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A preparation method of graphene-boron nitride nanotube thermally conductive filler and oriented thermally conductive composite material

A boron nitride nanotube and thermally conductive composite material technology, applied in the field of composite materials, can solve problems such as poor thermal conductivity, and achieve the effects of reducing phonon scattering, improving thermal conductivity, and improving interlayer thermal conductivity

Active Publication Date: 2021-10-15
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The problem solved by the present invention is that the heat conduction effect between the existing graphene layers is not good

Method used

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  • A preparation method of graphene-boron nitride nanotube thermally conductive filler and oriented thermally conductive composite material
  • A preparation method of graphene-boron nitride nanotube thermally conductive filler and oriented thermally conductive composite material
  • A preparation method of graphene-boron nitride nanotube thermally conductive filler and oriented thermally conductive composite material

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preparation example Construction

[0029] An embodiment of the present invention provides a method for preparing a graphene-boron nitride nanotube thermally conductive filler, comprising the following steps:

[0030] Step S1, preparing an aqueous graphene solution;

[0031] Step S2, adding urea and boric acid into the graphene aqueous solution to react to obtain an intermediate product;

[0032] Step S3, calcining the intermediate product under a protective atmosphere to obtain a graphene-boron nitride nanotube thermally conductive filler (hereinafter referred to as EG-BN thermally conductive filler).

[0033] In this embodiment, the raw materials urea and boric acid used for the synthesis of boron nitride are mixed with graphene aqueous solution and then calcined. The boron nitride nanotubes grown in situ grow on the surface of graphene, and are connected with graphene by C-N bonds. The graphene and boron nitride nanotubes are connected by a covalent bond, which reduces the interfacial thermal resistance of t...

Embodiment 1

[0044] This embodiment provides a method for preparing a graphene-boron nitride nanotube thermally conductive filler, comprising the following steps:

[0045] 1.1 Electric strip 0.2g graphite foil at normal temperature and pressure, 10V voltage, in which the electrolyte is 0.1M (NH 4 ) 2 SO 4 Aqueous solution, after the electrostripping reaction is completed, the product is washed and dispersed in 70mL water, and ultrasonicated in an ice bath for 30min to obtain a graphene aqueous solution;

[0046] 1.2 Weigh 40g of urea and dissolve it in 100ml of water, add 1g of boric acid and stir at room temperature for 12h, add ultrasonic graphene aqueous solution and stir for 5h, centrifuge the obtained product at 10,000r for 10min, remove the supernatant, take the lower layer and dry it in vacuum at 70°C, get intermediate products;

[0047] 1.3 Calcinate the dried intermediate product at 900°C for 5 hours under a nitrogen atmosphere to obtain EG-BN thermally conductive filler.

Embodiment 2

[0049] This embodiment provides a method for preparing a graphene-boron nitride nanotube thermally conductive filler, comprising the following steps:

[0050] 2.1 Electro-peel 0.1g graphite foil at normal temperature and pressure, 10V voltage, in which the electrolyte is 0.1M (NH 4 ) 2 SO 4 Aqueous solution, after the electrostripping reaction is completed, the product is washed and dispersed in 70mL water, and ultrasonicated in an ice bath for 30min to obtain a graphene aqueous solution;

[0051] 2.2 Weigh 35g of urea and dissolve it in 100ml of water, add 0.8g of boric acid and stir at room temperature for 12h, add ultrasonic graphene aqueous solution and stir for 5h, the obtained product is centrifuged at 10000r for 10min, remove the supernatant, and take the lower layer and dry it under vacuum at 70°C , to get the intermediate product;

[0052] 2.3 Calcinate the dried intermediate product at 900°C for 5 hours under a nitrogen atmosphere to obtain EG-BN thermally conduct...

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Abstract

The invention discloses a preparation method of graphene-boron nitride nanotube thermally conductive filler and an orientational thermally conductive composite material. The preparation method of the graphene-boron nitride nanotube thermally conductive filler comprises the following steps: step S1, preparing graphene Aqueous solution; step S2, adding urea and boric acid into the graphene aqueous solution to react to obtain an intermediate product; step S3, calcining the intermediate product under a protective atmosphere to obtain a graphene-boron nitride nanotube thermally conductive filler. The boron nitride nanotubes in the graphene-boron nitride nanotube thermally conductive filler prepared by the present invention are grown on the surface of graphene in situ, and are covalently connected with graphene by C-N bonds, which reduces the interface of graphene Thermal resistance improves the interlayer thermal conduction of graphene, doping it into the polymer matrix as a filler, and the hot pressing technology can improve the interface bonding ability between the thermally conductive filler and the polymer matrix, reduce the phonon scattering at the interface, and effectively Improve thermal conductivity of composite materials.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a method for preparing a graphene-boron nitride nanotube thermally conductive filler and an oriented thermally conductive composite material. Background technique [0002] With the rapid development of electronic technology, electronic products have experienced significant miniaturization and high power densification, and electronic devices integrate functions into small components. As the working efficiency of electronic products becomes higher and higher, the heat generated by electronic components increases and the temperature rises sharply. High temperature not only affects the stability of electronic products, but also has a negative effect on the service life. In severe cases, it will cause equipment damage or even danger. Therefore, it is necessary to use composite materials with excellent thermal conductivity to remove heat from electronic products in time to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K9/00C08K7/00C08K3/04C08K3/38C08L27/16C08L63/00
CPCC08K3/38C08K7/00C08K9/00C08K2003/385C08K2201/011C08K3/042C08L27/16C08L63/00
Inventor 钱家盛李旭伍斌杨斌夏茹曹明
Owner ANHUI UNIVERSITY