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Laser-induced reduction and sintering method of copper oxide ink to prepare flexible copper circuit

A laser-induced, copper oxide technology

Active Publication Date: 2021-09-14
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above scheme can conveniently prepare conductive patterns, reduce time and personnel costs and improve manufacturing efficiency, however, the copper ion ink used in the above scheme uses water as a solvent, and the laser parameters used in the laser processing process are all sensitive to the copper circuit. Density, resolution of copper circuits adversely affected

Method used

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  • Laser-induced reduction and sintering method of copper oxide ink to prepare flexible copper circuit
  • Laser-induced reduction and sintering method of copper oxide ink to prepare flexible copper circuit
  • Laser-induced reduction and sintering method of copper oxide ink to prepare flexible copper circuit

Examples

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Effect test

Embodiment 1

[0036] Such as Figure 1 to Figure 4 Shown as an embodiment of the method for preparing a flexible copper circuit with the laser-induced reduction sintering copper oxide ink of the present invention, comprising the following steps:

[0037] S10. Prepare CuO nano-ink with precursor material CuO NP, dispersant PVP and reducing agent EG, where m CuO NP :m EG =1.33, m CuO NP :m PVP = 3.07;

[0038] S20. Prepare CuO nano-coating: spin-coat the CuO nano-ink prepared in step S10 onto the polymer substrate film, and dry to obtain CuO nano-coating; before spin-coating CuO nano-ink, use the plasma generated by the plasma generator The body carries out oxygen plasma surface treatment on the surface of the polymer substrate film to ensure the surface flatness of the PI substrate; in addition, when the surface of the polymer substrate film is subjected to oxygen plasma surface treatment, the oxygen plasma and the surface molecules Direct or indirect effect can make polar groups on t...

Embodiment 2

[0045] This embodiment is the same as Embodiment 1, except that the laser parameters used for femtosecond laser induction are: laser pulse energy of 0.17nJ, laser scanning speed of 15mm / s, and laser scanning times of 1. The metallographic image of the Cu circuit array obtained in the test step S30, such as image 3 As shown in (b), the test results show that the surface of the Cu circuit array obtained in this embodiment is uniform and dense. Using the same method as in Example 1 to analyze the elemental composition of the Cu circuit array, it is found that the Cu circuit array obtained in this embodiment has Cu:O=5.5:1, and the relative content of Cu / O is low, which may be due to: when 0.17nJ The laser energy is not enough to completely reduce Cu by CuO NPs, and part of Cu exists in the reduced Cu lines 2 O. Using the same method as in Example 1 to test the surface morphology of the Cu circuit array, it was found that the porosity of the Cu circuit was 12.43%. Combining me...

Embodiment 3

[0047] This embodiment is the same as Embodiment 1, except that the laser parameters used for femtosecond laser induction are: laser pulse energy is 0.24nJ, laser scanning speed is 11mm / s, and laser scanning times is 1 time. The metallographic image of the Cu circuit array obtained in the test step S30, such as Figure 5 As shown in (c), the test results show that the surface of the Cu circuit array obtained in this embodiment is uniform and dense. Using the same method as in Example 1 to analyze the elemental composition of the Cu circuit array, it is found that the Cu circuit array obtained in this example has Cu:O=15:1, and the relative content of Cu / O is relatively high, reflecting the connectivity of the Cu circuit surface at this time. very good. Such as Image 6 As shown in (c), the surface morphology of the Cu circuit array was tested by the same method as in Example 1, and it was found that the porosity of the Cu circuit was 15.52%. Combining metallographic analysi...

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Abstract

The present invention relates to the technical field of heat dissipation of electronic devices, more specifically, to a method for preparing a flexible copper circuit by laser-induced reduction sintering copper oxide ink, including: S10. Preparing CuO nano-ink with precursor material CuO NP, dispersant PVP and reducing agent EG , where m CuO NP :m EG =1.33~2.28, m CuO NP :m PVP =1.85~3.08; S20. Preparation of CuO nano-coating: spin-coat the CuO nano-ink prepared in step S10 onto the polymer substrate film, and dry to obtain CuO nano-coating; S30. Preparation of flexible copper circuit: adopt femtosecond laser In the processing system induction step S20, the dried CuO nano-coating is reduced and sintered to obtain a Cu array, and the surface of the polymer substrate film is rinsed to remove the remaining CuO NPs in the unprocessed area to obtain a flexible copper circuit. The present invention uses a femtosecond laser processing system to reduce and sinter the CuO nano-coating to obtain a flexible copper circuit, and can obtain a Cu circuit array with a dense structure, high resolution, good adhesion, and low resistivity. The method is simple in process and high in control accuracy , good environmental protection, low production cost.

Description

technical field [0001] The invention relates to the technical field of microelectronic products, more specifically, to a method for preparing flexible copper circuits by laser-induced reduction and sintering of copper oxide ink. Background technique [0002] With the significant growth in the market and applications of flexible and stretchable microelectronics, rapid and low-cost methods for combining electronic devices with flexible substrates have attracted extensive attention at home and abroad. In recent years, the combination of electronic devices and flexible substrates has been widely used in batteries, sensors, lighting equipment, displays, robotics and automation equipment, energy storage devices, and inorganic nanomaterials are integrated on flexible substrates through different printing methods. , to make great progress in the research of fabricating flexible electronic devices. As a common method for processing circuit patterns on glass, the traditional indium t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10C09D11/03
CPCC09D11/03H05K3/105H05K2203/107
Inventor 谢小柱黄亚军龙江游张炜张宇梁
Owner GUANGDONG UNIV OF TECH