Conductive silver paste, preparation method and application of conductive silver paste to conductive film

A technology of conductive silver paste and conductive film, which is applied to the equipment used to manufacture conductive/semi-conductive layers, conductive materials dispersed in non-conductive inorganic materials, conductive coatings, etc., can solve the problem of poor tensile properties of conductive films, The surface metal silver is not adsorbed firmly, and the electrical conductivity is reduced, so as to achieve the effect of increasing the binding force, improving the binding performance and good resilience.

Pending Publication Date: 2020-09-04
常州市利多合金材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive metal silver in the prior art is used as a metal powder and mixed with commonly used high polymers such as polyurethane resins. Shedding phenomenon occurs, the conductive film has poor stretch resistance and low bending resistance; the amount of resin is too high, and the conductivity is reduced; the temperature resistance of polyurethane resin is between -20°C and 120°C, and the polymer decomposes at 220°C , poor high temperature resistance, affecting the use of electronic equipment

Method used

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  • Conductive silver paste, preparation method and application of conductive silver paste to conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A kind of conductive silver paste, comprises each component of following mass percentage:

[0037] 69.0% modified metallic silver, the metallic silver is 100% silver powder, the silver powder is a granular powder, wherein the particle size of the silver powder is 0.50 μm-5.00 μm; modified;

[0038] 10.3% silicone resin, wherein the silicone resin includes component A and component B, the mass ratio of the component A to the component B is 2:1, and the component A is dimethyl silicone oil, vinyl silicone oil, ethylene MQ-based silicone resin and platinum catalyst are mixed, and the vinyl silicone oil is a mixture of single-end vinyl silicone oil, double-end vinyl silicone oil, and side-chain vinyl silicone oil in a mass ratio of 1:1:1; the component B is acetylene A mixture of cycloethanol and a cross-linking agent, the cross-linking agent is a mixture of low-hydrogen-containing silicone oil, high-hydrogen-containing silicone oil, and hydrogen-containing MQ silicone res...

Embodiment 2

[0055] A kind of conductive silver paste, comprises each component of following mass percentage:

[0056] 66.7% modified metal silver, the metal silver is composed of 80% silver powder and 20% silver wire, the silver powder is a granular powder, wherein the particle size of the silver powder is 0.5μm-5.00μm, and the diameter of the silver wire is 40nm- 200nm, the silver wire length is 10μm-200μm; metallic silver is modified by sodium dodecylbenzenesulfonate as an anionic surfactant;

[0057] 11.1% silicone resin, wherein the silicone resin includes component A and component B, the mass ratio of the component A to the component B is 1:1, and the component A is dimethyl silicone oil, vinyl silicone oil, ethylene MQ-based silicone resin and platinum-palladium catalyst are mixed, and the vinyl silicone oil is mixed with single-end vinyl silicone oil, double-end vinyl silicone oil, and side-chain vinyl silicone oil in a mass ratio of 1:1:1; the component B is A mixture of ethynyl ...

Embodiment 3

[0071] A kind of conductive silver paste, comprises each component of following mass percentage:

[0072]51.9% modified metal silver, the metal silver is composed of 95% silver powder and 5% silver wire, the silver powder is a granular powder, wherein the particle size of the silver powder is 0.5μm-5.00μm, and the diameter of the silver wire is 40nm- 200nm, the length of the silver wire is 10μm-200μm; metal silver is modified with stearic acid as an anionic surfactant;

[0073] 13.0% silicone resin, wherein the silicone resin includes component A and component B, the mass ratio of the component A to the component B is 1:1, and the component A is dimethyl silicone oil, vinyl silicone oil, ethylene MQ-based silicone resin and platinum catalyst are mixed, and the vinyl silicone oil is a mixture of single-end vinyl silicone oil, double-end vinyl silicone oil, and side-chain vinyl silicone oil in a mass ratio of 1:1:1; the component B is acetylene A mixture of cycloethanol and a c...

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Abstract

The invention belongs to the technical field of electronic paste, and particularly relates to conductive silver paste, a preparation method and application of the conductive silver paste to a conductive film. The conductive silver paste adopts 30%-75% by mass of a modified conductive medium, 5%-20% by mass of pretreated silica gel resin, 1.0%-10% by mass of a silane coupling agent and 10%-50% by mass of a solvent, wherein the conductive medium is metal silver or silver-coated copper or a mixture of metal silver and silver-coated copper, and the metal silver is composed of silver powder and silver wires, and the silver powder is one or more of flakes, branches, particles and spheres. The preparation method comprises the steps of conductive medium modification, silica gel resin pretreatment,silica gel resin solution preparation, silane coupling agent addition and conductive silver paste preparation, and the prepared conductive silver paste coats one side or two sides of a silicone rubber film. The conductive medium on a conductive film prepared from the conductive silver paste is not easy to fall off, and the conductive film is good in bending resistance, conductivity and tensile property; and the advantages of high flexibility and elasticity, high and low temperature resistance, low production cost and the like are realized.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a conductive silver paste, a preparation method and its application on a conductive film. Background technique [0002] As a functional printing material, conductive paste is widely used in electronic information products due to its good physical properties, and conductive silver paste is widely used because of its good oxidation resistance, electrical conductivity, and thermal conductivity. In order to meet the requirements of high strength and high mechanical properties of the product, the conductive film layer after the conductive silver paste is cured has tensile properties, hardness requirements, and high adhesion and connection strength between the film layer and the substrate. However, the conductive metal silver in the prior art is used as a metal powder and mixed with commonly used high polymers such as polyurethane resins. Shedding phenomenon occurs, the condu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/04C09D183/07C09D7/65C09D5/24C08J7/044H01B1/22H01B5/14H01B13/00C08L83/04
CPCC08J2383/04C08J2483/04C08J2483/05C08J2483/07C08K2003/0806C08K2003/085C08K2201/001C08L2205/025C08L2205/035C09D5/24C09D183/04C09D7/65C08J7/0427C08J7/044H01B1/22H01B5/14H01B13/00H01B13/0026C08L83/04C08K13/06C08K9/04C08K3/08C08K5/5425C08K7/06C08K5/5435C08K5/548
Inventor 王学森徐敬义王金熠高玉鹏
Owner 常州市利多合金材料有限公司
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