Weather-resistant medium-temperature cured epoxy resin adhesive and preparation method thereof

A technology of curing epoxy resin and epoxy resin, which is applied in the field of chemical materials, can solve the problems of poor weather resistance, achieve good temperature resistance and UV aging resistance, meet the needs of use, and overcome the effects of poor weather resistance

Inactive Publication Date: 2020-06-26
DONGGUAN HUARTONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The object of the present invention is to, aim at the above-mentioned deficiency of prior art, provide a kind of weather-resistant type middle temperature curing epoxy resin adhesive and its preparation method, widen the application of hydrogenated bisphenol A epoxy resin or other cycloaliphatic epoxy resins. On the application side, it overcomes the shortcomings of poor w

Method used

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  • Weather-resistant medium-temperature cured epoxy resin adhesive and preparation method thereof
  • Weather-resistant medium-temperature cured epoxy resin adhesive and preparation method thereof

Examples

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Embodiment 1

[0024] Embodiment 1: The weather-resistant medium-temperature curing epoxy resin adhesive provided in this embodiment and its preparation method include steps: S1: Take 10g bisphenol A epoxy resin and 20g hydrogenated bisphenol A epoxy resin and mix Uniformly, mechanically stirred for 10 minutes, weighed 3g of carboxyl-terminated CTBN as a toughening agent and added to the mixed resin, mixed evenly under a nitrogen atmosphere, controlled the reaction temperature at 100°C, and cooled to room temperature after a reaction time of 1 hour to obtain a modified Toughening epoxy resin; S2: take by weighing 0.5g ultraviolet absorber, 0.5g antioxidant, 0.5g light stabilizer, 3.5g micropowder dicyandiamide as curing agent, 0.5g2-methylimidazole as accelerator, 1g bentonite , 0.5g fumed silica as a thixotropic agent, then added in order to the modified toughened epoxy resin, mechanically stirred for 30 minutes, to obtain the mixture;

[0025] S3: Weigh 4g butyl glycidyl ether as diluent, ...

Embodiment 2

[0026] Example 2: The weather-resistant medium-temperature curing epoxy resin adhesive and its preparation method provided in this example are basically the same as in Example 1, except that 15g of bisphenol A epoxy resin is weighed as epoxy resin A , 15g hydrogenated bisphenol A epoxy resin as epoxy resin B; Weigh 3g amino-terminated liquid butadiene as toughening agent, weigh 1g UV absorber, 1g antioxidant as stabilizer, weigh 4.5g polymer Propylene glycol diglycidyl ether is used as diluent, and 54g600 mesh activated aluminum hydroxide is taken as filler.

Embodiment 3

[0027] Example 3: The weather-resistant medium-temperature curing epoxy resin adhesive provided in this example and its preparation method are basically the same as in Example 1, except that 20g of bisphenol A epoxy resin is weighed as epoxy resin A , 5g cycloaliphatic epoxy resin, 5g hydrogenated bisphenol A epoxy resin as epoxy resin B; Weigh 1g UV absorber, 1g antioxidant, 0.5g light stabilizer as stabilizer, weigh 4.5g benzene Glycidyl ether was used as a diluent, 53.5g of 600 mesh activated aluminum hydroxide was weighed as a filler, and 1g of γ-glycidoxypropyltrimethoxysilane was used as a coupling agent.

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Abstract

The invention discloses a weather-resistant medium-temperature cured epoxy resin adhesive and a preparation method thereof. The adhesive comprises the following components, by weight: 10-40 parts of epoxy resin A, 10-40 parts of epoxy resin B, 5-15 parts of a diluent, 5-15 parts of a flexibilizer, 1-3 parts of a thixotropic agent, 1-3 parts of a stabilizer, 30-60 parts of a filler, 5-10 parts of acuring agent, 1-5 parts of an accelerant and 0.5-2 parts of a coupling agent. The epoxy resin A is common bisphenol A or bisphenol F epoxy resin; and the epoxy resin B is hydrogenated bisphenol A epoxy resin or alicyclic epoxy resin. According to the invention, the epoxy resin A and the epoxy resin B are compounded with a weather-resistant auxiliary agent for advantage complementation; the obtained epoxy resin adhesive has the advantages of being good in temperature resistance and ultraviolet aging resistance, excellent in mechanical property, resistant to cold and hot impact and the like, the application cost of the weather-resistant epoxy resin adhesive is reduced, the application range of hydrogenated bisphenol A epoxy resin or other alicyclic epoxy resin is widened, and the defects that an epoxy resin adhesive is poor in weather resistance and the like are overcome.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a weather-resistant medium-temperature curing epoxy resin adhesive and a preparation method thereof. Background technique [0002] At present, with the rapid development of modern science and technology fields such as automobiles and electronics, higher requirements are placed on the weather resistance of adhesives. Whether the epoxy resin can withstand weathering and UV aging depends on the proportion of unsaturated bonds contained in the molecular structure of the epoxy resin. Ordinary bisphenol A or bisphenol F epoxy resins have good physical, mechanical and electrical insulation properties, and are compatible with The adhesive properties of various materials, the flexibility of their use process, and low price are widely used in the adhesive industry, but at the same time, their molecular structure contains a large number of unsaturated bonds such as benzene rings,...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/00
CPCC08L2201/08C08L2205/025C08L2205/03C08L2205/035C09J163/00C08L63/00
Inventor 钟群东吴启华钟群璋朱志通
Owner DONGGUAN HUARTONG ELECTRONICS
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