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Grinding wheel for grinding electronic package substrate material and preparation method thereof

A technology for electronic packaging and grinding wheels, applied in grinding/polishing equipment, grinding devices, bonded grinding wheels, etc., can solve the problems of workpieces with high wear marks, difficult grinding wheels, and unqualified surface quality, so as to improve production and processing Efficiency and yield, good surface quality of the workpiece, and less dressing times

Active Publication Date: 2021-11-09
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the grinding process of the current grinding wheel, there are defects such as easy sticking of chips, deep scratches on the workpiece, high wear mark rate (10% to 20%), unqualified surface quality of the workpiece, and difficult dressing of the grinding wheel. Therefore, it is urgent to develop a new A new type of grinding wheel suitable for grinding electronic packaging substrate materials to meet market demand

Method used

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  • Grinding wheel for grinding electronic package substrate material and preparation method thereof
  • Grinding wheel for grinding electronic package substrate material and preparation method thereof
  • Grinding wheel for grinding electronic package substrate material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In the above-mentioned grinding wheel for grinding electronic packaging substrate materials, the abrasive layer is specifically composed of the following raw materials in weight percentage: 10-16 μm diamond abrasive 44%, bonding agent 16.2%, 20 μm black silicon carbide 19%, 10 μm aluminum borate whiskers 3% (aspect ratio 5), 20μm cobalt blue 11.8%, temporary wetting agent phenolic resin solution 6%. The binder is composed of the following raw materials in weight percentage: clay powder 15%, feldspar powder 25%, boron glass powder 40%, Li 2 o 2 5%, SiO 2 15%.

[0032] The preparation method of the above-mentioned grinding wheel for grinding electronic packaging substrate materials specifically includes the following steps:

[0033] (1) Take the raw materials of the binder in proportion, ball mill the binder for 24 hours to obtain particles with a size of 8-10 μm, and set aside;

[0034] (2) Mix diamond abrasives, silicon carbide and 2% temporary wetting agent, then...

Embodiment 2

[0042]A grinding wheel for grinding electronic packaging substrate materials, the abrasive layer is specifically composed of the following raw materials in weight percentage: 8-12 μm titanium-plated diamond abrasive 60%, bonding agent 10%, 10 μm black silicon carbide 12%, 6 μm aluminum borate Whisker 3% (length-to-diameter ratio 7), 5μm cobalt blue 10%, temporary wetting agent dextrin 5%. The binder is composed of the following raw materials in weight percentage: clay powder 25%, feldspar powder 15%, boron glass powder 39%, Li 2 o 2 3%, SiO 2 18%.

[0043] The preparation method of the above-mentioned grinding wheel for grinding electronic packaging substrate materials specifically includes the following steps:

[0044] (1) Take the raw materials of the binder in proportion, ball mill the binder for 48 hours, and the particle size of the obtained particles is 5-8 μm, and set aside;

[0045] (2) to (5) steps refer to Example 1;

[0046] (6) Spread 10mm thick sand (20-mesh ...

Embodiment 3

[0050] A grinding wheel for grinding electronic packaging substrate materials. The abrasive layer is specifically composed of the following raw materials in weight percentage: 24% of 6-8μm diamond abrasive, 20% of 6-8μm nickel-plated diamond abrasive, 10% of bonding agent, and 5μm black Silicon carbide 22%, 3μm aluminum borate whiskers 5% (aspect ratio 10), 12μm cobalt blue 10%, temporary wetting agent phenolic resin solution 9%. The binder is composed of the following raw materials in weight percentage: clay powder 5%, feldspar powder 25%, boron glass powder 60%, Li 2 o 2 1%, SiO 2 9%.

[0051] The preparation method of the above-mentioned grinding wheel for grinding electronic packaging substrate materials specifically includes the following steps:

[0052] (1) Take the raw materials of the binder in proportion, ball mill the binder for 72 hours, and the particle size of the obtained particles is 2.5-5 μm, and set aside;

[0053] (2) to (5) steps refer to Example 1;

[...

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Abstract

The invention relates to a grinding wheel for grinding an electronic package substrate material. The grinding wheel consists of a base body and an abrasive layer. The end face of the base body is evenly spaced with a plurality of arc segments along the circumferential direction, and the arc segments form the abrasive layer. . Both ends of the arc segment block are arc structures. The abrasive layer is composed of the following raw materials by weight percentage: 10-16.2% of binder, 12-22% of silicon carbide, 3-5% of aluminum borate whiskers, 10-15% of cobalt blue, and 6-9% of temporary wetting agent , the remainder is abrasive. The grinding wheel can effectively reduce the probability of deep scratches occurring at the moment of cutting into the grinding wheel when the grinding wheel is fed. It has the advantages of high grinding efficiency, less dressing times and good surface quality of the workpiece. The grinding rate of the workpiece can be reduced to less than 5%. , which greatly improves the processing efficiency.

Description

technical field [0001] The invention belongs to the technical field of mechanical manufacturing and processing, and in particular relates to a grinding wheel for grinding electronic packaging substrate materials and a preparation method thereof. Background technique [0002] With the improvement of modern electronic information technology, electronic products have been developed in the direction of miniaturization, portability and multi-function. Electronic packaging substrate materials are playing an increasingly important role in the new generation of electronic packaging materials. Common electronic packaging substrate materials include composite materials such as ceramic base, metal base, and polymer base. Due to different requirements for the penetration of the electronic identification module and the warpage of the substrate, the electronic packaging substrate needs to be ground and thinned. During the grinding process, the current grinding wheel has defects such as ea...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D3/18B24D7/06B24D18/00
CPCB24D3/18B24D7/06B24D7/066B24D18/0009
Inventor 熊华军赵延军丁玉龙惠珍吴武山苗卫朋
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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