The present application belongs to the technical field of
polymer porous foaming material and
semiconductor precision cleaning
consumables, and particularly relates to a PVA porous foaming material, a preparation method and a
semiconductor wafer cleaning
brush. The preparation method provided by the present application does not need to use
solid particle pore-forming medium,
polyvinyl alcohol is dissolved in water to form a glue solution, a surfactant and an acidic catalyst are added to adjust pH and filter,
inert gas is introduced for foaming, a
formaldehyde solution is added, and the product is obtained through gradient temperature solidification, demolding cleaning and
drying. The PVA porous foaming material prepared by the present application has a regular and uniform multi-stage pore structure, the main foam holes are nearly spherical and interconnected to form a three-dimensional
network structure. The prepared
semiconductor wafer cleaning
brush has excellent hydrophilicity, flexibility, high elasticity and high rebound characteristics, no particle
precipitation and debris shedding occur in the use process, can meet the ultra-high cleanliness requirement of high-end semiconductor processes, simultaneously simplifies the production process, reduces the
environmental protection cost, and has a good industrial application prospect.