Self-repairing in-situ fluorescent tracing type heat-resistant weather-resistant epoxy resin and preparation method thereof

Abstract

The invention provides self-repairing in-situ fluorescent tracing type heat-resistant weather-resistant epoxy resin and a preparation method thereof. According to the preparation method, glycidyl ethers, glycidyl esters and glycidyl amine are selected as main resin, so that the basic mechanical properties of the resin are ensured; hydantoin epoxy resin and alicyclic epoxy resin are selected as component resin, so that the heat resistance and weather resistance of the resin are improved; an acid curing agent is selected to construct a reversible exchange ester bond to endow the resin with a self-repairing function, acetylacetone metal salt is selected as a catalyst to reduce the curing temperature and catalyze the fracture-generation reaction of the reversible exchange ester bond, and aminated nanoparticles are selected to adjust the temperature resistance of a resin matrix and realize an in-situ fluorescent tracing repairing process. The self-repairing epoxy resin prepared on the basisof the technical scheme is simple in preparation process, high in self-repairing efficiency and diverse in repairing mode, can be subjected to fluorescence tracing in the repairing process, can be used for repairing multiple times,, and can be applied to the fields of pressure containers, electronic packaging, aerospace, transportation, sports goods and the like.

Description

technical field [0001] The invention relates to the field of high-performance polymers, and mainly relates to a self-repairing in-situ fluorescent tracer type heat-resistant and weather-resistant epoxy resin and a preparation method thereof. Background technique [0002] With the development of social life and industrial technology, polymers are widely used in various aspects of production and life, such as building panels, auto parts, and electronic components, due to their excellent mechanical properties, light specific gravity, and easy processing and molding. and printed circuit boards. High molecular polymers will inevitably produce crack damage under the action of the external environment, which will reduce the mechanical properties of the material and shorten the service life of the material. Traditional methods such as mechanical connection, plastic welding, and bonding can be applied to the repair of visible cracks in materials, but they are not suitable for intern...

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Problems solved by technology

[0003] At present, the self-repair method of epoxy resin is mostly landfill method: Chinese patent 200810025911.4 discloses an epoxy resin nano-microcapsule and its preparation method [Cai Xiulan, Qu Ailan, Fu Datian. An epoxy resin nano-microcapsule and its Preparation method; CN 104945847 A[P].2015.], the material is subjected to external force to cause cracks to expand, the microcapsules rupture and the liquid epoxy resin flows out, and the catalyst triggers the liquid resin to solidify at high temperature. Although this method solves the repair problem to a certain extent , but also faces many challenges: the cost of the catalyst or the instability and dispersion in the matrix, or the structure of the repaired part and the matrix is ​​different; Chinese patent 201410209131.0 discloses a self-healing epoxy resin containing hollow fibers Composite material [Su Junfeng. A self-healing epoxy resin composite material containing hollow fibers; CN 103937164 A[P].2014.], when the composite material cracks, the fiber breaks and releases dicyclopentadiene for repair. This method There are also certain limitations: for example, the introduction of hollow fibers into brittle materials can easily cause stress concentration; hollow fibers are not suitable for the repair of smooth surface materials due to their relatively large size.

Chinese patent 201510979587.X discloses a self-healing epoxy powder coating and its preparation method [Ren Hua, Zhu Jiting, Gu Tingting, et al. A self-healing epoxy powder coating and its preparation method; CN 105400377 A[P].2015], using the reversible exchange ester bond to realize the self-healing function of the material, but it needs to be baked at 180-300℃ for more than 10h to achieve self-healing, the self-healing temperature is too high and the time is too long

Generally speaking, the current preparation method of self-healing epoxy resin based on reversible exchange ester bonds has technical deficiencies: first, the curing temperature is too high and the resin has poor heat and weather resistance and mechanical properties; second, the repair method is single and the repair time is too long Long, can not meet the repair under specific circumstances; the third is unable to realize the visualization of the evolution process of the reversible exchange ester bond in the repair process

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