Photosensitive resin composition, dry film resist and corresponding element

Abstract

The invention relates to a photosensitive resin composition, a preparation method, a dry film resist and a corresponding element, and belongs to the technical field of preparation of circuit printingelements. The photosensitive resin composition comprises 50-70% of alkali-soluble resin, 30-50% of a photo-free radical polymerization monomer, 0.1-5% of a photoinitiator and 0.01-1% of an adhesion promoter; and the side chain of alkali-soluble resin molecules has an aromatic group or alicyclic hydrocarbon structure. The dry film resist prepared from the photosensitive resin composition has high electroplating resistance and peelable characteristics, and the photosensitive resin composition has high hole covering capability and high resolution.

Description

technical field [0001] The invention relates to the technical field of preparation of circuit printing components, in particular to a photosensitive resin composition, a dry film resist and corresponding components. Background technique [0002] In printed circuit boards, lead frames, solar cells, conductor packages, BGA (Ball Grid Array), CPS (Chip Size Package) packages, dry film resist is widely used as a key material for pattern transfer. For example, when manufacturing a printed circuit board, first, a dry film resist is bonded to a copper substrate, and the dry film resist is covered with a mask having a certain pattern to perform pattern exposure. Then, use a weak alkaline aqueous solution as a developer to remove the unexposed parts, then perform etching or electroplating to form a pattern, and finally use a remover to peel off the cured part of the dry film to achieve pattern transfer. [0003] The manufacturing methods of printed circuit boards mainly include mask...

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Problems solved by technology

[0006] The Chinese invention patent with the application number CN200610082639.4 discloses a dry film resist, which has carried out detailed research on the peelability and copper plating resistance of the dry film. Acid adhesive, which achieves particularly high resolution, high adhesion and peelability, but there is a lack of research on the resistance to tin plating, and there is no evidence that it can achieve the same technical effect in the tin plating process, while In actual industrial production, the tin plating process is actually more prone to the problem of permeation; the Japanese patent No. JP 2006330193 has also carried out detailed research on the electroplating metal layer, using polyimide precursor and polyphenylene Oxazole resin has improved plating resistance, but it cannot achieve conventional weak alkaline development, which is not conducive to large-scale industrial production

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