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Electrostatic chuck and preparation method thereof

An electrostatic chuck and electrostatic technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of insufficient temperature conduction rate, ineffective desorption of wafers, poor thermal conductivity, etc., to achieve high heating efficiency and avoid material Dimensional difference and internal tissue deterioration, high temperature uniformity effect

Pending Publication Date: 2020-10-30
BEIJING U PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the resin sheet has served in a vacuum and highly corrosive environment for a long time, and is easily damaged by corrosion. Even if various methods are used to improve the degree of damage, the effect is not obvious
[0004] In the prior art, in order to solve the radial temperature difference caused by the resin sheet and the defect of being easily damaged by corrosion, the resin sheet is replaced with a ceramic material, the heating electrode is embedded in the ceramic material, sintered to form a heating ceramic part, and then combined with the adsorption Bonding integration of functional ceramic components
After the electrostatic chuck has been in service for a period of time, it is found that its thermal conductivity is poor and the temperature conduction rate is not enough; moreover, after the wafer processing is completed, the wafer cannot be effectively desorbed due to the high temperature on the surface of the electrostatic chuck.

Method used

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  • Electrostatic chuck and preparation method thereof
  • Electrostatic chuck and preparation method thereof
  • Electrostatic chuck and preparation method thereof

Examples

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preparation example Construction

[0040] Please also refer to image 3 , Figure 6 , the preparation method of the electrostatic chuck of the present invention specifically comprises the following steps:

[0041] 1) Ceramic slurry preparation

[0042] Use 0.1-1 micron alumina ceramic particles as raw material, purity ≥ 99.9%, take alumina ceramic particles as the measurement base, add CaO or CaF below 5wt.% 2 or MgF 2 As a sintering aid, dispersant below 1wt.%, binder below 5wt.%, plasticizer below 3wt.%, and the rest are solvents. The solid phase content is 45%-60%. Ball milling for 24h, the into a uniformly dispersed ceramic slurry. The solvent can be selected from toluene, xylene, ethanol, isopropanol, ethylene glycol, etc., the dispersant can be selected from polyacrylic acid, fatty acid, fish oil, etc., the binder can be selected from polyethylene, ethyl cellulose, PVB, etc., plasticizer PEG, PVA, CMC, and PVAC can be used alone or in combination, and there is no special limitation.

[0043] 2) Form...

Embodiment 1

[0059] 1) Ceramic blank preparation

[0060] Use 1μm spherical alumina ceramic particles as raw material, purity ≥ 99.9%, take the weight of the ceramic particles as the measurement base, add less than 0.5wt.% CaO, 3wt.% MgF 2 As a sintering aid, ethanol is used as a solvent, 0.8wt.% polyacrylic acid is added as a dispersant, 2.5wt.% PVB is used as a binder and 3wt.% PEG is used as a plasticizer, and the solid phase content is adjusted to 55%. Ball milled for 24 hours to make evenly dispersed ceramic slurry, which was tape-cast to form a ceramic blank, and the ceramic blank was drilled.

[0061] 2) Electrode fabrication

[0062] Add W powder and 5wt.% Ti powder to polymer to make conductive paste, print electrostatic electrodes on the upper surface of a ceramic blank, and print heating electrodes on the lower surface of the same ceramic blank. The electrostatic electrode is grid-shaped, the thickness of the electrode is 15 μm, and the shape of the electrode is circular. The...

Embodiment 2

[0072] 1) Ceramic blank preparation

[0073] Use 0.5μm spherical alumina ceramic particles as raw material, purity ≥ 99.9%, take the weight of the ceramic particles as the measurement base, add less than 1wt.% CaO, 2wt.% MgF 2 As a sintering aid, use absolute ethanol as a solvent, add 0.8wt.% polyacrylic acid as a dispersant, 2.5wt.% PVB as a binder and 3wt.% PEG as a plasticizer, and adjust the solid phase content to 60 %, ball milled for 24 hours to make a uniformly dispersed ceramic slurry, which was taped to form a ceramic blank, and the ceramic blank was drilled.

[0074] 2) Electrode fabrication

[0075] Add W powder and 10wt.% Ti powder to polymer to make conductive paste, print electrostatic electrodes on the upper surface of a ceramic blank, and print heating electrodes on the lower surface of the same ceramic blank. The electrostatic electrode is grid-shaped, the thickness of the electrode is 10 μm, and the shape of the electrode is circular. The heating electrode...

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Abstract

The invention discloses an electrostatic chuck which comprises a ceramic substrate, an electrostatic electrode and a heating electrode are embedded in the ceramic substrate, the electrostatic electrode and the heating electrode have a height difference in the ceramic substrate, and the ceramic substrate, the electrostatic electrode and the heating electrode are formed by one-time sintering. The invention further discloses a preparation method of the electrostatic chuck. Compared with the prior art, the heating electrode and the electrostatic electrode of the electrostatic chuck are buried in the ceramic substrate and formed through one-time sintering, material size difference and internal structure deterioration caused by multiple times of sintering are avoided, partitioned heating and temperature control are achieved, and the indexes of high temperature rising efficiency and high temperature uniformity are achieved.

Description

technical field [0001] The invention relates to the technical field of electrostatic chucks, in particular to an electrostatic chuck and a preparation method thereof. Background technique [0002] The electrostatic chuck is a device that uses the principle of electrostatic adsorption to adsorb the wafer to be processed on its surface and can control the surface temperature of the wafer by back blowing gas. In the integrated circuit manufacturing process, especially in the etching process, in order to avoid the movement or dislocation of the wafer and cause the process to fail normally, electrostatic chucks are often used to fix and support the wafer. As critical dimension uniformity becomes more important, the temperature uniformity and temperature control functionality expectations of electrostatic chucks increase. [0003] In the prior art, the ceramic part with the adsorption function and the heating part with the heating function of the electrostatic chuck are manufactu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6833
Inventor 张玉利杨鹏远王建冲侯占杰王超星黎远成何宏庆樊文凤唐娜娜
Owner BEIJING U PRECISION TECH
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