Modified phenolic resin and preparation method thereof
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A phenolic resin and modification technology, which is applied in coatings, electrical components, circuits, etc., can solve the problems of easy crystal points and particles, increase the cost of coatings, and high prices, and achieve good leveling agent and feel, and improve thermal stability. Stability, compatibility improvement effect
Inactive Publication Date: 2020-01-17
NANTONG BAICHUAN NEW MATERIAL CO LTD +1
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Problems solved by technology
[0005] At present, phenolic resin used as enameled wire enamel additives in the market can improve the scratch resistance and heat shock resistance of enameled wire to a certain extent, but the surface leveling performance of enameled wire is not very good, and crystal points and particles are prone to appear
And the price of this kind of phenolic resin in the market is high, adding it to the enameled wire paint as an additive increases the cost of the coating, which is not conducive to market competition
Method used
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Embodiment 1
[0033] Raw material preparation (by mass)
[0034]
[0035] Introduce nitrogen protection into the cleaned reaction device, add distilled water, paraformaldehyde, sodium hydroxide, and ethanol while stirring, and raise the temperature to 65°C while feeding, and keep warm at this temperature. After 30 minutes, the contents of the kettle clarify;
[0036] Turn on the cooling to lower the temperature of the kettle to 38°C, and gradually add ammonia water to the kettle at a constant speed for 20 minutes;
[0037] After the ammonia water was added dropwise, the raw material phenol was added after stirring for 15 minutes. The exothermic reaction raised the temperature of the kettle to a maximum of 78.2°C. After the temperature of the kettle remained stable, it began to manually raise the temperature to 92°C, and kept at this temperature for 2 hours;
[0038] After the heat preservation is over, turn on the cooling, lower the temperature of the kettle to 75°C and add salicylic ac...
Embodiment 2
[0044] Raw material preparation (by mass)
[0045]
[0046] Introduce nitrogen protection into the cleaned reaction device, add distilled water, paraformaldehyde, sodium hydroxide, and ethanol while stirring, and raise the temperature to 65°C while feeding, and keep warm at this temperature. After 30 minutes, the contents of the kettle clarify;
[0047] Turn on the cooling to lower the temperature of the kettle. The temperature of the kettle is 37.8°C and gradually add ammonia water to the kettle at a uniform speed. The dripping time is about 19 minutes;
[0048] After the dropwise addition of ammonia water is completed, the raw material phenol is added after stirring for 15 minutes. The exothermic reaction causes the temperature of the kettle to rise up to 77.5°C. After the temperature of the kettle remains stable, the temperature is manually raised to 92°C, and the temperature is kept at this temperature for 2 hours;
[0049] After the heat preservation is over, turn on ...
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Abstract
The invention relates to the field of chemical product preparation, particularly discloses a modified phenolic resin and a preparation method thereof. The preparation method comprises following steps:conveying distilled water, paraformaldehyde, sodium hydroxide and ethanol sequentially into a reaction kettle to be stirred, heated and subjected to heat preservation; after the heat preservation isfinished, cooling and dropwise adding a catalyst into the reaction kettle; after dropwise adding is finished, adding molten phenol and carrying out heating reaction; cooling after reaction, adding salicylic acid and m-cresol, carrying out first reduced-pressure dehydration, after dehydration, adding polydimethylsiloxane and tetrabutyl titanate, heating to carry out secondary reaction, reducing thekettle temperature after reaction, carrying out second reduced-pressure dehydration until the viscosity reaches a set range, and finally adding m-cresol to dilute and adjust the viscosity, thereby obtaining a modified phenolic resin solution; adding polydimethylsiloxane, so that the thermal stability and low-temperature flexibility of the phenolic resin are improved. Adding of the modified phenolic resin into varnished wires is capable of improving the scratch resistance and impact resistance of the varnished wires, and improving coating film surface leveling property, smoothness and gloss.
Description
technical field [0001] The invention relates to the field of preparation of chemical products, in particular to a modified phenolic resin and a preparation method thereof. Background technique [0002] Phenolic resin is one of the earliest synthesized high molecular polymers. It is formed by polycondensation of phenolic compounds and aldehyde compounds under the action of catalysts. It generates thermoplastic resins under the action of acidic catalysts and thermosetting resins under the action of alkaline catalysts. [0003] Phenolic resin can endow coatings with properties such as hardness, gloss, quick drying, water resistance, acid and alkali resistance, and insulation. It can be widely used in wood, furniture, construction, ships, machinery, electrical, and chemical corrosion resistance. It can also be added in Polyester (PE), heat-resistant polyester, polyesterimide (PEI) and other enameled wire enamel to improve the mechanical properties, heat resistance and electrical...
Claims
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