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Application of dithiocarbamic acid compound in electroless palladium plating and electroless palladium plating composition

A dithiocarbamic acid and chemical plating technology, applied in the field of chemical plating, can solve problems such as unfavorable productivity increase, affecting production line productivity, raising the temperature of an electroless palladium plating solution, etc., to achieve the effects of increasing deposition speed and improving production efficiency

Active Publication Date: 2020-09-04
GUANGDONG TONESET SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the traditional electroless palladium plating process, the deposition rate of palladium ions is generally slow. In the actual processing process, in order to obtain a thicker palladium layer, it is often necessary to prolong the processing time of electroless palladium plating or increase the concentration of electroless palladium plating solution. temperature
Although this can obtain a thicker palladium layer to a certain extent, prolonging the processing time of electroless palladium plating will affect the production capacity of the production line, which is not conducive to the improvement of production capacity; The deposition rate of palladium ions, but the increase of temperature will lead to the instability of electroless palladium plating solution, which will affect the performance of electroless palladium plating, and then bring adverse effects to the effect of electroless palladium plating

Method used

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  • Application of dithiocarbamic acid compound in electroless palladium plating and electroless palladium plating composition
  • Application of dithiocarbamic acid compound in electroless palladium plating and electroless palladium plating composition
  • Application of dithiocarbamic acid compound in electroless palladium plating and electroless palladium plating composition

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preparation example Construction

[0057] In a specific example, the preparation method of the electroless palladium plating composition comprises the following steps: calculate the consumption of each raw material of the composition according to the preset volume; add the palladium source into the solvent for dissolution; add complexing agent, reducing agent and A dithiocarbamate compound with a structure represented by formula (I); the pH of the composition is adjusted to 4-9.

[0058] Preferably, the preparation method of the electroless palladium plating composition is: calculate the amount of each raw material of the composition according to the preset volume; add the palladium source into the solvent for dissolution; add complexing agent, reducing agent and The structural dithiocarbamic acid compound; the pH of the composition is adjusted to 4-9.

[0059]As a specific example, the preparation method of the electroless palladium plating composition is as follows: pure water is used as a solvent, and the pr...

Embodiment 1

[0073] The dithiocarbamic acid compound in this implementation is S-(N,N-dimethylthiocarbamoyl)thioglycolic acid (CAS number: 4007-01-6). The preset volume of the electroless palladium plating composition in this embodiment is 2L. Based on 2L, each raw material in the composition is 100mg / L palladium chloride, 5g / L ethylenediamine, 1g / L sodium hypophosphite and 0.1mg / L S-(N,N-dimethylthiocarbamate Acyl) thioglycolic acid, the solvent is pure water.

[0074] The preparation method of the electroless palladium plating composition in the present embodiment is: add pure water in beaker, palladium chloride is dissolved in pure water, then add ethylenediamine, sodium hypophosphite and S-(N,N-di Methylthiocarbamoyl) mercaptoacetic acid, adjust solution pH=4 with hydrochloric acid, the volume of electroless palladium plating composition is 2L, standby.

Embodiment 2

[0076] The dithiocarbamate compound in this implementation is butyl ethyl dithiocarbamate (CAS number: 83962-20-3). The preset volume of the electroless palladium plating composition in this embodiment is 2L. Based on 2L, the raw materials in the composition are 700mg / L palladium sulfate, 30g / L ethylenediaminetetraacetic acid, 15g / L sodium formate and 10mg / L butyl ethyl dithiocarbamate, and the solvent is pure water.

[0077] The preparation method of the electroless palladium plating composition in this embodiment is: add pure water in the beaker, dissolve palladium sulfate in pure water, then add ethylenediaminetetraacetic acid, sodium formate and butyl ethyldithiocarbamate successively , the pH of the solution was adjusted to 6.5 with sulfuric acid, the volume of the electroless palladium plating composition was 2L, and it was set aside.

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Abstract

The invention relates to application of a dithiocarbamic acid compound in electroless palladium plating and an electroless palladium plating composition. The dithiocarbamic acid compound with a structure shown in a general formula (I) is adopted as a raw material to prepare the electroless palladium plating composition, and then the electroless palladium plating composition is adopted to carry outpalladium plating treatment on a to-be-plated palladium part; the dithiocarbamic acid compound is applied to electroless palladium plating, so that the deposition speed of palladium ions can be effectively increased, the electroless palladium plating treatment time is shortened, and the productivity is improved; and besides, the dithiocarbamic acid compound can stabilize the electroless palladiumplating composition and reduce the risk of palladium ion precipitation in the composition, thereby enhancing the stability of the electroless palladium plating composition and ensuring the palladiumplating effect.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an application of a dithiocarbamate compound in electroless palladium plating and an electroless palladium plating composition. Background technique [0002] In the manufacturing process of printed circuit boards, integrated circuits or wafers, due to the complex circuit processing involved, in order to improve the stability between circuits, it is often necessary to perform electroless palladium plating on circuit boards or wafers to Improve the corrosion resistance and oxidation resistance of metals. [0003] However, in the traditional electroless palladium plating process, the deposition rate of palladium ions is generally slow. In the actual processing process, in order to obtain a thicker palladium layer, it is often necessary to prolong the processing time of electroless palladium plating or increase the concentration of electroless palladium plating solution. ...

Claims

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Application Information

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IPC IPC(8): C23C18/44
CPCC23C18/44
Inventor 黎小芳李小兵黄憬韬陈光辉张俊林赖海祥万会勇黄辉祥
Owner GUANGDONG TONESET SCI & TECH
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