Formula of monocrystalline silicon texturing additive containing polyol and PEG
A technology of additives and polyols, applied in the directions of single crystal growth, single crystal growth, polycrystalline material growth, etc., can solve the problems of poor surface uniformity of silicon wafers, poor texture stability, and unsatisfactory texture effects, etc., to achieve Improved texturing effect, improved photoelectric conversion efficiency, and excellent texturing effect
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Embodiment 1
[0027] Take the following steps in the texturing process: 1) Preparation of additives: use 1L of deionized water as a solvent, add 8.0g of MPD, 15.0g of PEG 400, 1.0g of sodium phenylacetate, and 3.0g of NaCl to fully dissolve; 2) Preparation of texturing solution: 1 L Add 35.0mL of NaOH solution with a concentration of 30% by weight in deionized water, and add 14.0mL of additives to obtain an alkaline texturing solution; 3) Clean the cut monocrystalline silicon wafers in a pre-cleaning solution at 65°C for 5 minutes Finally, wash with deionized water, and then immerse the monocrystalline silicon wafer in the texturing solution, the temperature of the texturing solution is 78 ° C, and the texturing time is 15 minutes; 4) Dip the monocrystalline silicon wafer after texturing in deionized water for cleaning 1.5 min, then wash with mixed acid for 6 min; 5) soak the pickled monocrystalline silicon wafer in deionized water for 1.5 min, then dip in 85°C deionized water and slowly pul...
Embodiment 2
[0029]Take the following steps in the texturing process: 1) Additive preparation: use 1L of deionized water as a solvent, add 12.0g of 1,2-propanediol, 20.0g of PEG600, 2.0g of sodium isophthalate, and 2.0g of KCl to fully dissolve; 2) Texture making Liquid preparation: Add 38.0 mL of 30% NaOH solution by weight to 1 L of deionized water, and add 12.0 mL of additives to obtain alkaline texturing liquid; After washing in the cleaning solution for 5 minutes, wash it with deionized water, and then immerse the monocrystalline silicon wafer in the texturing solution. The temperature of the texturing solution is 82 ° C, and the texturing time is 13 minutes; Wash in deionized water for 1.5 min, and then wash with mixed acid for 8 min; 5) Dip the acid-washed monocrystalline silicon wafer in deionized water for 1.5 min, then dip in deionized water at 85°C and slowly pull it out. The finished product was dried in a drying oven at 65°C for 3 hours to obtain a textured monocrystalline sil...
Embodiment 3
[0031] Take the following steps in the texturing process: 1) Additive preparation: with 1L deionized water as solvent, add 1,4-butanediol 15.0g, PEG800 20.0g, sodium benzoate 3.0g, Na 2 SO 4 2.0g fully dissolved; 2) preparation of texturing solution: add 40.0mL of NaOH solution with a concentration of 30% by weight in 1 L of deionized water, and add 16.0mL of additives to obtain alkaline texturing solution; 3) the cut single The crystalline silicon wafer was cleaned in a pre-cleaning solution at 65°C for 5 minutes, and then washed with deionized water, and then the monocrystalline silicon wafer was immersed in the texturing solution. The temperature of the texturing solution was 85°C, and the texturing time was 14 minutes; 4) the The monocrystalline silicon wafers after texturing were soaked in deionized water for 1.5 min, and then washed with mixed acid for 6 min; Slowly pull it out in deionized water, and dry the finished product in a drying oven at 65°C for 3 hours to obt...
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