Polyimide, preparation method of precursor solution of polyimide and double-sided flexible copper-clad plate

A polyimide and precursor solution technology, which is applied in chemical instruments and methods, coatings, layered products, etc., can solve the problems of low yield and production efficiency of double-sided flexible copper clad laminates

Active Publication Date: 2020-08-14
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The main purpose of the present invention is to provide a kind of polyimide, the preparation method of the precursor solution of polyimide and the double-sided

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  • Polyimide, preparation method of precursor solution of polyimide and double-sided flexible copper-clad plate
  • Polyimide, preparation method of precursor solution of polyimide and double-sided flexible copper-clad plate
  • Polyimide, preparation method of precursor solution of polyimide and double-sided flexible copper-clad plate

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preparation example Construction

[0054] The preparation method of the above precursor solution comprises: mixing aniline compounds containing alkyne groups and aromatic diamine compounds with an organic solvent to obtain a mixed solution of organic amines, the mass concentration of the mixed solution of organic amines being 6-12%; Mix tetracarboxylic dianhydride compounds with 4,4'-(acetylene-1,2-diyl) diphthalic anhydride to obtain an acid anhydride mixture; under an inert atmosphere, divide the anhydride mixture three times according to the mass ratio of 6:3:1 react with an organic amine mixed solution, and the reaction temperature is 30-40°C to obtain a polyimide precursor solution with general formula I, or

[0055] Mix the aromatic diamine compound with an organic solvent to obtain an organic amine mixed solution, the mass concentration of the organic amine mixed solution is 6-12%; mix alkyne-containing phthalic anhydride compounds, aromatic tetracarboxylic dianhydride compounds and 4 , 4'-(acetylene-1,2...

preparation Embodiment 1～8

[0065] Prepared according to the amount of raw material input in Table 1 and the following experimental procedures: under a nitrogen atmosphere, in a 100mL three-necked flask, while stirring, the quantitative alkyne-containing aniline compounds and aromatic diamines shown in Table 1 The compounds were dissolved in 40g of strong polar solvent NMP, and then the aromatic tetracarboxylic dianhydride compounds and 4,4'-(acetylene-1, 2-diyl) diphthalic anhydride, and then, under a nitrogen atmosphere, the solution was stirred at room temperature for about 24 hours to obtain a corresponding thermosetting / thermoplastic polyimide precursor solution. Measure the glass transition temperature of the polyimide resin corresponding to each polyimide precursor solution by the DMA test method, and use A, C, E, G as the thermosetting polyimide precursor solution according to the glass transition temperature , B, D, F, H as thermoplastic polyimide precursor solutions.

[0066] Table 1

[0067]...

preparation Embodiment 9～16

[0071] Prepared according to the amount of raw material input in Table 2 and the following experimental procedures: under a nitrogen atmosphere, in a 100mL three-necked flask, dissolve the quantitative aromatic diamine compounds shown in Table 2 in 40g of highly polar In the solvent NMP, add the alkyne-containing phthalic anhydride compounds, aromatic tetracarboxylic dianhydride compounds and 4,4'-(acetylene-1, 2-diyl) diphthalic anhydride. Then, under a nitrogen atmosphere, the solution was continuously stirred at room temperature for about 24 hours to prepare a corresponding thermosetting / thermoplastic polyimide precursor solution. Through the DMA test method, the glass transition temperature of the polyimide resin corresponding to each thermosetting / thermoplastic polyimide precursor solution is measured, and I, K, M, O are used as thermosetting polyimides according to the glass transition temperature Precursor solution, J, L, N, P as thermoplastic polyimide precursor solut...

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Abstract

The invention provides polyimide, a preparation method of a precursor solution of polyimide and a double-sided flexible copper-clad plate. Structural formula of the polyimide is shown as a general formula I or a general formula II, on one hand, the number of alkynyl groups inside and at the end of a polyimide molecular chain is increased; the density of crosslinking sites is improved, and the net-shaped structure formed after crosslinking forms a crystal-like structure in the microstructure of the polyimide, so that the heat conductivity coefficient of the polyimide is improved, and the production efficiency and the production speed of laminating preparation of the double-sided flexible copper-clad plate are improved; and on the other hand, the molecular chain rigidity strength and the glass-transition temperature of the polyimide resin can be adjusted by controlling the groups R1, R2, R5, R6, R7, R10, R11 and R12, so that the peeling strength, the tensile strength and the tensile modulus of the double-sided flexible copper-clad plate product are guaranteed, and meanwhile, the double-sided flexible copper-clad plate product also has good folding resistance.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide, a method for preparing a polyimide precursor solution, and a double-sided flexible copper clad laminate. Background technique [0002] In recent years, with the high performance, miniaturization and light weight of digital cameras, digital video cameras, car navigators, computer accessories and other electronic products, as well as the emergence of high-end electronic products, such as tablet computers and smart phones, the electronic Circuits are also constantly developing towards the trend of "light, thin, short, and small"; while the traditionally used rigid copper-clad laminates do not have flexibility, and the electronic circuits obtained cannot be bent and assembled, and are bulky, which can no longer meet actual needs. Therefore, single-sided / double-sided flexible CCLs with high density, multilayer, high heat resistance, and high dimensional stabilit...

Claims

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Application Information

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IPC IPC(8): C08G73/12B32B15/20B32B15/01B32B33/00B32B37/06B32B37/10
CPCC08G73/127B32B15/20B32B15/01B32B33/00B32B37/06B32B37/10B32B2255/06B32B2255/26B32B2255/28B32B2307/54Y02E60/10
Inventor 周慧李营翁建东俞仁杰章陈萍周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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