A kind of p-type monocrystalline silicon boron back field bifacial battery and preparation method thereof
A monocrystalline silicon boron, double-sided cell technology, applied in the field of solar cells, can solve problems such as failure to enter, lower battery output performance, and limit the improvement of battery efficiency, and achieve simple process, good battery electrical performance, and low metal composite effect
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[0041] The invention discloses a preparation method of a P-type single crystal silicon boron back field double-sided battery, comprising the following steps:
[0042] S1. Provide a P-type silicon substrate 1, and clean and texture the P-type silicon substrate 1;
[0043] S2. Phosphorus is diffused on the textured surface of the front side of the P-type silicon substrate to form a phosphorus expansion area 2;
[0044] S3. Wet-etch the backside of the P-type silicon substrate to remove edge junctions and part of the back junctions;
[0045] S4. After the wet etching of the back surface of the P-type silicon substrate is completed, deposit the borosilicate glass layer 3 thereon;
[0046] S5, depositing the absorption layer dielectric film 4 on the borosilicate glass layer 3;
[0047] S6, use a laser to scan the surface of the absorption layer dielectric film 4;
[0048] S7, removing the absorption layer dielectric film and the borosilicate glass layer (ie BSG); then thermally ...
Embodiment 1
[0073] This embodiment provides a P-type single crystal silicon boron back field double-sided battery, such as figure 2 As shown, it includes a P-type silicon substrate 1, and the front side of the P-type silicon substrate 1 is sequentially provided with a phosphor expansion region 2, an anti-reflection film 5 and a front electrode 7 along the direction away from the P-type silicon substrate 1; A boron back field 6, an anti-reflection film 5 and a back electrode 8 are arranged in sequence along the direction away from the P-type silicon substrate 1; the thickness of the boron back field 6 is 400 nm, see image 3 .
[0074] The P-type single crystal silicon boron back field double-sided battery of this embodiment is prepared by the following method:
[0075] Step 101, selecting a P-type single crystal silicon substrate with a certain thickness (150-200 μm) and resistivity (1-3 ohm*cm), and cleaning and texturing the P-type silicon substrate;
[0076] Step 102: Diffusion of p...
Embodiment 2
[0086] This embodiment provides a P-type single crystal silicon boron back field double-sided battery, such as figure 2 As shown, it includes a P-type silicon substrate 1, and the front side of the P-type silicon substrate 1 is sequentially provided with a phosphor expansion region 2, an anti-reflection film 5 and a front electrode 7 along the direction away from the P-type silicon substrate 1; The boron back field 6, the antireflection film 5 and the back electrode 8 are arranged in sequence along the direction away from the P-type silicon substrate 1; wherein, the thickness of the boron back field 6 is 350 nm, see Figure 4 .
[0087] The preparation method of the P-type single crystal silicon boron back-field double-sided battery in this embodiment is the same as that in Embodiment 1, and will not be repeated here. The differences are:
[0088] In step 105, a silicon oxynitride (SiON) film is deposited on the borosilicate glass layer by plasma enhanced chemical vapor depo...
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Abstract
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