Silicon/perovskite laminated solar cell
A technology of solar cells and perovskite cells, applied in the field of solar cells, can solve problems such as low stability, affecting the life of silicon/perovskite solar cells, short-circuit current decline, etc., and achieve good stability
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Embodiment 1
[0074] Example 1: Preparation of silicon / wide bandgap perovskite parallel stack cell
[0075] S1. On the n-type silicon wafer that has been cleaned and textured, each of the two surfaces is coated with an intrinsic amorphous silicon layer with a thickness of 10nm and 12nm by plasma-enhanced chemical vapor deposition; and the thickness of the n-type silicon wafer is A part of one side is reserved as an area for leading out the middle transparent conductive layer;
[0076] S2. Depositing a layer of p-type amorphous silicon with a thickness of 10 nm on the 10 nm thick intrinsic amorphous silicon layer. Depositing a layer of n-type amorphous silicon with a thickness of 15 nm on the 12 nm thick intrinsic amorphous silicon layer;
[0077] S3. Prepare indium tin oxide on the n-type amorphous silicon layer by magnetron sputtering, with a thickness of 100nm, and prepare indium tin oxide on the p-type amorphous silicon layer by magnetron sputtering, with a thickness of 120nm;
[0078]...
Embodiment 2
[0084] Example 2: Preparation of silicon / narrow bandgap perovskite parallel stack cell (p-side light incident)
[0085] S1. On the n-type silicon wafer that has been cleaned and textured, each of the two surfaces is coated with an intrinsic amorphous silicon layer by plasma-enhanced chemical vapor deposition, with a thickness of 10nm and 12nm respectively;
[0086] S2. Depositing a layer of p-type amorphous silicon with a thickness of 10 nm on the 10 nm thick intrinsic amorphous silicon layer. Depositing a layer of n-type amorphous silicon with a thickness of 15 nm on the 12 nm thick intrinsic amorphous silicon layer;
[0087] S3. Prepare indium tin oxide on the n-type amorphous silicon layer by magnetron sputtering, with a thickness of 100nm, and prepare indium tin oxide on the p-type amorphous silicon layer by magnetron sputtering, with a thickness of 120nm;
[0088] S4. Depositing a layer of nickel oxide by electron beam on the indium tin oxide layer of the p-type amorphou...
Embodiment 3
[0093] Example 3: Preparation of silicon / narrow bandgap perovskite parallel stack cell (n-side light incident)
[0094] S1. On the n-type silicon wafer that has been cleaned and textured, each of the two surfaces is coated with an intrinsic amorphous silicon layer by plasma-enhanced chemical vapor deposition, with a thickness of 10nm and 12nm respectively;
[0095] S2. Depositing a layer of p-type amorphous silicon with a thickness of 10 nm on the 10 nm thick intrinsic amorphous silicon layer. Depositing a layer of n-type amorphous silicon with a thickness of 15 nm on the 12 nm thick intrinsic amorphous silicon layer;
[0096] S3. Prepare indium tin oxide on the p-type amorphous silicon layer by magnetron sputtering, with a thickness of 100nm, and prepare indium tin oxide on the n-type amorphous silicon layer by magnetron sputtering, with a thickness of 120nm;
[0097] S4. Depositing a layer of tin oxide by electron beam on the indium tin oxide layer of the n-type amorphous s...
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