A uniform droplet/polymer space circuit combined printing device and method

A printing device, polymer technology, applied in the direction of manufacturing tools, additive manufacturing, process efficiency improvement, etc., can solve the problem of difficulty in applying high-frequency space circuit printing, poor circuit smoothness and conductivity, and inability to use high-frequency circuit printing, etc. problems, to achieve the effect of improving molding quality and applicability, reducing parasitic impedance, and improving circuit molding quality and conductivity

Active Publication Date: 2022-04-19
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process can achieve a higher degree of freedom in the wiring of the circuit in three dimensions, and has advantages in printing low-frequency space circuits, but it is difficult to apply to high-frequency space circuit printing that requires high line quality.
Because the silver paste itself tends to retain air and form pores, and the 3D printing process itself has a step effect that will lead to poor smoothness and conductivity of the formed circuit, so it cannot be used for high-frequency circuit printing

Method used

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  • A uniform droplet/polymer space circuit combined printing device and method
  • A uniform droplet/polymer space circuit combined printing device and method
  • A uniform droplet/polymer space circuit combined printing device and method

Examples

Experimental program
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Effect test

Embodiment 1

[0035] Embodiment 1: Printing of polyhedral space circuit functional parts. Firstly, the pressure reducing valve 4 is opened, and the glove box 5 is cleaned with the anti-oxidation inert gas cylinder 1 to ensure a low-oxygen working environment in the glove box 5 . Install the polyether ether ketone resin wire rod into the installation hole of the wire rod extruder 3, and put the tin-silver alloy material into the heating furnace 10, adjust the temperature controller 14, set the temperature of the heating furnace 10 to about 180°C, set the high The temperature of the molecular material heater 21 is about 350°C, and the temperature of the heated bed 18 is set at about 150°C. Carry out two-dimensional slicing processing on the space circuit model and generate the motion track information of the three-dimensional mobile platform 17 , the action time information of the wire extruder 3 , the exciting rod 7 and the laser 13 .

[0036] During the rapid manufacture of electronic circ...

Embodiment 2

[0038] Example 2: Combined printing of multifunctional car model space circuit. The process steps of this embodiment are basically the same as those of Embodiment 1, except for the shape of the model and the way of internal wiring. Since the position of the light 30, the position of the motor 31 and the position of the wheel 32 of the trolley model are relatively fixed, they cannot be changed at will. Therefore, before printing the model, the layout of the model should be reasonably designed in the special space circuit modeling software. When the light position 30, the motor position 31 and the wheel position 32 interfere, the space for the power supply position 27, the control chip position 28 and the resistor position 29 is reserved, and then the circuit wires 26 are reasonably arranged inside the three-dimensional model to form the final three-dimensional data model . Import and read the generated deposition path file, and repeat the deposition according to the method of ...

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Abstract

The invention relates to a uniform droplet / polymer space circuit combined printing device and method, belonging to the field of rapid printing of three-dimensional circuits; including an anti-oxidation inert gas cylinder, a pressure reducing valve, a glove box, an oxygen content detector, a water content detector, Polymer printing components, uniform metal droplet injection components, signal generators, lasers, temperature controllers, motion control cards, three-dimensional mobile platforms, hot beds; anti-oxidation inert gas cylinders are connected to the glove box through a pressure reducing valve, The three-dimensional mobile platform is fixed on the bottom surface of the glove box, and the hot bed is fixed on the upper surface of the three-dimensional mobile platform; the polymer printing component, the uniform metal droplet ejection component and the laser are all fixed on the top of the glove box through the cantilever beam. After receiving the control signal, the metal circuit that has been deposited and solidified on the hot bed is remelted; the invention solves the problem that air is easy to remain and pores are formed when the circuit is printed with silver paste, so that the circuit forming quality and conductivity can be improved.

Description

technical field [0001] The invention belongs to the field of rapid printing of three-dimensional circuits, and in particular relates to a uniform droplet / polymer space circuit combined printing device and method. Background technique [0002] With the advancement of electronic circuit design and manufacturing technology, circuit manufacturing is developing towards large-scale, digital, and personalized directions. In order to further reduce product size, increase circuit integration density and wiring freedom, three-dimensional circuits are widely used in circuit design and manufacturing. middle. With the rise of 3D printing technology in recent years, it has become possible to combine layer-by-layer deposition manufacturing technology with electronic circuit manufacturing technology and realize digitization. Conduct electrical interconnections, and parts can be printed in arbitrary shapes and mounted on other objects. 3D printing technology can break through the limitatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/105B29C64/118B33Y10/00B33Y30/00B33Y50/02B33Y70/10
CPCB22F3/003B29C64/118B33Y10/00B33Y30/00B33Y50/02B33Y70/10Y02P10/25
Inventor 齐乐华周怡罗俊李贺军豆毅博
Owner NORTHWESTERN POLYTECHNICAL UNIV
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