Resin composition for hydrocarbon copper-clad plate

Abstract

The invention discloses a resin composition for a hydrocarbon copper-clad plate. The resin composition is prepared from the following raw materials in parts by weight: 20 to 40 parts of polybutadiene,10 to 20 parts of nitrile resin / modified maleimide resin mixture, 25 to 45 parts of ceramic powder and volcanic ash mixture, 15 to 40 parts of polydiene-styrene-ethylene terpolymer, 8 to 12 parts ofcross-linking agent and 4 to 6 parts of curing agent. According to the resin composition for the hydrocarbon copper-clad plate, the prepared copper-clad plate has the advantages of controllable dielectric constant, low dielectric loss, high peel strength, good heat resistance, good processability and the like.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to a resin composition for a hydrocarbon copper-clad laminate. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. The advancement of modern information technology has brought digital circuits into the stage of high-speed information processing and high-frequency signal transmission, which puts forward higher requirements for the dielectric constant and dielectric loss of microwave dielectric circuit substrates. [0003] Because the polarity of C-H in the molecular chain of hydrocarbon resin is small (the electronegativity of C and H are 2.5 and 2.1 respectively), it has excellent dielectric properties (volume re...

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Problems solved by technology

But on the other hand, due to its flexible and non-polar carbon chain structure, the cured product has problems such as insufficient rigidity, low strength, poor heat resistance, low glass transition temperature (Tg), and low peel strength. limit its use

In the prior art, those skilled in the art have carried out a lot of research and improvement on it, but they are all achieved through the formation of a composition of hydrocarbon resin and heat-resistant resin and then cross-linking through the initiator to initiate the system to form a polymer. The purpose of improving heat resistance, for example: the application number is JP19770061619 (application date: 1977.5.26, announcement number: JP53145891A, announcement date: 1978.12.19) discloses a kind of using maleic anhydride modified polybutadiene High-frequency copper-clad laminates, but the grafting rate of MA functional groups on the molecular chain after modification is not given. If the grafting rate is too large, the polarity of the composite material will increase, and the dielectric constant and dielectric loss will increase.

If the functional group grafting rate is too small, the peel strength between the resin system and the copper foil will be too small; the patent disclosure of the application number is JP19800183423 (application date: 1980.12.24, announcement number: JP57105347A, announcement date: 1982.6.30) A high-frequency copper-clad laminate using maleic anhydride-modified polybutadiene was developed, but the grafting rate of polymer maleic anhydride after modification was too high, resulting in an increase in the polarity of the composite material, dielectric constant, and dielectric loss. In addition, the MA-modified polybutadiene disclosed in this patent has a molecular weight of 50,000 to 200,000, is difficult to dissolve in solvents, and has poor follow-up processability

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