Silicon wafer processing wastewater treatment method and device thereof
A technology for processing wastewater and treatment methods, which is applied to the treatment of sewage or sludge, water, and wastewater, and can solve problems such as high treatment costs, waste of resources, and consumption of acid-base resources.
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Embodiment 1
[0070] The silicon wafer alkali etching liquid flushing waste water is 100m³, the KOH concentration in the feed is 6%-7%, and the potassium silicate concentration is 13000mg / L. Enter the microfiltration membrane system at a temperature of 30°C, adopt cross-flow filtration, control the membrane surface flow velocity at 3-5m / s, the pore size of the microfiltration membrane is 200nm, and the operating pressure is controlled at 0.2Mpa. The recovery rate is 95%, and the microfiltration membrane supernatant enters the first-stage nanofiltration membrane system with an operating pressure of 2MPa and a temperature of 30-40°C. When the concentration of potassium silicate is above 30000 mg / L, the concentrated liquid enters the secondary nanofiltration membrane system to continue separation and concentration. The operating pressure of the secondary nanofiltration membrane is 3MPa and the temperature is 35-40°C. The membrane filtrate of the first-level membrane separation system and the s...
Embodiment 2
[0072] The silicon wafer alkali etching liquid flushing wastewater is 100m³, the KOH concentration in the feed is 6%-7%, and the potassium silicate concentration is 13500mg / L. Enter the microfiltration membrane system at a temperature of 35°C, adopt cross-flow filtration, control the membrane surface flow velocity at 3-5m / s, the pore size of the microfiltration membrane is 50nm, and the operating pressure is controlled at 0.3Mpa. The recovery rate is 92%, and the microfiltration membrane supernatant enters the first-stage nanofiltration membrane system with an operating pressure of 2MPa and a temperature of 30-40°C. When the concentration of potassium silicate is above 30000 mg / L, the concentrated liquid enters the secondary nanofiltration membrane system to continue separation and concentration. The operating pressure of the secondary nanofiltration membrane is 3MPa and the temperature is 35-40°C. The membrane filtrate of the first-level membrane separation system and the sec...
Embodiment 3
[0074]The silicon wafer alkali etching liquid flushing waste water is 100m³, the KOH concentration in the feed is 6%-7%, and the potassium silicate concentration is 13000mg / L. First, add flocculant polyacrylamide 75mg / L to carry out flocculation reaction. After the reaction, after natural settlement, the settled clear liquid enters the microfiltration membrane system at a temperature of 30°C, adopts cross-flow filtration, and the flow velocity of the membrane surface is controlled at 3-5m / s, the pore size of the microfiltration membrane is 200nm, and the operating pressure is controlled at 0.2Mpa. The recovery rate is 95%, and the microfiltration membrane supernatant enters the first-stage nanofiltration membrane system with an operating pressure of 2MPa and a temperature of 30-40°C. When the concentration of potassium silicate is above 30000 mg / L, the concentrated liquid enters the secondary nanofiltration membrane system to continue separation and concentration. The operati...
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