material input and addition port and nitrogen gas introduction port, in Stirring was carried out at 130° C. for 3 hours under a stream of dry nitrogen. Thereafter, the reaction liquid was cooled to 25° C., 29.33 g of DDS and 183.4 g of MPM were thrown in, and stirred at 20° C. to 30° C. for 2 hours, then at 115° C. for 1 hour. Then, by cooling to 30 degreeC or less, the 30 weight% solution of the pale yellow transparent polyester amic acid was obtained.

[0276] The rotational viscosity of the solution was 29 mPa·s. Here, the rotational viscosity is a value measured at 25°C using an E-type viscometer (trade name: VISCONIC END, manufactured by Tokyo Keiki Co., Ltd.) (the same applies hereinafter).

[0277] The weight average molecular weight of the obtained polyester amic acid ...

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Abstract

In order to provide good adhesion to a substrate, flux resistance, solder resistance, and solvent resistance, this thermosetting resin composition contains a polyester amide acid (A), an epoxy compound (B) having a weight-average molecular weight of less than 10,000, and a copolymer (C) having oxiranyl or oxetanyl and having a weight-average molecular weight of 10,000 or more.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, a cured film obtained from the thermosetting resin composition, a substrate with a cured film having the cured film, and an electronic component having the cured film or a substrate with a cured film and an inkjet ink composition. Background technique [0002] In the manufacturing process of semiconductor packages, printed wiring boards, etc., the following operations are performed in order to protect the circuit patterns formed on the substrate, that is, a protective film called a cover film (cover lay) or solder resist (solder resist). The layer is coated on the circuit pattern. [0003] The specific functions of the protective layer are: to protect the electronic circuit from the influence of heat or moisture, to prevent oxidation and corrosion of the copper forming the circuit; to insulate and protect the circuit to prevent short circuit; to protect the circuit during the welding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40B41J2/01B41M5/00C08G73/10C08K3/04C08L63/00C09D11/30H05K3/28
CPCB41J2/01B41M5/00C08G59/40C08G73/10C08K3/00C08L63/00C09D11/30H05K3/28C08G59/42C08L79/08C08L33/068C08L33/14C08K3/04
Inventor 高桥敏行古田智嗣诸越信太
Owner JNC CORP
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