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Polyurethane for CMP polishing pad and preparation method of polyurethane

A technology of polyurethane and polyurethane prepolymer, applied in the field of polyurethane application, can solve the problems of complex production process, poor dynamic performance and high endogenous heat

Inactive Publication Date: 2020-10-30
SHANDONG INOV POLYURETHANE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, with the increasing precision of polishing precision of integrated circuits and wafer surfaces by high-precision electronic devices, conventional polyurethane polishing pads have disadvantages such as complex manufacturing process, poor dynamic performance, and high internal heat generation, which are difficult to meet the requirements of higher fields. need

Method used

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  • Polyurethane for CMP polishing pad and preparation method of polyurethane

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] (1) Preparation of prepolymer A component

[0050] 56.3g of PTMG650, 2.4g of 1,4-BDO and 0.3g of carbodiimide were dehydrated at a temperature of 100°C and a vacuum of 0.095MPa to a moisture content below 0.03%, and 41g of TDI-100 in React at 75°C for 4 hours to obtain a prepolymer with an isocyanate content of 10.0 wt%.

[0051] (2) Preparation of curing agent B component

[0052] Curing agent B components are all XYlink311.

[0053] (3) Preparation of polyurethane polishing pad

[0054] Component A of the prepolymer and component B of the curing agent are thoroughly mixed at 80°C according to the ratio of A:B=100:56, poured into a mold to open the mold, and vulcanized to obtain a polyurethane elastomer with a Shore hardness of 60D .

Embodiment 2

[0056] (1) Preparation of prepolymer A component

[0057] 20g of PCL210, 15g of PTMG1000, 0.2g of carbodiimide, dehydrated at a temperature of 100°C and a vacuum of 0.095MPa to a moisture content below 0.05%, and 45g of MDI-100 and 19.8g of liquefied MDI at a temperature of 75 Reaction at ℃ to obtain a prepolymer with an isocyanate content of 17.8wt%;

[0058] (2) Preparation of curing agent B component

[0059] Put 30g of MOCA, 29.9g of PTMG1000, 10g of PPG400, 20g of hollow glass microspheres, 10g of plasticizer diethyl phthalate, 0.1g of organic bismuth catalyst, at 100°C, vacuum below -0.095MPa Dehydration until the water content is less than 0.05%, to obtain component B.

[0060] (3) Preparation of polyurethane polishing pad

[0061] Component A of the prepolymer and component B of the curing agent are thoroughly mixed at 40°C according to the ratio of A:B=100:80, poured into a mold to open the mold, and vulcanized to obtain a polyurethane elastomer with a Shore hardne...

Embodiment 3

[0063] (1) Preparation of prepolymer A component

[0064] 25g of PTMG650, 12g of PPG3000 and 0.3g of carbodiimide were dehydrated at a temperature of 100°C and a vacuum of 0.095MPa to a moisture content below 0.05%, and 44g of hydrogenated MDI and 18.7g of liquefied MDI were dehydrated at a temperature of 75°C Down reaction, obtain the prepolymer that isocyanate mass content is 16wt%;

[0065] (2) Preparation of curing agent B component

[0066] 25g of MCDEA, 39.9g of PPG1000, 10g of PPG400, 15g of hollow glass microspheres, 10g of plasticizer propylene carbonate, 0.1g of organic zinc catalyst, vacuum dehydrated at 105°C, below -0.095MPa until the water content is less than 0.05%, get B component;

[0067] (3) Preparation of polyurethane polishing pad

[0068] Component A of the prepolymer and component B of the curing agent are thoroughly mixed at 60°C according to the ratio of A:B=100:70, poured into a mold to open the mold, and vulcanized to obtain a polyurethane elastom...

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Abstract

The invention belongs to the technical field of polyurethane application, and particularly relates to polyurethane for a CMP polishing pad and a preparation method of the polyurethane. The polyurethane for the CMP polishing pad comprises a polyurethane prepolymer component A and a curing agent component B. The component A is composed of polymeric polyol A, diisocyanate and an anti-hydrolysis agent, and the component B is composed of an amine chain extender, polymeric polyol B, a hollow filler, a plasticizer and a catalyst. The structures of prepolymer molecules are arranged more regularly, andthe forming speed is high; the stability is good; the quality risk is reduced; the high-content prepolymer component does not crystallize at room temperature, has low initial viscosity, and has higher proportion when being mixed with the curing agent component, the uniform mixing is easier, consistency of hardness and uniformity after slicing of the prepared product is guaranteed, the breakage rate of electronic elements in the later polishing process is greatly reduced, and on the basis of micro-foaming, the hollow filler is added, so that the product has longer service life and storage lifeand good mechanical performance.

Description

technical field [0001] The invention belongs to the technical field of polyurethane applications, and in particular relates to a polyurethane for CMP polishing pads and a preparation method thereof. Background technique [0002] Chemical mechanical polishing (CMP) technology removes the chemical reactants on the surface of the polished piece by organically combining the mechanical grinding of abrasive grains with the chemical action of the oxidizing agent, and obtains a smooth surface to achieve ultra-precision and non-damaging surface processing, which meets the requirements of circuits under 0.35 μm It is mainly used for the processing of ultra-precision surfaces (such as silicon wafers, micro-integrated circuits, memory, etc.). [0003] The semiconductor polishing pad is the polishing original for the substrate material silicon wafer in integrated circuits and VLSIs. At this stage, the main substrate is polyurethane elastomer. Polyurethane polishing pads have the charact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/66C08G18/48C08G18/32C08G18/42C08G18/38C08G18/12C08K7/28C08G101/00
CPCC08G18/12C08G18/3243C08G18/3814C08G18/4018C08G18/4277C08G18/4804C08G18/4854C08G18/6618C08G18/6674C08G18/6685C08G2101/00C08K7/28
Inventor 代金辉刘兆阳李英乾王旭
Owner SHANDONG INOV POLYURETHANE
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