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Magnetron cathode assembly and silicon-molybdenum solder integrated preparation method

A magnetron cathode and solder technology, which is used in electrode assembly manufacturing, thermionic cathode manufacturing, metal processing equipment, etc. The effect of automated production, stable production process and quality, and cost reduction

Inactive Publication Date: 2020-05-08
佛山市海欣光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional way of adding solder is: (1) first clamp the thoriated tungsten filament between the upper end cap and the lower end cap of the support assembly, then manually apply the solder on the contact between the upper and lower end caps and the thoriated tungsten filament, after high frequency welding Form a combination; due to manual operation, it is difficult to control the amount of solder added in this way, and the quality stability is poor on the other hand
(2) Press the solder into a solder ring and add it into the groove of the upper and lower end caps. After sintering and combining with the end cap, clamp the thoriated tungsten filament for high-frequency welding to form a weld; add solder according to this process. On the one hand, the solder ring is Thin-walled structure, difficult to suppress, in addition, the strength of the solder ring is low, it will inevitably cause breakage during operation and affect product quality
At present, the mainstream used solder systems are: ruthenium-molybdenum-nickel ternary system and ruthenium-molybdenum binary system, both of which contain rare and precious metal ruthenium, and the production cost is high

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Embodiment approach

[0014] A preparation method for the integration of magnetron cathode assembly and silicon-molybdenum solder, the steps are as follows: (1) material selection and proportioning: molybdenum powder with an average particle size of 3 μm and silicon powder with an average particle size of 1 μm are selected as solder raw materials, Weigh 10g of silicon powder and 100g of molybdenum powder according to the weight ratio of 1:10; (2) Grinding and mixing: add the powder with a good proportion to the planetary ball mill for grinding for 36 hours, the ball milling medium is agate ball, the weight is 1.2kg, the ball The material ratio is 10:1, the ball milling atmosphere is Ar, and the ball milling speed is set at 380r / min. (3) Sieving: After grinding, sieve the powder and grinding balls, pass the powder through a 300-mesh sieve, and take the sieve for use. The entire operation process must be carried out under vacuum or argon protection to prevent powder Oxidation occurs when exposed to a...

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Abstract

The invention discloses a magnetron cathode assembly and silicon-molybdenum solder integrated preparation method, and the method is characterized by comprising the following steps: (1) selecting materials and performing proportioning; (2) performing grinding and uniform mixing; (3) performing screening; (4) preparing an organic carrier; (5) preparing silicon-molybdenum solder slurry; (6) performing coating; (7) performing presintering; (8) performing high-temperature sintering; (9) performing welding. The preparation method is simple in production process, low in cost and easy to realize automation.

Description

technical field [0001] The invention relates to the combined field of powder metallurgy and fine chemical industry, in particular to a preparation method for the integration of magnetron cathode assembly and silicon-molybdenum solder. Background technique [0002] The core part of the magnetron is the cathode part, which mainly consists of thoriated tungsten filament and molybdenum support; as the heating body for microwave emission, its temperature is the highest. However, the melting point of the thoriated tungsten filament and the molybdenum support exceeds 2600°C, and there is currently no process for direct butt welding, and the closed-circuit combination must be completed by brazing with intermediate solder. The brazing process of the thoriated tungsten filament and the end cap of the molybdenum support is to clamp the filament between the upper end cap and the lower end cap of the support component through a clamp, and melt the solder through high-frequency heating, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J9/04H01J9/18B22F1/00B22F3/10B22F7/08
CPCH01J9/04H01J9/18B22F7/08B22F3/1007B22F3/1021B22F1/10
Inventor 何达强
Owner 佛山市海欣光电科技有限公司
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