P-type monocrystalline silicon boron back surface field double-sided battery and preparation method thereof
A monocrystalline silicon boron, double-sided battery technology, applied in the field of solar cells, can solve the problems of lower battery output performance, limit the improvement of battery efficiency, and failure to enter, so as to achieve good battery electrical performance, reduce metal recombination, and process simple effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0041] The invention discloses a preparation method of a P-type single crystal silicon boron back field double-sided battery, comprising the following steps:
[0042] S1. Provide a P-type silicon substrate 1, and clean and texture the P-type silicon substrate 1;
[0043] S2, performing phosphorus diffusion on the textured surface of the front side of the P-type silicon substrate to form a phosphorus expansion area 2;
[0044] S3. Wet etching the back of the P-type silicon substrate to remove side junctions and partial back junctions;
[0045] S4, after the wet etching on the back of the P-type silicon substrate is completed, depositing a borosilicate glass layer 3 thereon;
[0046] S5, depositing the absorbing layer dielectric film 4 on the borosilicate glass layer 3;
[0047] S6, scanning the surface of the absorbing layer dielectric film 4 with a laser;
[0048] S7, removing the dielectric film of the absorbing layer and the borosilicate glass layer (i.e. BSG); then perfo...
Embodiment 1
[0073] This embodiment provides a P-type monocrystalline silicon boron back field double-sided cell, such as figure 2 As shown, including a P-type silicon substrate 1, the front of the P-type silicon substrate 1 is sequentially provided with a phosphorus diffusion region 2, an anti-reflection film 5, and a front electrode 7 along a direction away from the P-type silicon substrate 1; Boron back field 6, anti-reflection film 5 and back electrode 8 are sequentially provided along the direction away from P-type silicon substrate 1; wherein, the thickness of boron back field 6 is 400nm, see image 3 .
[0074] The P-type monocrystalline silicon-boron back-field double-sided cell of this example is prepared by the following method:
[0075] Step 101, select a P-type single crystal silicon substrate with a certain thickness (150-200 μm) and resistivity (1-3 ohm*cm), and clean and texture the P-type silicon substrate;
[0076] Step 102, perform phosphorus diffusion on the textured ...
Embodiment 2
[0086] This embodiment provides a P-type monocrystalline silicon boron back field double-sided cell, such as figure 2 As shown, including a P-type silicon substrate 1, the front of the P-type silicon substrate 1 is sequentially provided with a phosphorus diffusion region 2, an anti-reflection film 5, and a front electrode 7 along a direction away from the P-type silicon substrate 1; A boron back field 6, an antireflection film 5 and a back electrode 8 are sequentially provided along the direction away from the P-type silicon substrate 1; wherein, the thickness of the boron back field 6 is 350nm, see Figure 4 .
[0087] The preparation method of the P-type monocrystalline silicon-boron back-field double-sided cell in this embodiment is the same as that in Embodiment 1, and will not be repeated here. The difference lies in:
[0088] In step 105, a silicon oxynitride (SiON) film is deposited on the above-mentioned borosilicate glass layer by plasma enhanced chemical vapor depo...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| wavelength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


