Thermally conductive adhesive with high glass transition temperature and preparation method thereof

A technology of high vitrification and heat-conducting adhesive, which is applied in the field of heat-conducting adhesive, can solve the problems of gradient temperature difference of optical fiber ring, affecting the accuracy of optical fiber gyroscope, affecting the stability of the zero bias of optical fiber gyroscope, etc., to reduce the temperature difference, reduce the curing shrinkage rate, moisten Good wet leveling effect

Active Publication Date: 2020-07-28
武汉长盈鑫科技有限公司
View PDF8 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both these internal heat sources and the ambient temperature will produce a gradient temperature difference on the fiber optic ring, which directly affects the bias stability of the fiber optic gyroscope.
At present, the thermal conductivity of the ring adhesive used for winding the optical fiber ring and the ring adhesive used for bonding the ring is only 0.15~0.25W / (m.K), so the temperature gradient effect of the optical fiber gyro ring will be very obvious, which will seriously affect the accuracy of the optical fiber gyroscope. improve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermally conductive adhesive with high glass transition temperature and preparation method thereof
  • Thermally conductive adhesive with high glass transition temperature and preparation method thereof
  • Thermally conductive adhesive with high glass transition temperature and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] (1) Preparation of organosilicon epoxy prepolymer A

[0036] 344g terminal hydrogen-containing phenyl silicone oil Add 308.42g of allyl bisphenol A into the flask, add 100ppm platinum catalyst KP36 relative to the total mass, react at a temperature of 120°C for 3 hours, then add 114.14g of allyl glycidyl ether and continue the reaction for 4 hours to obtain the product with a viscosity of 25℃265mpa.s.

[0037] (2) Preparation of organosilicon epoxy prepolymer B

[0038] 208g terminal hydrogen-containing silicone oil Add 308.42g of allyl bisphenol A into the flask, add 150ppm platinum catalyst KP36 relative to the total mass, react at a temperature of 130°C for 2 hours, and then add 124.18g of 4-vinyl-1-cyclohexene-1,2- The epoxy continued to react for 3 hours to obtain a product with a viscosity of 176mpa.s at 25°C.

[0039] (3) Preparation of thermally conductive adhesive

[0040] The mass ratio of the raw materials of each component of the thermal conductive adh...

Embodiment 2

[0043] Step (1) (2) is consistent with embodiment 1.

[0044] (3) Preparation of thermally conductive adhesive

[0045] The mass ratio of the raw materials of each component of the thermal conductive adhesive is: silicone epoxy prepolymer A 4%, silicone epoxy prepolymer B6%, alicyclic epoxy resin UVR-6128 2%, 3-ethyl-3 -Oxetanemethanol 2%, macromolecular polyol PTMG6502%, curing agent Anyhard 1010P 3.52%, antioxidant 1726 0.1%, light stability UV-9 0.1%, thermally conductive filler acicular alumina 10%, thermally conductive filler Spherical alumina 70%, TiloJet 3000 0.08%, coupling agent AL-M (aluminate) 0.2%, the sum of each component meets 100%.

[0046] Weigh the above-mentioned raw materials in proportion, add all materials except curing agent and thermal conductive filler into the mixing tank, and then add thermal conductive filler while stirring. After all the thermal conductive fillers are added, use an ultrasonic processor for 25 minutes, and then wait for the materia...

Embodiment 3

[0048] Step (1) (2) is consistent with embodiment 1.

[0049] (3) Preparation of thermally conductive adhesive

[0050] The mass ratio of the raw materials of each component of the thermal conductive adhesive is: silicone epoxy prepolymer A 30%, silicone epoxy prepolymer B 5%, cycloaliphatic epoxy resin UVR-6128 12%, 3-oxetane Alkanol 12%, macromolecular polyol PCL305 11%, curing agent ICAM-8409 0.5%, defoamer DC-163 0.1%, antioxidant 1010 0.16%, light stability UV-5310.15%, thermally conductive filler graphene 8%, thermal conductive filler spherical boron nitride 20%, TiloJet 3003 0.59%, coupling agent isopropyl triisostearyl titanate 0.5%, the sum of each component meets 100%.

[0051] Weigh the above-mentioned raw materials in proportion, add all materials except curing agent and thermal conductive filler into the mixing tank, and then add thermal conductive filler while stirring. After all the thermal conductive fillers are added, use an ultrasonic processor for 10 minute...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
viscosityaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention relates to the technical field of thermally conductive adhesives and discloses a thermally conductive adhesive with high glass transition temperature and a preparation method thereof. The thermally conductive adhesive is prepared from the following raw materials (by mass): 5-80% of an organic silicon epoxy prepolymer; 1-50% of cycloaliphatic epoxy resin; 1-20% of an oxetane monomer,0-20% of macromolecular polyol, 0.2-25% of a curing agent, 0.1-2% of an antioxidant, 0.1-0.5% of a light stabilizer, 0.0-0.5% of a defoaming agent, 5-90% of a thermally conductive filler, 0.0-5% of adispersing agent and 0.2-2% of a coupling agent, wherein the sum of the components is 100%. The thermally conductive adhesive provided by the invention has high glass transition temperature (higher than 100 DEG C), higher elastic modulus (higher than 1000MPa), better toughness (the elongation is higher than 5%) and higher binding power; the thermally conductive adhesive is suitable for bonding anoptical fiber ring in an optical fiber gyroscope, the overall heat conductivity coefficient of the optical fiber ring can be effectively improved, the temperature gradient of the optical fiber ring isreduced, the full-temperature error of the ring is reduced, and the precision of the gyroscope is improved.

Description

technical field [0001] The invention relates to the technical field of thermally conductive adhesives, in particular to a thermally conductive adhesive for optical fiber rings with a high glass transition temperature and a preparation method thereof. Background technique [0002] Fiber optic gyroscope is one of the important gyroscopes used in industrial applications in the world today. Its main sensitive device is the fiber optic ring. In order to meet the vibration performance requirements of the fiber optic gyroscope and improve the overall accuracy of the fiber optic gyroscope, the fiber optic ring after winding needs to be glued. It is fixed by curing, but its working error is greatly affected by external vibration and temperature changes. [0003] The impact of temperature on the fiber optic ring mainly comes from two aspects, one is the heat dissipation of the internal heat source of the fiber optic gyroscope, and the other is the influence of the change of ambient te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J163/00C09J11/04C09J11/06C09J11/08C08G77/38
CPCC08G77/38C08K2003/282C08K2201/003C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C09J183/06C08L83/06C08L63/00C08K13/04C08K3/042C08K3/28C08K7/18C08K7/08
Inventor 黄星余晓梦崔丽云万欢皮亚斌高旭
Owner 武汉长盈鑫科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap