Heat-conducting connecting foam and preparation method thereof

A thermally conductive connection and foam technology, applied in the foam field, can solve the problems of poor temperature uniformity, low thermal conductivity and high production cost, and achieve the effects of stable performance, high thermal conductivity and low production cost

Inactive Publication Date: 2020-08-07
深圳市象形科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although several foam materials with heat conduction effect have appeared at present, there are still

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] In addition, the present invention also provides a method for preparing the above thermally conductive connection foam, comprising the steps of: mixing polycarbonate diol, xylylene diisocyanate, vinyl polysiloxane, 2-hydroxypropionic acid and graphite oxide The alkene is shaken and dispersed for 2-3h under the ultrasonic power of 400-500W to form a blend; the blend is added to the mixer, and the pH value is adjusted to 7.5-7.8 under the condition of a stirring speed of 100-120r / min, and then The temperature was raised to 210°C at a heating rate of 2-4°C / min, and the temperature was maintained for 40-50min; then other remaining raw material components were added, and the pH value was adjusted to 4.5-5.5 under the condition of stirring The cooling rate of 0.5-1°C / min is cooled to 140-145°C, then kept for 20-30min, and then foamed in a foaming furnace with a frequency of 2000-2200MHz and a power of 4-5kW for 10-12min, and then dried in an oven Dry for 4-5 hours to obtain t...

Example Embodiment

[0032] Example 1

[0033] This embodiment provides a thermally conductive connection foam. The raw material components, in parts by weight, include: 8 parts of polycarbonate diol, 15 parts of xylylene diisocyanate, 4 parts of vinyl polysiloxane, 2 parts of -4 parts of hydroxypropionic acid, 0.6 parts of graphene oxide, 30 parts of pentaerythritol, 15 parts of polyethyleneimine, 1 part of sodium lauryl sulfate, 1 part of N-phenyl-2-naphthylamine, guar hydroxypropyl 0.4 part of trimethylammonium chloride, 3 parts of foaming agent dichloromethane, 3 parts of curing agent acetic acid and 1 part of flame retardant zinc borate.

[0034] According to the above-mentioned raw materials, adopt the preparation method provided by the present invention to prepare the thermally conductive connection foam:

[0035] Polycarbonate diol, xylylene diisocyanate, vinyl polysiloxane, 2-hydroxypropionic acid and graphene oxide were oscillated and dispersed for 2h under ultrasonic power of 400W to f...

Example Embodiment

[0036] Example 2

[0037] This embodiment provides a thermally conductive connection foam. The raw material components, in parts by weight, include: 10 parts of polycarbonate diol, 12 parts of xylylene diisocyanate, 9 parts of vinyl polysiloxane, 2- 2 parts of hydroxypropionic acid, 1.0 parts of graphene oxide, 20 parts of pentaerythritol, 20 parts of polyethyleneimine, 0.5 parts of sodium lauryl sulfate, 3 parts of N-phenyl-2-naphthylamine, guar hydroxypropyl 0.1 part of trimethylammonium chloride, 8 parts of foaming agent dichloromethane, 2 parts of curing agent acetic acid and 1.5 parts of flame retardant zinc borate.

[0038] According to the above-mentioned raw materials, adopt the preparation method provided by the present invention to prepare the thermally conductive connection foam:

[0039] Polycarbonate diol, xylylene diisocyanate, vinyl polysiloxane, 2-hydroxypropionic acid and graphene oxide were oscillated and dispersed for 3h under ultrasonic power of 500W to fo...

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Abstract

The invention relates to heat-conducting connecting foam and a preparation method thereof. The foam comprises the raw material components in parts by weight: 8 to 10 parts of polycarbonate diol, 12 to15 parts of xylylene diisocyanate, 4 to 9 parts of vinyl polysiloxane, 2 to 4 parts of 2-hydracrylic acid, 0.6 to 1.0 part of graphene oxide, 20 to 30 parts of pentaerythritol, 15 to 20 parts of polyethyleneimine, 0.5 to 1 part of lauryl sodium sulfate, 1 to 3 parts of N-phenyl-2-naphthylamine, 0.1 to 0.4 part of guar gum hydroxypropyl trimethyl ammonium chloride, 3 to 8 parts of a foaming agent,2 to 3 parts of a curing agent and 1 to 1.5 parts of a flame retardant. The heat-conducting connection foam provided by the invention is good in heat conductivity, high in foaming rate in the foam, uniform and fine in foam holes, stable in performance in all aspects, excellent in compression resilience, flame retardance, waterproofness and structural stability, low in production cost and wide inapplication prospect.

Description

technical field [0001] The invention relates to the technical field of foam, in particular to a heat-conducting connection foam and a preparation method thereof. Background technique [0002] Foam is a material made of plastic particles, which can be divided into PU foam, anti-static foam, conductive foam, EPE, anti-static EPE, PORON, CR, EVA, bridging PE, SBR, EPDM, etc. Foam has a series of characteristics such as good elasticity, light weight, fast pressure-sensitive fixation, convenient use, free bending, ultra-thin volume, and reliable performance. [0003] As the electronic information industry has become the main driving industry for GDP growth, the market for electronic products is getting bigger and bigger, such as notebook computers, large liquid crystal displays, high-power power supplies, etc. For these electronic products, good heat dissipation is to ensure their normal and continuous operation. An important factor in the work; it has been shown that for every ...

Claims

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Application Information

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IPC IPC(8): C08L75/04C08L83/07C08L79/02C08L5/00C08L23/08C08L61/06C08K13/02C08K3/04C08K3/38C08K5/18C08K13/06C08K7/06C08J9/14C08G18/66C08G18/44C08G18/34C08G18/32
CPCC08G18/44C08G18/6644C08G18/6659C08J9/145C08J2203/142C08J2375/04C08J2405/00C08J2423/08C08J2461/06C08J2479/02C08J2483/07C08K5/18C08K7/06C08K13/02C08K13/06C08K2003/387C08K3/042
Inventor 郑超超梁鑫
Owner 深圳市象形科技有限公司
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