Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fluorine-containing resin mixture and copper-clad plate prepared from same

A fluorine-containing resin and mixture technology, applied in synthetic resin layered products, adhesive types, adhesive additives, etc., can solve the problem of uneven dielectric properties, mechanical properties and thermal expansion coefficients of copper clad laminates The interaction force of foil is not high and the viscosity of fluorine-containing resin emulsion is low, so as to achieve the effect of good adhesion, meeting performance requirements and smooth surface

Active Publication Date: 2020-05-15
ALLSTAE TECH ZHONGSHAN
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is the great chemical inertness of the fluorine-containing resin that causes the interaction force between the fluorine-containing resin and the copper foil to be low. Huge, and the viscosity of the fluorine-containing resin emulsion is low, and it is easy to fall off the film after drying, resulting in serious inhomogeneity in the dielectric properties, mechanical properties and thermal expansion coefficient of the copper clad laminate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fluorine-containing resin mixture and copper-clad plate prepared from same
  • Fluorine-containing resin mixture and copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0024] The preparation method of the fluorine-containing resin emulsion in this application can be any one well-known to those skilled in the art, for example, the fluorine-containing resin is uniformly dispersed in N-methylpyrrolidone, and the solid content can be adjusted according to the amount of raw materials, and can also be added appropriately Dispersants improve emulsion stability.

[0025] Prepolymers of thermoplastic polymers

[0026] In some preferred embodiments, the prepolymer main chain of the thermoplastic polymer contains ether groups; more preferably, the prepolymer main chain of the thermoplastic polymer contains ether groups and bisphenol A structure ; Furthermore, the main chain of the prepolymer of the thermoplastic polymer contains ether groups and bisphenol A structure, and the main chain or side chain also contains ester groups.

[0027] The ether group structure in the present application can exemplify the molecular structure in formula 1, the bisph...

Embodiment 1

[0054] Example 1 provides a fluorine-containing resin mixture, which includes 114 parts of fluorine-containing resin emulsion, 12 parts of thermoplastic polymer prepolymer, and 2 parts of cyanate ester in parts by weight.

[0055] The fluorine-containing resin in the fluorine-containing resin emulsion is polytetrafluoroethylene, produced by AGC, and the brand is EA2000; the solid content of the fluorine-containing resin emulsion is 40 wt%, and the solvent is N-methylpyrrolidone.

[0056] The main chain of the prepolymer of the thermoplastic high polymer contains ether group and bisphenol A structure, and the side chain contains ester group; the solid content of the prepolymer of the thermoplastic high polymer is 20 wt%.

[0057] The prepolymer of the thermoplastic polymer is in parts by weight, and its formula is as follows: 756 parts of BAPP, 105 parts of APAB, 569 parts of ODPA, and 100 parts of PMDA. The above raw materials are all produced by Wakayama Seika Industry Co., Lt...

Embodiment 2

[0063] Embodiment 2 provides a fluorine-containing resin mixture, which is the same as Embodiment 1.

[0064] This example also provides a copper clad laminate, which is different from Example 1 in that the film substrate is an LCP film.

[0065] This example also provides a method for preparing the above-mentioned copper clad laminate, which is similar to Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Peel strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a fluorine-containing resin mixture. The fluorine-containing resin mixture at least comprises a fluorine-containing resin emulsion, a prepolymer of a thermoplastic polymer, andcyanate ester. The mixture can be well coated and attached to a film base material, good dimensional stability can be kept in the processing process, and the water absorption rate is low. Besides, the invention further discloses a copper-clad plate prepared from the fluorine-containing resin mixture, and the copper-clad plate has the characteristics of excellent dielectric property, relatively high peel strength, good dimensional stability and the like, and can meet various comprehensive performance requirements on a substrate material in the field of 5G high-frequency communication.

Description

technical field [0001] The invention relates to the field of communication materials, in particular to a fluorine-containing resin mixture and a copper-clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, vending machines, communication base stations, satellites, wearable devices, unmanned vehicles, drones and intelligent robots, and are one of the key basic materials for the electronic communication and information industries. Under the trend of 5G, the requirements for communication frequency and network bandwidth are increasing. The performance bottleneck of traditional copper clad laminates can no longer meet the current development direction. However, the performance improvement of copper clad laminates depends to a large extent on the choice of resin. Resin puts forward higher requirements, such as high heat resistance, low water absorption, low dielectric, good weather resistance, green envi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J127/18C09J201/06C09J11/04C09J129/10C09J123/08B32B7/12B32B15/08B32B15/20B32B27/28
CPCC09J127/18C09J11/04C09J129/10C09J123/0892B32B15/08B32B15/20B32B7/12B32B27/281B32B27/28C08L101/06C08K5/29
Inventor 徐莎刘成河王洋
Owner ALLSTAE TECH ZHONGSHAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com