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Polymer electromagnetic shielding composite foam with gradient filler structure and preparation method thereof

A technology of electromagnetic shielding and composite foam, applied in the direction of magnetic field/electric field shielding, electrical components, etc., can solve the problems of increasing material preparation cost and processing difficulty, limiting application, and increasing the overall density of composite materials, so as to broaden potential application areas and reduce Density, low cost effect

Active Publication Date: 2020-05-12
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to obtain good electromagnetic shielding performance, it is generally necessary to add a large amount of conductive fillers to the polymer matrix, which will lead to an increase in the overall density of the composite material, and increase the cost of material preparation and processing difficulty, which greatly limits its application in aerospace, Applications in transportation, precision instrument electronics, new generation communication technology and other fields
At present, there is no research report on the preparation of polymer electromagnetic shielding composite foam with gradient packing structure by high-pressure gas foaming technology

Method used

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  • Polymer electromagnetic shielding composite foam with gradient filler structure and preparation method thereof
  • Polymer electromagnetic shielding composite foam with gradient filler structure and preparation method thereof
  • Polymer electromagnetic shielding composite foam with gradient filler structure and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] A preparation method of polymer electromagnetic shielding composite foam with gradient filler structure, comprising the following steps:

[0031] (1) Preparation of conductive metal-loaded hollow glass microspheres

[0032] Add 2g of hollow glass microspheres to 20mL of dilute sulfuric acid, mechanically stir for 10min, wash with distilled water, then filter with suction, then treat and wash with stannous chloride, and finally add the product to 10mL of electroless tungsten plating solution (sodium tungstate 20g / L, sodium hypophosphite 20g / L), add dropwise the mixed solution that sodium citrate and ammonium sulfate are formed, the concentration of sodium citrate in the mixed solution is 20g / L, the concentration of ammonium sulfate is 50g / L, machine React for 5 minutes under the condition of stirring, wash, filter with suction, and dry to obtain metal tungsten-loaded hollow glass microspheres.

[0033] (2) Preparation of glass microsphere-epoxy resin composite body

[...

Embodiment 2

[0038] A preparation method of polymer electromagnetic shielding composite foam with gradient filler structure, comprising the following steps:

[0039] (1) Preparation of conductive metal-loaded hollow glass microspheres

[0040] Add 2g of hollow glass microspheres to 50mL of dilute sulfuric acid, mechanically stir for 30min and wash with distilled water, then suction filter, then treat and wash with sensitization solution, and finally add the product to 50mL of electroless iron plating solution (iron sulfate 15g / L , gentiobiose 2g / L), a sodium borohydride solution with a concentration of 1.5g / L was added dropwise, reacted for 1h under the condition of mechanical stirring, washed, suction filtered, and dried to obtain metal iron-loaded hollow glass microspheres.

[0041] (2) Preparation of glass microsphere-polyethylene composite body

[0042] Add 10 g of polyethylene into the trichlorethylene solvent, heat and mechanically stir to fully dissolve the polyethylene, then add 2...

Embodiment 3

[0046] A preparation method of polymer electromagnetic shielding composite foam with gradient filler structure, comprising the following steps:

[0047] (1) Preparation of conductive metal-loaded hollow glass microspheres

[0048] 2g of hollow glass microspheres were added to 80mL of dilute sulfuric acid, mechanically stirred for 1h and washed with distilled water, then suction filtered, then treated with stannous chloride and washed, and finally the product was added to 100mL of electroless aluminum plating solution (aluminum chloride 5g / L, sodium hypophosphite 25g / L), dropwise adding a lithium hydride solution with a concentration of 1g / L, reacted for 2h under the condition of mechanical stirring, washed, suction filtered, and dried to obtain metal aluminum-loaded hollow glass microspheres.

[0049] (2) Preparation of glass microsphere-polyphenylene sulfide composite body

[0050] Add 10 g of polyphenylene sulfide to the α-chloronaphthalene solvent, raise the temperature a...

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Abstract

The invention discloses polymer electromagnetic shielding composite foam with a gradient filler structure and a preparation method thereof. The preparation method comprises the following steps: loading conductive metal on the hollow glass microspheres to obtain low-density conductive particles; then preparing a conductive particle-polymer composite material; and finally, foaming the composite material to obtain the electromagnetic shielding composite foam. By adopting the method disclosed by the invention, the filler consumption of the electromagnetic shielding composite material can be effectively reduced, and the electric conduction and electromagnetic shielding efficiency of the composite foam is improved, so that the prepared foam material has good electric conduction and electromagnetic shielding properties under the condition of low electric conduction filler content.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic shielding materials, and in particular relates to a polymer electromagnetic shielding composite foam with a gradient filler structure and a preparation method thereof. Background technique [0002] With the development of the electronic industry and the high application of electronic equipment, the use of various communication equipment and electronic components is becoming more and more common, and their wide use provides many conveniences for people's daily life. However, these electronic devices will inevitably produce a large amount of electromagnetic wave radiation when they are used. Electromagnetic radiation is considered to be the fourth largest type of pollution after water pollution, noise pollution, and air pollution. Electromagnetic interference caused by electromagnetic radiation will not only affect The normal operation of communication facilities, hospital instruments, and a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/12C08J9/14C08L63/00C08L23/06C08L81/02C08L75/04C08L83/04C08L81/06C08K9/12C08K3/08H05K9/00
CPCC08J9/0066C08J9/009C08J9/122C08J9/141C08J9/145C08J9/147C08J2203/06C08J2203/14C08J2203/142C08J2203/144C08J2323/06C08J2363/00C08J2375/04C08J2381/02C08J2381/06C08J2383/04H05K9/0081
Inventor 廖霞杨建明周荣涛王圭郭富民李光宪
Owner SICHUAN UNIV
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