Low-dielectric-constant heat-conducting silica gel sheet and preparation method thereof

Abstract

The invention discloses a low-dielectric-constant heat-conducting silica gel sheet, which comprises low-dielectric-constant heat-conducting powder, vinyl silicone oil, hydrogen-containing silicone oil, a silicone rubber reinforcing agent, a platinum catalyst, an inhibitor and a silane coupling agent. The low-dielectric-constant heat-conducting powder accounts for 40%-90% of the total mass; the vinyl silicone oil accounts for 4-59% of the total mass; wherein the hydrogen-containing silicone oil accounts for 0.4%-1% of the total mass of the silicone oil, the silicone rubber reinforcing agent accounts for 1%-4% of the total mass of the silicone oil, the platinum catalyst accounts for 0.2%-1% of the total mass of the silicone oil, the inhibitor accounts for 0.01%-0.03% of the total mass of thesilicone oil, and the silane coupling agent accounts for 0.1%-0.6% of the total mass of the heat conduction powder; and the dielectric constant of the low-dielectric-constant heat-conducting powder is less than or equal to 4. The invention further discloses a preparation method of the low-dielectric-constant heat-conducting silica gel sheet. The low-dielectric-constant heat-conducting silica gelsheet not only has the characteristics of high heat conductivity coefficient, low hardness and high insulating strength of a common heat-conducting sheet, but also can be used for thermal interface filling, and has low interference to signals, which is not possessed by the common heat-conducting sheet.

Description

technical field [0001] The invention relates to the technical field of thermally conductive interface materials, in particular to a low dielectric constant thermally conductive silica gel sheet and a preparation method thereof. Background technique [0002] With the miniaturization and continuous improvement of the performance of electronic products, its electronic components are becoming more and more dense, and the transmission and reception, shielding and enhancement of signals are also particularly important. [0003] In order to solve the heat dissipation problem of electronic products, materials such as thermal silica sheet, thermal paste, thermal adhesive, etc. are usually used to fill the interface, so that the heat can be conducted in time. These thermal interface materials usually use aluminum oxide, aluminum nitride, oxide Magnesium, zinc oxide, etc., even carbon fiber, graphene, and these materials are filled with boron nitride, aluminum hydroxide, and silicon di...

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Problems solved by technology

This method has a high thermal conductivity, but the process is complicated, it is difficult to realize industrial production, and the epoxy system has high curing hardness, which is not suitable for thermal interface filling materials. Moreover, the dielectric constant of this method is still greater than 4.0. Cannot meet the requirement of low dielectric constant

Chinese patent document CN 109721750 A discloses a low dielectric constant nano-aramid fiber / boron nitride heat-conducting film and its preparation method. The material obtained by this method has a low dielectric constant, but low thermal conductivity and high hardness. , cannot be applied to high-power heat dissipation components such as chips, let alone fill gaps between electronic components

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