A nanoscale Ag-Sno for improved silver electromigration 2 Solder paste preparation method and its application

A technology of ag-sno2 and nano-soldering, which is applied in the direction of welding equipment, circuits, manufacturing tools, etc., can solve problems such as the service temperature of nano-silver high-cost tin solder paste sintering materials, and achieve reduced electromigration, reduced content, and low cost Effect

Active Publication Date: 2021-08-17
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention solves the high cost of nano-silver prepared by the existing method and the service temperature problem of tin solder paste sintered materials and provides a nano-Ag-SnO nanometer that improves silver electromigration. 2 Solder paste preparation method, comprising the following preparation steps:

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] S1. the tin oxide particle that size is 25nm is fully mixed with diluent to obtain the first mixture, and the mass percent of the mixture of tin oxide and diluent is 6%; S2. size is 25nm nano-silver particle and diluent (terpineol With ethanol), binding agent (polyvinyl alcohol), surfactant (fatty acid glyceride) mixes and obtains the second mixed solution; S3. the first mixture is added in the second mixed solution, and the mass of the first mixture accounts for The mass percentage of the total mass of the first mixture and the second mixture is 6%, the stirring speed is 1500r / min, and the Ag-SnO is prepared by centrifugation 2 Nano solder paste, its conductivity is 125±10W / mK.

Embodiment 2

[0037] S1. the tin oxide particle that size is 25nm is fully mixed with diluent to obtain the first mixture, and the mass percent of the mixture of tin oxide and diluent is 6%; S2. size is 25nm nano-silver particle and diluent (terpineol With ethanol), binding agent (polyvinyl alcohol), surfactant (fatty acid glyceride) mixes and obtains the second mixed solution; S3. the first mixture is added in the second mixed solution, and the mass of the first mixture accounts for The mass percentage of the total mass of the first mixture and the second mixture is 15%, the uniform stirring speed is 1500r / min, and Ag-SnO is prepared by centrifugation 2 Nano solder paste, its thermal conductivity is 125±10W / mK.

Embodiment 3

[0039] S1. the tin oxide particle that size is 25nm is fully mixed with diluent to obtain the first mixture, and the mass percent of the mixture of tin oxide and diluent is 6%; S2. size is 25nm nano-silver particle and diluent (terpineol With ethanol), binding agent (polyvinyl alcohol), surfactant (fatty acid glyceride) mixes and obtains the second mixed solution; S3. the first mixture is added in the second mixed solution, and the mass of the first mixture accounts for The mass percentage of the total mass of the first mixture and the second mixture is 30%, the uniform stirring speed is 1500r / min, and Ag-SnO is prepared by centrifugation 2 Nano solder paste, its thermal conductivity is 125±10W / mK.

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Abstract

The present invention provides a nano-Ag-SnO that improves silver electromigration 2 The solder paste preparation method and its application include the following preparation steps: S1. fully mixing the tin oxide particles with a diluent to obtain the first mixture; S2. mixing the nano-silver particles with the diluent, binder, and surfactant to obtain the second mixture. Two mixtures; S3. Add the first mixture to the second mixture, stir evenly, and centrifuge to obtain Ag-SnO 2 nano solder paste. By adding tin oxide to change the oxygen partial pressure of nano-silver interconnect materials, reduce the occurrence of electromigration; the Ag generated by silver and tin atoms 3 Sn hinders silver electromigration, thereby prolonging the service life of electronic packaging and interconnection materials; the invention has simple technological process, low cost and is suitable for industrial application.

Description

technical field [0001] The invention relates to the field of advanced materials for interconnection of electronic packaging chips, in particular to a nano-Ag-SnO that improves silver electromigration 2 Solder paste preparation method and its application. Background technique [0002] With the rapid development of electronic science and technology, people's requirements for the performance of electronic power devices are constantly improving. Wide bandgap semiconductor power chips such as silicon carbide (SiC) and gallium nitride (GaN) have been rapidly developed due to their advantages in high temperature, high power or high heat dissipation applications. However, the high temperature conditions (higher than 250°C) of its work pose a great challenge to the traditional packaging process. Therefore, it is particularly important to study the chip interconnect level packaging of wide bandgap semiconductor power devices for their application at high temperatures, which requires...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/14B23K35/30B23K1/00
CPCB23K1/00B23K35/025B23K35/3006B23K2101/36B23K2101/40
Inventor 陈静刘盼张靖叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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