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Method for preparing IC equipment surface key part surface protective coating based on the plasma spraying and cold spraying technology

A protective coating and plasma technology, which is applied in the preparation of protective coatings on the surface of key parts of IC equipment and the preparation of ceramic coatings, can solve problems such as easy failure, achieve high deposition efficiency, excellent plasma erosion resistance and The effect of the protective effect

Pending Publication Date: 2019-11-19
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above-mentioned deficiencies existing in the prior art, the purpose of the present invention is to provide a method for preparing a protective coating on the surface of IC equipment key components based on plasma spraying and cold spraying technology, to solve the problem of the current IC equipment plasma etching chamber The problem that the protective coating is prone to failure in the high-power etching process is to try a new effective way to prepare a protective coating for the plasma etching chamber of IC equipment, in order to obtain practical application as soon as possible

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  • Method for preparing IC equipment surface key part surface protective coating based on the plasma spraying and cold spraying technology

Examples

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Effect test

Embodiment 1

[0031] In this embodiment, a protective coating on the inner surface of the plasma etching chamber of IC equipment is prepared on a 6061 aluminum alloy substrate. The specific method steps are as follows:

[0032] (1) Weigh 20g of pure Al powder, 160g of Y 2 o 3 Powder, dry for subsequent use after mixing; Weigh 300g high-purity (purity 99.99wt%) Y 2 o 3 powder, dry for later use.

[0033] (2) Micron-grade Al+Y mixed in step (1) 2 o 3 The powder is the raw material for spraying, and the plasma spraying technology is used to prepare Al+Y on the 6061 aluminum alloy substrate 2 o 3 The composite coating acts as a transition layer with a thickness of 150 μm.

[0034] (3) Al+Y obtained in step (2) by cold spray high-speed deposition technology 2 o 3 Deposit high-purity Y on the transition layer 2 o 3 Coating, about 180 μm thick.

[0035] Preparation of Al+Y 2 o 3 For the transition layer, the main gas used for plasma spraying is argon, the secondary gas is hydrogen, a...

Embodiment 2

[0039] In this embodiment, a protective coating on the inner surface of the plasma etching chamber of IC equipment is prepared on a 6061 aluminum alloy substrate. The specific method steps are as follows:

[0040] (1) Weigh 70g of pure Al powder, 150g of Y 2 o 3 Powder, dry for subsequent use after mixing; Weigh 200g high-purity (purity 99.99wt%) Y 2 o 3 powder, dry for later use.

[0041] (2) Micron-grade Al+Y mixed in step (1) 2 o 3 The powder is the raw material for spraying, and the plasma spraying technology is used to prepare Al+Y on the 6061 aluminum alloy substrate 2 o 3 The composite coating serves as a transition layer with a thickness of 120 μm.

[0042] (3) Al+Y obtained in step (2) by cold spray high-throughput deposition technology 2 o 3 Deposit high-purity Y on the transition layer 2 o 3 coating, about 170 μm thick.

[0043] Preparation of Al+Y 2 o 3 For the transition layer, the main gas used for plasma spraying is argon, the secondary gas is hydr...

Embodiment 3

[0047] In this embodiment, a protective coating on the inner surface of the plasma etching chamber of IC equipment is prepared on a 6061 aluminum alloy substrate. The specific method steps are as follows:

[0048] (1) Weigh 40g of pure Al powder, 120g of Y 2 o 3 Powder, dry for subsequent use after mixing; Weigh 400g high-purity (purity 99.99wt%) Y 2 o 3 powder, dry for later use.

[0049] (2) Micron-grade Al+Y mixed in step (1) 2 o 3The powder is the raw material for spraying, and the plasma spraying technology is used to prepare Al+Y on the 6061 aluminum alloy substrate 2 o 3 The composite coating serves as a transition layer with a thickness of 160 μm.

[0050] (3) Al+Y obtained in step (2) by cold spray high-speed deposition technology 2 o 3 Deposit high-purity Y on the transition layer 2 o 3 Coating, about 180 μm thick.

[0051] Preparation of Al+Y 2 o 3 For the transition layer, the main gas used for supersonic plasma spraying is argon, the secondary gas is...

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Abstract

The invention relates to a preparation technology of a ceramic coating, in particular to a method for preparing an IC equipment surface key part surface protective coating based on the plasma sprayingand cold spraying technology, and belongs to the field of plasma etching of a semiconductor integrated circuit chip (wafer). The plasma spraying and cold spraying high-speed deposition technology isadopted to form uniformly distributed protective coatings on the surface of an etching cavity of plasma. The protective coatings are of a two-layer composite structure, a metal / Y2O3 coating depositedby plasma spraying on the bottom layer is used as a transition layer, the difference in a thermal expansion coefficient between a ceramic coating and a metal substrate is reduced, and the bonding strength between the coating and the substrate is improved, the outermost layer is a high-purity Y2O3 ceramic coating, and Y2O3 ceramic powder is deposited on the metal / Y2O3 transition layer at a high speed by cold spraying high-speed deposition. A (metal / yttria) / yttria composite coating is obtained in order to achieve more excellent plasma corrosion resistance and protective effect.

Description

technical field [0001] The invention relates to a preparation technology of a ceramic coating, in particular to a method for preparing a protective coating on the surface of key components of IC equipment based on plasma spraying and cold spraying technology, and belongs to the field of plasma etching of semiconductor integrated circuit chips (wafers). Background technique [0002] In the etching manufacturing equipment of IC equipment (for example: equipment for manufacturing semiconductor materials and liquid crystal display screens), it is necessary to resist the etching effect of high-energy plasma. When the base material cannot meet the protection requirements, it can be prepared on the surface of the base material. Protective coatings to extend the service life of the material. High-purity alumina and high-purity yttrium oxide have been widely used as plasma erosion-resistant materials due to their excellent resistance to plasma erosion. The research on the relative p...

Claims

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Application Information

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IPC IPC(8): C23C4/134C23C4/06C23C24/08
CPCC23C4/134C23C4/06C23C24/085C23C24/04C23C4/067C23C4/11C23C4/12C23C28/321C23C28/3455C23C28/36C23C28/345H01J37/32495
Inventor 熊天英沈艳芳崔新宇王吉强唐俊榕李宁祁建中陶永山
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI