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Modification method of ultrafine composite silica powder for high-end copper-clad plate

A technology of silicon micropowder and copper clad laminate, which is applied in the field of modification of ultrafine composite silicon micropowder for high-end copper clad laminate, which can solve the problem of poor compatibility of organic polymer resins, which affects product reliability and stability, heat resistance and moisture resistance. Variation and other problems, achieve good compatibility, reduce expansion coefficient, and improve water absorption

Inactive Publication Date: 2020-06-19
江苏海格新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, silicon micropowder for copper-clad laminates has the following problems: silicon micropowder is an inorganic filler, which has poor compatibility with organic polymer resins and is difficult to disperse when mixed and used, resulting in the use of traditional silicon micropowder-filled integrated circuit packages and substrates. Poor heat resistance and moisture resistance, which affects product reliability and stability

Method used

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  • Modification method of ultrafine composite silica powder for high-end copper-clad plate
  • Modification method of ultrafine composite silica powder for high-end copper-clad plate
  • Modification method of ultrafine composite silica powder for high-end copper-clad plate

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Experimental program
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Effect test

Embodiment 1

[0020] (1) SiO 2 Quartz fragments with a content higher than 99% and quartz sand of about 0.5 mm are put into a continuously operating ball mill at a mass ratio of 5:1, and the grinding medium is alumina balls (0.1-1.0 mm). Adjust the induced air flux at about 15,000 cubic meters per hour, and separate and obtain large-particle silicon micropowder with uneven particle size distribution through high-speed classifier. Pass through a 150 micron protection sieve to obtain a 1-3 micron horn-shaped silicon micropowder coarse powder, D100<10 micron.

[0021] (2) Pour 1 to 3 micron angular silicon micropowder coarse powder into a reaction vessel filled with a mixture of natural gas and oxygen, ignite, melt and spheroidize.

[0022] (3) Choose spheroidized silicon micropowder, 4-aminobutyltriethoxysilane and hexamethyldisilazane in step 2 to mix with anhydrous chloroform at a mass ratio of 1:0.002:0.01, and react at 100°C for 12 Hours, cooled, centrifuged, washed 3 times with chlorof...

Embodiment 2

[0024] (1) SiO 2 Quartz fragments with a content higher than 99% and quartz sand of about 0.5 mm are put into a continuously operating ball mill at a mass ratio of 5:1, and the grinding medium is alumina balls (0.1-1.0 mm). Adjust the induced air flux at about 10,000 cubic meters per hour, and separate and obtain large-particle silicon micropowder with uneven particle size distribution through high-speed classifier. Pass through a 100-micron protective sieve to obtain a 1-3 micron angular silicon micropowder coarse powder, D100<10 micron.

[0025] (2) Pour 1 to 3 micron angular silicon micropowder coarse powder into a reaction vessel filled with a mixture of natural gas and oxygen, ignite, melt and spheroidize.

[0026] (3) Choose spheroidized silicon micropowder, 3-aminopropyltriethoxysilane and hexamethyldisilazane in step 2 and mix them in anhydrous chloroform at a mass ratio of 1:0.01:0.01, and react at 120°C for 12 Hours, cooled, centrifuged, washed 3 times with chlorof...

Embodiment 3

[0028] (1) SiO 2 Quartz fragments with a content higher than 99% and quartz sand of about 0.5 mm are put into a continuously operating ball mill at a mass ratio of 5:1, and the grinding medium is alumina balls (0.1-1.0 mm). Adjust the induced air flux at about 12,000 cubic meters per hour, and separate and obtain large-particle silicon micropowder with uneven particle size distribution through high-speed classifier. Pass through a 130-micron safety sieve to obtain 1-3 micron horn-shaped silicon micropowder coarse powder, D100<10 micron.

[0029] (2) Pour 1 to 3 micron angular silicon micropowder coarse powder into a reaction vessel filled with a mixture of natural gas and oxygen, ignite, melt and spheroidize.

[0030] (3) Choose spheroidized silicon micropowder, 6-aminohexyltriethoxysilane and hexamethyldisilazane in step 2 and mix them in anhydrous chloroform at a mass ratio of 1:0.03:0.01, and react at 130°C for 4 hours , cooled and then centrifuged, washed three times wit...

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Abstract

The invention relates to a modification method of ultrafine composite silica powder for a high-end copper-clad plate, which comprises the following steps: 1, putting quartz fragments and quartz sand into a continuous running ball mill according to a mass ratio of 5: 1, taking alumina balls as grinding mediums, adjusting the induced air flux to be 10,000-15,000 cubic meters per hour, separating through a high-speed classifier to obtain large-particle silicon micropowder with non-uniform particle size distribution, and passing through a guarantee sieve to prepare angular silica powder coarse powder with the particle size of 1-3 microns, 2, pouring the 1-3-micron angular silica powder coarse powder into a reaction container and carrying out igniting, melting and spheroidizing, and 3, mixing the spheroidized silica powder, aminotriethoxysilane and hexamethyldisilazane in the step 2 in anhydrous chloroform according to a mass ratio of 1: 0.002-0.03: 0.01, reacting at 100-130 DEG C for 4-24hours, cooling, carrying out centrifugal separation, and carrying out vacuum drying to obtain the modified ultrafine silica powder. According to the invention, the compatibility of the silica powder and the phenolic resin is effectively enhanced in the processing process of the copper-clad plate.

Description

technical field [0001] The invention belongs to the field of materials for manufacturing integrated circuits, and in particular relates to a method for modifying ultrafine composite silicon micropowder for high-end copper-clad laminates. Background technique [0002] As more and more electronic information products in our country gradually rank in the forefront of the world, the integrated circuit market in my country continues to grow. As an important epoxy molding compound filler for integrated circuit packaging, composite silicon micropowder has a huge market space. At present, silicon for copper clad laminates The market demand for micropowder is growing at a rate of 15-20% every year. [0003] In the prior art, silicon micropowder for copper-clad laminates has the following problems: silicon micropowder is an inorganic filler, which has poor compatibility with organic polymer resins and is difficult to disperse when mixed and used, resulting in the use of traditional sil...

Claims

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Application Information

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IPC IPC(8): C09C1/28C09C3/08C09C3/12C01B33/18C08K9/06C08K7/18C08L61/06
CPCC01B33/181C01P2004/32C08K7/18C08K9/06C08L61/06C08L2203/20C09C1/28C09C3/006C09C3/08C09C3/12
Inventor 钮计芹
Owner 江苏海格新材料有限公司
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