A kind of lspr sensor based on flexible substrate and its preparation method and application
A flexible substrate and sensor technology, applied in the fields of nanotechnology, instruments, scientific instruments, etc. for materials and surface science, can solve the problems of limited application, rigid substrates cannot be bent arbitrarily, etc., to achieve high flexibility, good water oxygen Blocking function, light weight effect
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[0035] The present invention provides a method for preparing an LSPR sensor based on a flexible substrate described in the above technical solution, comprising the following steps:
[0036] depositing a plasma excitation material on the surface of the flexible polymer substrate, forming a layer of the plasma excitation material on the surface of the flexible polymer substrate;
[0037] Coating a photoresist on the surface of the plasmon excitation material layer to form a photoresist layer;
[0038] Constructing an island-like two-dimensional nanostructure array pattern on the photoresist layer by photolithography and development in sequence;
[0039] The pattern of the island-like two-dimensional nanostructure array is transferred to the plasmon excitation material layer by dry etching, and the residual photoresist is removed to obtain an LSPR sensor based on a flexible substrate.
[0040] In the present invention, unless otherwise specified, all raw material components are ...
Embodiment 1
[0072] Fabricate a diamond-shaped island-like two-dimensional nanostructure array pattern with a period of 300nm in the XY direction, a depth of 50nm, and a thickness of the plasma excitation material layer of 100nm.
[0073] (1) The polyimide with a thickness of 100 μm is flatly pasted on the surface of a quartz substrate with a thickness of 3 mm with an adhesive tape, and an Ag film with a thickness of 100 nm is deposited on the surface of the polymethyl methacrylate by resistance heating and evaporation , anti-evaporation current 160A, evaporation time 2min;
[0074] (2) Spin-coat AR-P-3170 photoresist on the surface of the Ag film at a speed of 5000rpm for 10s, and then dry it at 100°C for 10min to obtain a photoresist layer with a thickness of 100nm;
[0075] (3) On the surface of the photoresist layer, a contact photolithography method is used to photoetch the diamond-shaped micro-nano mask pattern with a period of 300 nm in the XY direction to the photoresist layer, and...
Embodiment 2
[0079] Fabricate a circular hole groove shape island-like two-dimensional nanostructure array pattern with a period of 500nm in the XY direction, a depth of 40nm, and a thickness of the plasma excitation material layer of 50nm.
[0080] (1) A gold film with a thickness of 80nm is deposited on the surface of 800 μm polymethyl methacrylate by magnetron sputtering, and the deposition rate of Au is 10.2nm / min. Among them, the working parameters of magnetron sputtering: RF power is 200W, the Ar gas flow rate is 8sccm, the rotation speed is 20Hz; sputtering 1min stop 2min, split sputtering;
[0081] (2) Spin-coat AR-P-3170 photoresist on the surface of the gold film at a speed of 5000rpm for 10s, then dry at 100°C for 10min to obtain an AR-P-3170 photoresist layer with a thickness of 100nm;
[0082] (3) SP super-resolution lithography is adopted on the surface of the photoresist layer, and a mask in the shape of a circular hole groove with a cycle of 500 nm in the XY direction is pl...
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Abstract
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